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Datasheet Texas Instruments 74AC16374 — Даташит

ПроизводительTexas Instruments
Серия74AC16374
Datasheet Texas Instruments 74AC16374

16-битные триггеры D-типа с фронтальным запуском и выходами с 3 состояниями

Datasheets

16-Bit Edge-Triggered D-Type Flip-Flops With 3-State Outputs datasheet
PDF, 350 Кб, Версия: B, Файл опубликован: 1 апр 1996
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Цены

19 предложений от 16 поставщиков
16Bit Edge-Triggered D-Type Flip-Flops With 3-State Outputs 48-SSOP -40℃ to 85℃
Akcel
Весь мир
74AC16374DLR
Texas Instruments
от 33 ₽
74AC16374DL
Texas Instruments
66 ₽
T-electron
Россия и страны СНГ
74AC16374DLR
Texas Instruments
102 ₽
TradeElectronics
Россия
74AC16374
STMicroelectronics
по запросу
Выбираем схему BMS для заряда литий-железофосфатных (LiFePO4) аккумуляторов

Статус

74AC16374DL74AC16374DLR
Статус продуктаВ производствеВ производстве
Доступность образцов у производителяНетНет

Корпус / Упаковка / Маркировка

74AC16374DL74AC16374DLR
N12
Pin4848
Package TypeDLDL
Industry STD TermSSOPSSOP
JEDEC CodeR-PDSO-GR-PDSO-G
Package QTY251000
CarrierTUBELARGE T&R
МаркировкаAC16374AC16374
Width (мм)7.497.49
Length (мм)15.8815.88
Thickness (мм)2.592.59
Pitch (мм).635.635
Max Height (мм)2.792.79
Mechanical DataСкачатьСкачать

Параметры

Parameters / Models74AC16374DL
74AC16374DL
74AC16374DLR
74AC16374DLR
3-State OutputYesYes
Bits1616
F @ Nom Voltage(Max), Mhz100100
ICC @ Nom Voltage(Max), мА0.080.08
Рабочий диапазон температур, Cот -40 до 85от -40 до 85
Output Drive (IOL/IOH)(Max), мА24/-2424/-24
Package GroupSSOPSSOP
Package Size: mm2:W x L, PKG48SSOP: 164 mm2: 10.35 x 15.88(SSOP)48SSOP: 164 mm2: 10.35 x 15.88(SSOP)
RatingCatalogCatalog
Schmitt TriggerNoNo
Technology FamilyACAC
VCC(Max), В5.55.5
VCC(Min), В33
Voltage(Nom), В3.3,53.3,5
tpd @ Nom Voltage(Max), нс17,10.817,10.8

Экологический статус

74AC16374DL74AC16374DLR
RoHSСовместимСовместим

Application Notes

  • Live Insertion
    PDF, 150 Кб, Файл опубликован: 1 окт 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Introduction to Logic
    PDF, 93 Кб, Файл опубликован: 30 апр 2015
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Кб, Версия: D, Файл опубликован: 23 июн 2016
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Кб, Файл опубликован: 8 июл 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Кб, Версия: C, Файл опубликован: 2 дек 2015
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Кб, Файл опубликован: 29 авг 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Кб, Версия: B, Файл опубликован: 1 июн 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Мб, Файл опубликован: 1 окт 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • Power-Up Behavior of Clocked Devices (Rev. A)
    PDF, 34 Кб, Версия: A, Файл опубликован: 6 фев 2015
  • Designing With Logic (Rev. C)
    PDF, 186 Кб, Версия: C, Файл опубликован: 1 июн 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
    PDF, 43 Кб, Файл опубликован: 1 апр 1996
    Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren

Модельный ряд

Серия: 74AC16374 (2)

Классификация производителя

  • Semiconductors> Logic> Flip-Flop/Latch/Register> D-Type Flip-Flop

На английском языке: Datasheet Texas Instruments 74AC16374

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