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Datasheet Texas Instruments 66AK2H12 — Даташит

ПроизводительTexas Instruments
Серия66AK2H12
Datasheet Texas Instruments 66AK2H12

Многоядерная однокристальная система DSP+ARM KeyStone II (SoC)

Datasheets

66AK2Hxx Multicore DSP+ARMВ® KeyStone II System-on-Chip (SoC) datasheet
PDF, 2.4 Мб, Версия: F, Файл опубликован: 2 июн 2017
Выписка из документа

Цены

18 предложений от 12 поставщиков
Digital Signal Processors & Controllers - DSP, DSC Mulitcore DSP+ARM Keystone II SoC
EIS Components
Весь мир
66AK2H12AXAAW2
Texas Instruments
23 591 ₽
ChipWorker
Весь мир
66AK2H12AAAW2
Texas Instruments
29 599 ₽
Utmel
Весь мир
66AK2H12BAAW2
Texas Instruments
от 38 608 ₽
ЭИК
Россия
66AK2H12BAAW24
Texas Instruments
117 443 ₽
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Статус

66AK2H12BAAW266AK2H12BAAW2466AK2H12BAAWA266AK2H12BAAWA2466AK2H12BXAAW266AK2H12DAAW266AK2H12DAAW2466AK2H12DAAWA266AK2H12DAAWA2466AK2H12DXAAWA24
Статус продуктаВ производствеВ производствеВ производствеВ производствеВ производствеВ производствеВ производствеВ производствеВ производствеВ производстве
Доступность образцов у производителяНетНетДаНетДаНетНетНетНетНет

Корпус / Упаковка / Маркировка

66AK2H12BAAW266AK2H12BAAW2466AK2H12BAAWA266AK2H12BAAWA2466AK2H12BXAAW266AK2H12DAAW266AK2H12DAAW2466AK2H12DAAWA266AK2H12DAAWA2466AK2H12DXAAWA24
N12345678910
Pin1517151715171517151715171517151715171517
Package TypeAAWAAWAAWAAWAAWAAWAAWAAWAAWAAW
Package QTY21212121212121212121
CarrierJEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)
Маркировка@2012 TI66AK2H12AAW66AK2H12AAWA1.2GHZ/1.4GHZ66AK2H12XAAW@2012 TI66AK2H12AAWA1.2GHZ66AK2H12AAW@2012 TI
Width (мм)40404040404040404040
Length (мм)40404040404040404040
Thickness (мм)3.073.073.073.073.073.073.073.073.073.07
Mechanical DataСкачатьСкачатьСкачатьСкачатьСкачатьСкачатьСкачатьСкачатьСкачатьСкачать

Параметры

Parameters / Models66AK2H12BAAW2
66AK2H12BAAW2
66AK2H12BAAW24
66AK2H12BAAW24
66AK2H12BAAWA2
66AK2H12BAAWA2
66AK2H12BAAWA24
66AK2H12BAAWA24
66AK2H12BXAAW2
66AK2H12BXAAW2
66AK2H12DAAW2
66AK2H12DAAW2
66AK2H12DAAW24
66AK2H12DAAW24
66AK2H12DAAWA2
66AK2H12DAAWA2
66AK2H12DAAWA24
66AK2H12DAAWA24
66AK2H12DXAAWA24
66AK2H12DXAAWA24
ARM CPU4 ARM Cortex-A154 ARM Cortex-A154 ARM Cortex-A154 ARM Cortex-A154 ARM Cortex-A154 ARM Cortex-A154 ARM Cortex-A154 ARM Cortex-A154 ARM Cortex-A154 ARM Cortex-A15
ARM MHz, Max.1200,14001200,14001200,14001200,14001200,14001200,14001200,14001200,14001200,14001200,1400
ApplicationsAutomation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,SpaceAutomation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,SpaceAutomation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,SpaceAutomation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,SpaceAutomation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,SpaceAutomation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,SpaceAutomation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,SpaceAutomation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,SpaceAutomation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,SpaceAutomation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space
DRAMDDR3,DDR3LDDR3,DDR3LDDR3,DDR3LDDR3,DDR3LDDR3,DDR3LDDR3,DDR3LDDR3,DDR3LDDR3,DDR3LDDR3,DDR3LDDR3,DDR3L
DSP8 C66x8 C66x8 C66x8 C66x8 C66x8 C66x8 C66x8 C66x8 C66x8 C66x
DSP MHz, Max.1200120012001200120012001200120012001200
EMAC4-port 1Gb Switch4-port 1Gb Switch4-port 1Gb Switch4-port 1Gb Switch4-port 1Gb Switch4-port 1Gb Switch4-port 1Gb Switch4-port 1Gb Switch4-port 1Gb Switch4-port 1Gb Switch
Hardware AcceleratorsPacket Accelerator,Security AcceleratorPacket Accelerator,Security AcceleratorPacket Accelerator,Security AcceleratorPacket Accelerator,Security AcceleratorPacket Accelerator,Security AcceleratorPacket Accelerator,Security AcceleratorPacket Accelerator,Security AcceleratorPacket Accelerator,Security AcceleratorPacket Accelerator,Security AcceleratorPacket Accelerator,Security Accelerator
I2C3333333333
On-Chip L2 Cache4096 KB (ARM Cluster),1024 KB (per C66x DSP core)4096 KB (ARM Cluster),1024 KB (per C66x DSP core)4096 KB (ARM Cluster),1024 KB (per C66x DSP core)4096 KB (ARM Cluster),1024 KB (per C66x DSP core)4096 KB (ARM Cluster),1024 KB (per C66x DSP core)4096 KB (ARM Cluster),1024 KB (per C66x DSP core)4096 KB (ARM Cluster),1024 KB (per C66x DSP core)4096 KB (ARM Cluster),1024 KB (per C66x DSP core)4096 KB (ARM Cluster),1024 KB (per C66x DSP core)4096 KB (ARM Cluster),1024 KB (per C66x DSP core)
Operating SystemsIntegrity,Linux,SYS/BIOS,VxWorksIntegrity,Linux,SYS/BIOS,VxWorksIntegrity,Linux,SYS/BIOS,VxWorksIntegrity,Linux,SYS/BIOS,VxWorksIntegrity,Linux,SYS/BIOS,VxWorksIntegrity,Linux,SYS/BIOS,VxWorksIntegrity,Linux,SYS/BIOS,VxWorksIntegrity,Linux,SYS/BIOS,VxWorksIntegrity,Linux,SYS/BIOS,VxWorksIntegrity,Linux,SYS/BIOS,VxWorks
Рабочий диапазон температур, Cот -40 до 100,0 до 85от -40 до 100,0 до 85от -40 до 100,0 до 85от -40 до 100,0 до 85от -40 до 100,0 до 85от -40 до 100,0 до 85от -40 до 100,0 до 85от -40 до 100,0 до 85от -40 до 100,0 до 85от -40 до 100,0 до 85
Other On-Chip Memory6144 KB6144 KB6144 KB6144 KB6144 KB6144 KB6144 KB6144 KB6144 KB6144 KB
PCI/PCIe2 PCIe Gen22 PCIe Gen22 PCIe Gen22 PCIe Gen22 PCIe Gen22 PCIe Gen22 PCIe Gen22 PCIe Gen22 PCIe Gen22 PCIe Gen2
RatingCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalog
SPI3333333333
UART, SCI2222222222
USB1111111111

Экологический статус

66AK2H12BAAW266AK2H12BAAW2466AK2H12BAAWA266AK2H12BAAWA2466AK2H12BXAAW266AK2H12DAAW266AK2H12DAAW2466AK2H12DAAWA266AK2H12DAAWA2466AK2H12DXAAWA24
RoHSСовместимСовместимСовместимСовместимСовместимСовместимСовместимСовместимСовместимСовместим

Application Notes

  • Keystone EDMA FAQ
    PDF, 1.3 Мб, Файл опубликован: 1 сен 2016
    This document is a collection of frequently asked questions (FAQs) on enhanced direct memory access (EDMA) on KeyStoneв„ў I (KS1) and KeyStone II (KS2) devices, along with useful collateral and software reference links.
  • Keystone II DDR3 Initialization
    PDF, 73 Кб, Файл опубликован: 26 янв 2015
    This application report provides a step-to-step initialization guide for the Keystone II device DDR3 SDRAM controller.
  • Throughput Performance Guide for KeyStone II Devices (Rev. B)
    PDF, 866 Кб, Версия: B, Файл опубликован: 22 дек 2015
    This application report analyzes various performance measurements of the KeyStone II family of processors. It provides a throughput analysis of the various support peripherals to different end-points and memory access.
  • Keystone II DDR3 Debug Guide
    PDF, 143 Кб, Файл опубликован: 16 окт 2015
    This guide provides tools for use when debugging a failing DDR3 interface on a KeyStone II device.
  • Power Management of KS2 Device (Rev. C)
    PDF, 61 Кб, Версия: C, Файл опубликован: 15 июл 2016
    This application report lists the steps to enable Class 0 Temperature Compensation (Class 0 TC) mode of SmartReflexв„ў Subsystem (SRSS) module available on such devices.
  • Hardware Design Guide for KeyStone II Devices
    PDF, 1.8 Мб, Файл опубликован: 24 мар 2014
  • Keystone NDK FAQ
    PDF, 54 Кб, Файл опубликован: 3 окт 2016
    This document is a collection of frequently asked questions (FAQ) on running the NDK examples on the KeyStoneв„ў family of devices.
  • SERDES Link Commissioning on KeyStone I and II Devices
    PDF, 138 Кб, Файл опубликован: 13 апр 2016
    The serializer-deserializer (SerDes) performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial conversion on data received from the CPU. This application report explains the SerDes transmit and receive parameters tuning, tools and some debug techniques for TI Keystone I and Keystone II devices.
  • PCIe Use Cases for KeyStone Devices
    PDF, 320 Кб, Файл опубликован: 13 дек 2011
  • Optimizing Loops on the C66x DSP
    PDF, 585 Кб, Файл опубликован: 9 ноя 2010
  • Clocking Design Guide for KeyStone Devices
    PDF, 1.5 Мб, Файл опубликован: 9 ноя 2010
  • The C6000 Embedded Application Binary Interface Migration Guide (Rev. A)
    PDF, 20 Кб, Версия: A, Файл опубликован: 10 ноя 2010
    The C6000 compiler tools support a new ELF-based ABI named EABI. Prior to this time, the compiler only supported a single ABI, which is now named COFF ABI. The following compelling best-in-class features are available under the C6000 EABI:GeneralZero-init globals: “int gvar;” gets set to 0 before main runs.Dynamic linking: Add code to a running system.Native ROM
  • DDR3 Design Requirements for KeyStone Devices (Rev. B)
    PDF, 582 Кб, Версия: B, Файл опубликован: 5 июн 2014
  • Multicore Programming Guide (Rev. B)
    PDF, 1.8 Мб, Версия: B, Файл опубликован: 29 авг 2012
    As application complexity continues to grow, we have reached a limit on increasing performance by merely scaling clock speed. To meet the ever-increasing processing demand, modern System-On-Chip solutions contain multiple processing cores. The dilemma is how to map applications to multicore devices. In this paper, we present a programming methodology for converting applications to run on multicore
  • TI DSP Benchmarking
    PDF, 62 Кб, Файл опубликован: 13 янв 2016
    This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.
  • Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
    PDF, 324 Кб, Версия: A, Файл опубликован: 17 авг 2016
    This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require

Модельный ряд

Классификация производителя

  • Semiconductors> Processors> Digital Signal Processors> C6000 DSP + ARM Processors> 66AK2x

На английском языке: Datasheet Texas Instruments 66AK2H12

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