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Texas Instruments DM3730CUS100

Производитель:Texas Instruments
Серия:DM3730
Модель:DM3730CUS100

Digital Media Processor 423-FCBGA 0 to 90

Документы:

  • Скачать » Datasheet
  • Скачать » Application Notes, PDF, 3.2 Мб, Rev. C, 03-11-2011
    TI OMAP4430 POP SMT Design Guideline (Rev. C)
  • Скачать » Application Notes, PDF, 19 Кб, 03-06-2010
    AM3715 GPMC
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:href=http://processors.wiki.ti.com/index.php/Am3715_gpmcThe GPMC is a 16-bit external memory controller. The GPMC data access engine provides a flexible programming model for communicatio
  • Скачать » Application Notes, PDF, 739 Кб, 15-06-2011
    PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs
    The purpose of a power distribution network (PDN) is to provide clean and reliable power to active devices in the system. The printed circuit board (PCB) is a critical component of the system-level PDN. Therefore, the PCB design is of utmost importance for high-performance low-power microprocessors. This application report provides design requirements and details a step-by-step methodology on how
  • Скачать » Application Notes, PDF, 19 Кб, 03-06-2010
    AM3715/03 Memory Subsystem
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM3715/03_Memory_SubsystemThe Memory Subsystem in the AM3715/03 devices consists of the internal SRAM and two dedicated memory contr
  • Скачать » Application Notes, PDF, 19 Кб, 03-06-2010
    AM37x/DM37x Schematic Checklist
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x/DM37x_Schematic_Checklist.This article provides many tips related to reset, JTAG, peripherals, etc. It should be used as
  • Скачать » Application Notes, PDF, 19 Кб, 03-06-2010
    AM37x EVM Software Developer's Guide
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x_EVM_Software_Developer%27s_Guide.This wiki article illustrates the various software components provided with the A
  • Скачать » Application Notes, PDF, 20 Кб, 07-06-2010
    AM/DM37x Power Estimation Spreadsheet
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or tocontribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM/DM37x_Power_Estimation_SpreadsheetThis article discusses the power consumption of the Texas Instruments AM/DM37x high
  • Скачать » Application Notes, PDF, 19 Кб, 03-06-2010
    AM/DM37x Overview
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM/DM37x_Overview.This document provides an overview of the AM37x applications processor.All trademarks are property of their respective
  • Скачать » Application Notes, PDF, 19 Кб, 03-06-2010
    Ethernet Connectivity via GPMC
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/Ethernet_Connectivity_via_GPMCThe purpose of this article is to describe a solution for connecting Ethernet to various devices,
  • Скачать » Application Notes, PDF, 19 Кб, 03-06-2010
    Setting up AM37x SDRC Registers
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/Setting_up_AM37x_SDRC_registersThis wiki article describes how to set the SDRC registers in the OMAP35x SDRC module depending o
  • Скачать » Application Notes, PDF, 19 Кб, 03-06-2010
    AM37x CUS Routing Guidelines
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x_CUS_Routing_Guidelines.CUS package is designed with a new technology called Via Channelв„ў array. This technology allows for e
  • Скачать » Application Notes, PDF, 2.2 Мб, Rev. A, 01-05-2004
    AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)
    Application Note 1281 Bumped Die (Flip Chip) Packages
  • Скачать » Application Notes, PDF, 2.4 Мб, Rev. A, 01-11-2013
    PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A)
    Once the bottom circuit board has been designed, the assembly guidelines for package-on-package (PoP) versions of the OMAP35xx processor and the memory device must be considered.PoP packages have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of final assembly: the circuit board design, the solder paste char
  • Скачать » Application Notes, PDF, 6.7 Мб, Rev. B, 13-06-2009
    PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part I (Rev. B)
    Ball grid array (BGA) packages having 0.4mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies; the standard rules of thumb don't apply anymore. In fact, the design guidelines for 0.4mm and 0.5mm differ primarily due to issues surrounding shorts or opens between balls under the processor.In addition to the de
  • Скачать » Application Notes, PDF, 40.5 Мб, Rev. A, 09-08-2015
    0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)
  • Скачать » Application Notes, PDF, 1.2 Мб, 23-06-2010
    PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II
    Once the main printed circuit board (PCB) has been designed, the assembly guidelines for the 0.5mm package-on-package (PoP) applications processor and companion memory device must be considered. PoP applications processors have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of PCB assembly: PoP applications process
  • Скачать » Application Notes, PDF, 2.0 Мб, 23-06-2010
    PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I
    Ball grid array (BGA) packages having 0.5mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies. PCBs with package-on-package (PoP) technology have additional assembly requirements and options that need to be considered when designing the PCB.Fine-pitch PCB design is a team effort and may require more than
  • Скачать » Application Notes, PDF, 1.6 Мб, Rev. B, 13-08-2015
    Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
  • Скачать » Application Notes, PDF, 535 Кб, 06-10-2011
    Introduction to TMS320C6000 DSP Optimization
    The TMS320C6000в„ў Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications. However, to fully leverage the architectural features that C6000в„ў processors offer, code optimization may be required. First, this document reviews five key concepts in understanding the C6000 DSP architecture and optimization. Then

На английском языке: Datasheet Texas Instruments DM3730CUS100

    Процессоры и контроллеры цифровых сигналов (DSP, DSC) Digital Media Proc
    Цены на DM3730CUS100
    ПоставщикПроизводительЦена
    ЭлитанTexas Instruments4 563 руб.
    КонтестTexas Instrumentsпо запросу
    МосЧипTexas Instrumentsпо запросу
    ДКО ЭлектронщикTexas Instrumentsпо запросу
    КремнийTexas Instrumentsпо запросу
    Подробнее об условиях поставки »

Статус продуктаВ производстве (Рекомендуется для новых разработок)
RoHSСовместим
Бессвинцовая технология (Pb Free)Да
Доступность образцов у производителяДа

Параметры:

ARM CPU1 ARM Cortex-A8
ARM MHz (Max.)800
1000
ApplicationsAudio
Automotive
Communications and Telecom
Computers and Peripherals
Consumer Electronics
Energy
Industrial
Medical
Security
Approx. Price (US$)25.60 | 1ku
DRAMLPDDR
DSP1 C64x
DSP MHz (Max.)660
800
I2C4
On-Chip L2 Cache256 KB (ARM Cortex-A8)
Operating SystemsAndroid
DSP/BIOS
Neutrino
ntegrity
Windows Embedded CE
Linux
VXWorks
Operating Temperature Range(C)-40 to 105
-40 to 90
0 to 90
RatingCatalog
SPI4
UART(SCI)4
USB4
Video Port (Configurable)1 Dedicated Input
1 Dedicated Output
Video Resolution/Frame RateD1 or Less
720p

Корпус / Упаковка / Маркировка:

Pin423
Package TypeCUS
Industry STD TermFC/CSP
JEDEC CodeS-PBGA-N
Package QTY90
CarrierJEDEC TRAY (5+1)
Device MarkingDM3730CUS100
Width (мм)16
Length (мм)16
Thickness (мм).96
Pitch (мм).65
Max Height (мм)1.4
Mechanical DataСкачать »

Классификация производителя:

Semiconductors > Processors > Digital Signal Processors > Media Processors > DaVinci Video Processors

Комплекты разработчика и оценочные наборы:

  • Evaluation Modules & Boards: TMDSEVM3730
    AM/DM37x Evaluation Module
    Статус продукта: В производстве (Рекомендуется для новых разработок)
  • Evaluation Modules & Boards: BEAGLEXM
    BeagleBoard-xM Development Board
    Статус продукта: В производстве (Рекомендуется для новых разработок)

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