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Datasheet Texas Instruments MSP430F5335 — Даташит

ПроизводительTexas Instruments
СерияMSP430F5335
Datasheet Texas Instruments MSP430F5335

MSP430F533x Mixed Signal Microcontroller

Datasheets

MSP430F533x Mixed-Signal Microcontrollers datasheet
PDF, 1.7 Мб, Версия: D, Файл опубликован: 8 дек 2015
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Цены

28 предложений от 17 поставщиков
MSP430 CPUXV2 MSP430F5xx Microcontroller IC 16-Bit 20MHz 256KB (256K x 8) FLASH 113-BGA Microstar Junior (7x7)
MSP430F5335IPZ
Texas Instruments
233 ₽
EIS Components
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MSP430F5335IPZR
Texas Instruments
284 ₽
ЧипСити
Россия
MSP430F5335IPZR
Texas Instruments
480 ₽
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MSP430F5335IPZR
Texas Instruments
от 689 ₽
Выбираем схему BMS для заряда литий-железофосфатных (LiFePO4) аккумуляторов

Статус

MSP430F5335IPZMSP430F5335IPZRMSP430F5335IZQWRMSP430F5335IZQWT
Статус продуктаВ производствеВ производствеВ производствеВ производстве
Доступность образцов у производителяНетДаДаНет

Корпус / Упаковка / Маркировка

MSP430F5335IPZMSP430F5335IPZRMSP430F5335IZQWRMSP430F5335IZQWT
N1234
Pin100100113113
Package TypePZPZZQWZQW
Industry STD TermLQFPLQFPBGA MICROSTAR JUNIORBGA MICROSTAR JUNIOR
JEDEC CodeS-PQFP-GS-PQFP-GS-PBGA-NS-PBGA-N
Package QTY9010002500250
CarrierJEDEC TRAY (10+1)LARGE T&RLARGE T&RSMALL T&R
МаркировкаM430F5335M430F5335M430F5335M430F5335
Width (мм)141477
Length (мм)141477
Thickness (мм)1.41.4.74.74
Pitch (мм).5.5.5.5
Max Height (мм)1.61.611
Mechanical DataСкачатьСкачатьСкачатьСкачать

Параметры

Parameters / ModelsMSP430F5335IPZ
MSP430F5335IPZ
MSP430F5335IPZR
MSP430F5335IPZR
MSP430F5335IZQWR
MSP430F5335IZQWR
MSP430F5335IZQWT
MSP430F5335IZQWT
ADCADC12 - 12chADC12 - 12chADC12 - 12chADC12 - 12ch
AESN/AN/AN/AN/A
Active Power, uA/MHz330330330330
Additional FeaturesReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDAReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDAReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDAReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA
BSLUARTUARTUARTUART
CPUMSP430MSP430MSP430MSP430
Comparators12121212
DMA6666
Featuredf5f5f5f5
Тактовая частота, МГц20202020
GPIO Pins74747474
I2C2222
Max VCC3.63.63.63.6
Min VCC1.81.81.81.8
Multiplier32x3232x3232x3232x32
Non-volatile Memory, KB256256256256
Рабочий диапазон температур, Cот -40 до 85от -40 до 85от -40 до 85от -40 до 85
Package GroupLQFPLQFPBGA MICROSTAR JUNIORBGA MICROSTAR JUNIOR
Package Size: mm2:W x L, PKG100LQFP: 256 mm2: 16 x 16(LQFP)100LQFP: 256 mm2: 16 x 16(LQFP)113BGA MICROSTAR JUNIOR: 49 mm2: 7 x 7(BGA MICROSTAR JUNIOR)113BGA MICROSTAR JUNIOR: 49 mm2: 7 x 7(BGA MICROSTAR JUNIOR)
RAM, KB18181818
RatingCatalogCatalogCatalogCatalog
SPI4444
Special I/ON/AN/AN/AN/A
Standby Power, LPM3-uA2.22.22.22.2
Timers - 16-bit4444
UART2222
Wakeup Time, us3333

Экологический статус

MSP430F5335IPZMSP430F5335IPZRMSP430F5335IZQWRMSP430F5335IZQWT
RoHSСовместимСовместимСовместимСовместим

Application Notes

  • Using the MSP430 Timer_D Module in Hi-Resolution Mode
    PDF, 870 Кб, Файл опубликован: 2 окт 2013
    This application report describes the use of the high-resolution feature of the Timer_D module introduced in MSP430F51x1 and MSP430F51x2 devices. Timer_D enables applications that require high resolution such as capacitive touch detection, PWM DACs, advanced LED lighting, and digital controllers for power supplies. This application report provides an advanced description of the use and calibration
  • Migrating from the MSP430F5xx,F6xx Family to the MSP430FR58xx/FR59xx/68xx Family (Rev. D)
    PDF, 151 Кб, Версия: D, Файл опубликован: 3 ноя 2016
    This application report helps enable easy migration from MSP430F5xx and MSP430F6xx flash-based MCUs to the MSP430FR58xx/FR59xx/68xx/69xx FRAM-based MCUs. For the migration guide to MSP430FR57xx, see Migrating From the MSP430F2xx Family to the MSP430FR57xx Family. It covers programming, system, and peripheral considerations when migrating firmware. The intent is to highlight differences between the
  • General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
    PDF, 551 Кб, Версия: A, Файл опубликован: 1 апр 2016
    Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl
  • Design Considerations When Using the MSP430 Graphics Library
    PDF, 475 Кб, Файл опубликован: 5 окт 2012
    LCDs are a growing commodity in todays market with products as diverse as children's toys to medical devices. Modern LCDs, along with the graphics displayed on them, are growing in complexity. A graphics library can simplify and accelerate development while creating the desired user experience. TI provides the MSP430 Graphics Library for use in developing products with the MSP430в„ў MCU. This
  • MSP Code Protection Features
    PDF, 752 Кб, Файл опубликован: 7 дек 2015
    MSP microcontrollers (MCUs) offer a number of features to help control code accessibility in the device, to add different layers of code access management and protection strategies. These include features that can lock or password protect the JTAG/SBW access, IP Encapsulation (IPE) to isolate sensitive code with different permissions than the rest of the program, and bootloader (BSL) access featur
  • ESD Diode Current Specification
    PDF, 520 Кб, Файл опубликован: 7 дек 2015
    This document explains the maximum ESD diode current specified for GPIO on MSP microcontrollers. Sometimes signals on specific pins exceed the supply of the MSP MCU. In such a case, the device can handle this overvoltage condition through the ESD diodes, but the ESD diode specification must be considered during application design. The items to be considered are described in this document.

Модельный ряд

Классификация производителя

  • Semiconductors> Microcontrollers (MCU)> MSP430 ultra-low-power MCUs> MSP430F5x/6x

На английском языке: Datasheet Texas Instruments MSP430F5335

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