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Datasheet Texas Instruments AM3715CUS100

Texas Instruments AM3715CUS100

Производитель:Texas Instruments
Серия:AM3715
Модель:AM3715CUS100

Sitara Processor 423-FCBGA 0 to 90

Datasheets

  • Скачать » Datasheet, PDF, 3.3 Мб, Rev. F, 29-08-2011
    AM3715, AM3703 Sitara ARM Microprocessors (Rev. F)

Цены

    AM3715CUS100 на РадиоЛоцман.Цены — от 2 199 до 91 278 руб.
    MPU AM37x RISC 32bit 45nm 1GHz 423-Pin FC/CSP
    Цена AM3715CUS100
    ПоставщикПроизводительНаименованиеЦена
    ЭлитанTexas InstrumentsAM3715CUS1002 199 руб.
    5 элементTexas InstrumentsAM3715CUS1003 026 руб.
    AliExpressAm3715cus100-bga423 AM3715CUS10091 278 руб.
    МосЧипTexas InstrumentsAM3715CUS100по запросу
    КремнийAM3715CUS100по запросу
    Подробнее об условиях поставки »

Семейство: AM3703, AM3715

Статус

Статус продуктаВ производстве (Рекомендуется для новых разработок)
Доступность образцов у производителяНет

Экологический статус

RoHSСовместим
Бессвинцовая технология (Pb Free)Да

Параметры

ARM CPU1 ARM Cortex-A8
ARM MHz (Max.)1000
ApplicationsIndustrial
Personal Electronics
Approx. Price (US$)19.70 | 1ku
DRAMLPDDR
Display OptionsDSS
Graphics Acceleration1 3D
I2C4
On-Chip L2 Cache256 KB (ARM Cortex-A8)
Operating SystemsNeutrino
Integrity
Windows Embedded CE
Linux
VxWorks
Android
Operating Temperature Range(C)-40 to 105
-40 to 90
0 to 90
Other On-Chip Memory64 KB
RatingCatalog
SPI4
UART(SCI)4
USB4
Video Port (Configurable)1 Input
1 Output

Корпус / Упаковка / Маркировка

Pin423
Package TypeCUS
Industry STD TermFC/CSP
JEDEC CodeS-PBGA-N
Package QTY90
CarrierJEDEC TRAY (5+1)
МаркировкаAM3715CUS100
Width (мм)16
Length (мм)16
Thickness (мм).96
Pitch (мм).65
Max Height (мм)1.4
Mechanical DataСкачать »

Классификация производителя

Semiconductors > Processors > Sitara Processors > ARM Cortex-A8 > AM3x

Комплекты разработчика и оценочные наборы

  • Evaluation Modules & Boards: TMDSEVM3730
    AM/DM37x Evaluation Module
    Статус продукта: В производстве (Рекомендуется для новых разработок)
  • Evaluation Modules & Boards: BEAGLEXM
    BeagleBoard-xM Development Board
    Статус продукта: В производстве (Рекомендуется для новых разработок)
  • JTAG Emulators/ Analyzers: TMDSEMU200-U
    XDS200 USB Debug Probe
    Статус продукта: В производстве (Рекомендуется для новых разработок)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
    XDS560v2 System Trace USB & Ethernet Debug Probe
    Статус продукта: В производстве (Рекомендуется для новых разработок)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
    XDS560v2 System Trace USB Debug Probe
    Статус продукта: В производстве (Рекомендуется для новых разработок)

Application Notes

  • Скачать » Application Notes, PDF, 19 Кб, 03-06-2010
    AM3715/03 SDRC Subsystem
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM3715/03_SDRC_SubsystemThe SDRC subsystem module provides connectivity between the AM37x and SDRAM memory components. The module incl
  • Скачать » Application Notes, PDF, 19 Кб, 03-06-2010
    AM3715 GPMC
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:href=http://processors.wiki.ti.com/index.php/Am3715_gpmcThe GPMC is a 16-bit external memory controller. The GPMC data access engine provides a flexible programming model for communicatio
  • Скачать » Application Notes, PDF, 20 Кб, 07-06-2010
    AM/DM37x Power Estimation Spreadsheet
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or tocontribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM/DM37x_Power_Estimation_SpreadsheetThis article discusses the power consumption of the Texas Instruments AM/DM37x high
  • Скачать » Application Notes, PDF, 19 Кб, 03-06-2010
    AM/DM37x Overview
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM/DM37x_Overview.This document provides an overview of the AM37x applications processor.All trademarks are property of their respective
  • Скачать » Application Notes, PDF, 19 Кб, 03-06-2010
    AM3715/03 Memory Subsystem
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM3715/03_Memory_SubsystemThe Memory Subsystem in the AM3715/03 devices consists of the internal SRAM and two dedicated memory contr
  • Скачать » Application Notes, PDF, 19 Кб, 03-06-2010
    AM37x/DM37x Schematic Checklist
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x/DM37x_Schematic_Checklist.This article provides many tips related to reset, JTAG, peripherals, etc. It should be used as
  • Скачать » Application Notes, PDF, 19 Кб, 03-06-2010
    AM37x EVM Software Developer's Guide
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x_EVM_Software_Developer%27s_Guide.This wiki article illustrates the various software components provided with the A
  • Скачать » Application Notes, PDF, 739 Кб, 15-06-2011
    PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs
    The purpose of a power distribution network (PDN) is to provide clean and reliable power to active devices in the system. The printed circuit board (PCB) is a critical component of the system-level PDN. Therefore, the PCB design is of utmost importance for high-performance low-power microprocessors. This application report provides design requirements and details a step-by-step methodology on how
  • Скачать » Application Notes, PDF, 19 Кб, 03-06-2010
    Ethernet Connectivity via GPMC
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/Ethernet_Connectivity_via_GPMCThe purpose of this article is to describe a solution for connecting Ethernet to various devices,
  • Скачать » Application Notes, PDF, 19 Кб, 03-06-2010
    Setting up AM37x SDRC Registers
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/Setting_up_AM37x_SDRC_registersThis wiki article describes how to set the SDRC registers in the OMAP35x SDRC module depending o
  • Скачать » Application Notes, PDF, 19 Кб, 03-06-2010
    AM37x CUS Routing Guidelines
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x_CUS_Routing_Guidelines.CUS package is designed with a new technology called Via Channelв„ў array. This technology allows for e
  • Скачать » Application Notes, PDF, 37 Кб, 03-06-2010
    OMAP35x to AM37x Hardware Migration Guide
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/OMAP35x_To_AM37x_Hardware_Migration_Guide.The OMAP35x to AM37x Hardware Migration Guide describes device consideratio
  • Скачать » Application Notes, PDF, 2.4 Мб, Rev. A, 01-11-2013
    PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A)
    Once the bottom circuit board has been designed, the assembly guidelines for package-on-package (PoP) versions of the OMAP35xx processor and the memory device must be considered.PoP packages have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of final assembly: the circuit board design, the solder paste char
  • Скачать » Application Notes, PDF, 6.7 Мб, Rev. B, 13-06-2009
    PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part I (Rev. B)
    Ball grid array (BGA) packages having 0.4mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies; the standard rules of thumb don't apply anymore. In fact, the design guidelines for 0.4mm and 0.5mm differ primarily due to issues surrounding shorts or opens between balls under the processor.In addition to the de
  • Скачать » Application Notes, PDF, 2.0 Мб, 23-06-2010
    PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I
    Ball grid array (BGA) packages having 0.5mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies. PCBs with package-on-package (PoP) technology have additional assembly requirements and options that need to be considered when designing the PCB.Fine-pitch PCB design is a team effort and may require more than
  • Скачать » Application Notes, PDF, 1.2 Мб, 23-06-2010
    PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II
    Once the main printed circuit board (PCB) has been designed, the assembly guidelines for the 0.5mm package-on-package (PoP) applications processor and companion memory device must be considered. PoP applications processors have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of PCB assembly: PoP applications process

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