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Datasheet Texas Instruments AM3354 — Даташит

ПроизводительTexas Instruments
СерияAM3354
Datasheet Texas Instruments AM3354

Ситара Процессор

Datasheets

AM335x Sitaraв„ў Processors datasheet
PDF, 3.2 Мб, Версия: J, Файл опубликован: 12 апр 2016
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Цены

31 предложений от 24 поставщиков
ARM® Cortex®-A8 Microprocessor IC SitaraTM1 Core, 32-Bit 800MHz 324-NFBGA (15x15)
EIS Components
Весь мир
AM3354BZCED30
Texas Instruments
75 ₽
ЧипСити
Россия
AM3354BZCZ80
Texas Instruments
307 ₽
AiPCBA
Весь мир
AM3354BZCED60
Texas Instruments
830 ₽
AM3354BZCZ100
Texas Instruments
по запросу
Выбираем схему BMS для заряда литий-железофосфатных (LiFePO4) аккумуляторов

Статус

AM3354BZCE60AM3354BZCEA60AM3354BZCED60AM3354BZCZ100AM3354BZCZ30AM3354BZCZ60AM3354BZCZ80AM3354BZCZA100AM3354BZCZA60AM3354BZCZA80AM3354BZCZA80RAM3354BZCZD60AM3354BZCZD80
Статус продуктаВ производствеВ производствеВ производствеВ производствеВ производствеВ производствеВ производствеВ производствеВ производствеВ производствеВ производствеВ производствеВ производстве
Доступность образцов у производителяДаНетДаНетНетНетДаНетДаДаНетДаДа

Корпус / Упаковка / Маркировка

AM3354BZCE60AM3354BZCEA60AM3354BZCED60AM3354BZCZ100AM3354BZCZ30AM3354BZCZ60AM3354BZCZ80AM3354BZCZA100AM3354BZCZA60AM3354BZCZA80AM3354BZCZA80RAM3354BZCZD60AM3354BZCZD80
N12345678910111213
Pin298298298324324324324324324324324324324
Package TypeZCEZCEZCEZCZZCZZCZZCZZCZZCZZCZZCZZCZZCZ
Industry STD TermNFBGANFBGANFBGA
JEDEC CodeS-PBGA-NS-PBGA-NS-PBGA-N
Package QTY1601601601261261261261261261261000126126
МаркировкаAM3354BZCE60AM3354BZCEA60AM3354BZCED60AM3354BZCZ100AM3354BZCZ30AM3354BZCZ60AM3354BZCZ80AM3354BZCZA100AM3354BZCZA60AM3354BZCZA80AM3354BZCZA80AM3354BZCZD60AM3354BZCZD80
Width (мм)13131315151515151515151515
Length (мм)13131315151515151515151515
Thickness (мм).89.89.89.9.9.9.9.9.9.9.9.9.9
Pitch (мм).65.65.65
Max Height (мм)1.31.31.3
Mechanical DataСкачатьСкачатьСкачатьСкачатьСкачатьСкачатьСкачатьСкачатьСкачатьСкачатьСкачатьСкачатьСкачать
CarrierJEDEC TRAY (10+1)

Параметры

Parameters / ModelsAM3354BZCE60
AM3354BZCE60
AM3354BZCEA60
AM3354BZCEA60
AM3354BZCED60
AM3354BZCED60
AM3354BZCZ100
AM3354BZCZ100
AM3354BZCZ30
AM3354BZCZ30
AM3354BZCZ60
AM3354BZCZ60
AM3354BZCZ80
AM3354BZCZ80
AM3354BZCZA100
AM3354BZCZA100
AM3354BZCZA60
AM3354BZCZA60
AM3354BZCZA80
AM3354BZCZA80
AM3354BZCZA80R
AM3354BZCZA80R
AM3354BZCZD60
AM3354BZCZD60
AM3354BZCZD80
AM3354BZCZD80
ARM CPU1 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A8
ARM MHz, Max.600,800,1000600,800,1000600,800,1000600,800,1000600,800,1000600,800,1000600,800,1000600,800,1000600,800,1000600,800,1000600,800,1000600,800,1000600,800,1000
ApplicationsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal Electronics
Co-Processor, sN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/A
DMIPS1200,1600,20001200,1600,20001200,1600,20001200,1600,20001200,1600,20001200,1600,20001200,1600,20001200,1600,20001200,1600,20001200,1600,20001200,1600,20001200,1600,20001200,1600,2000
DRAMDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDR
Display Outputs1111111111111
EMAC2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch
Graphics Acceleration1 3D1 3D1 3D1 3D1 3D1 3D1 3D1 3D1 3D1 3D1 3D1 3D1 3D
On-Chip L2 Cache256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)
Operating SystemsAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE
Рабочий диапазон температур, Cот -40 до 105,-40 до 90,0 до 90от -40 до 105,-40 до 90,0 до 90от -40 до 105,-40 до 90,0 до 90от -40 до 105,-40 до 90,0 до 90от -40 до 105,-40 до 90,0 до 90от -40 до 105,-40 до 90,0 до 90от -40 до 105,-40 до 90,0 до 90от -40 до 105,-40 до 90,0 до 90от -40 до 105,-40 до 90,0 до 90от -40 до 105,-40 до 90,0 до 90от -40 до 105,-40 до 90,0 до 90от -40 до 105,-40 до 90,0 до 90от -40 до 105,-40 до 90,0 до 90
Other On-Chip Memory128 KB128 KB128 KB128 KB128 KB128 KB128 KB128 KB128 KB128 KB128 KB128 KB128 KB
RatingCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalog
Security EnablerCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment
Serial I/OCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USB

Экологический статус

AM3354BZCE60AM3354BZCEA60AM3354BZCED60AM3354BZCZ100AM3354BZCZ30AM3354BZCZ60AM3354BZCZ80AM3354BZCZA100AM3354BZCZA60AM3354BZCZA80AM3354BZCZA80RAM3354BZCZD60AM3354BZCZD80
RoHSСовместимСовместимСовместимСовместимСовместимСовместимСовместимСовместимСовместимСовместимСовместимСовместимСовместим

Application Notes

  • AM335x Low Power Design Guide (Rev. A)
    PDF, 300 Кб, Версия: A, Файл опубликован: 28 фев 2017
    This document discusses techniques to develop a low power, low cost system based on the AM335x series processor. The goal is to explain how system design choices affect power consumption and how power consumption can vary significantly depending on how the developer’s application runs in that system under specific conditions.
  • AM335x Reliability Considerations in PLC Applications (Rev. A)
    PDF, 112 Кб, Версия: A, Файл опубликован: 27 апр 2017
    Programmable Logic Controllers (PLC) are used as the main control in an automation system with high-reliability expectations and long life in harsh environments. Processors used in these applications require an assessment of performance verses expected power on hours to achieve the optimal performance for the application.
  • AM335x and AM43xx Sitara Processors USB Layout Guidelines (Rev. A)
    PDF, 76 Кб, Версия: A, Файл опубликован: 21 авг 2014
    This application report discusses best-practice layout guidelines when implementing a universal serial bus (USB).
  • Processor SDK RTOS Customization: Modifying Board library to change UART instanc
    PDF, 783 Кб, Файл опубликован: 4 мар 2016
  • AM335x Thermal Considerations
    PDF, 16 Кб, Файл опубликован: 15 апр 2013
    This article discusses the thermal considerations of the AM335x devices. It offers guidance on analysis of the processor's thermal performance, suggests improvements for an end system to aid in overcoming some of the existing challenges of producing a good thermal design, and provides real power/thermal data measured with AM335x EVMs for user evaluation.
  • nFBGA Packaging (Rev. B)
    PDF, 3.1 Мб, Версия: B, Файл опубликован: 13 ноя 2015
    This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts.
  • 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)
    PDF, 40.5 Мб, Версия: A, Файл опубликован: 9 авг 2015
  • Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
    PDF, 324 Кб, Версия: A, Файл опубликован: 17 авг 2016
    This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
  • Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
    PDF, 1.6 Мб, Версия: B, Файл опубликован: 13 авг 2015
  • High-Speed Interface Layout Guidelines (Rev. G)
    PDF, 814 Кб, Версия: G, Файл опубликован: 27 июл 2017
    As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

Модельный ряд

Классификация производителя

  • Semiconductors> Processors> Sitara Processors> ARM Cortex-A8> AM335x

На английском языке: Datasheet Texas Instruments AM3354

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