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Datasheet Texas Instruments MSP430F6659 — Даташит

ПроизводительTexas Instruments
СерияMSP430F6659
Datasheet Texas Instruments MSP430F6659

MSP430F66xx Mixed Signal Microcontroller

Datasheets

MSP430F665x, MSP430F645x, MSP430F565x, MSP430F535x Mixed Signal Microcontroller datasheet
PDF, 1.9 Мб, Версия: C, Файл опубликован: 21 окт 2013
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Цены

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Микроконтроллер MSP430, MSP430 Family MSP430F6x Series Microcontrollers, MSP430, 16бит, 20 МГц
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Россия и страны СНГ
MSP430F6659IPZR
Texas Instruments
738 ₽
ЧипСити
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MSP430F6659IPZR
Texas Instruments
850 ₽
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MSP430F6659IPZ
Texas Instruments
1 994 ₽
MSP430F6659IPZ
Texas Instruments
от 4 052 ₽
Сравнительное тестирование аккумуляторов EVE Energy и Samsung типоразмера 18650

Статус

MSP430F6659IPZMSP430F6659IPZRMSP430F6659IZQWRMSP430F6659IZQWT
Статус продуктаВ производствеВ производствеВ производствеВ производстве
Доступность образцов у производителяНетДаДаНет

Корпус / Упаковка / Маркировка

MSP430F6659IPZMSP430F6659IPZRMSP430F6659IZQWRMSP430F6659IZQWT
N1234
Pin100100113113
Package TypePZPZZQWZQW
Industry STD TermLQFPLQFPBGA MICROSTAR JUNIORBGA MICROSTAR JUNIOR
JEDEC CodeS-PQFP-GS-PQFP-GS-PBGA-NS-PBGA-N
Package QTY9010002500250
CarrierJEDEC TRAY (10+1)LARGE T&RLARGE T&RSMALL T&R
МаркировкаF6659F6659F6659F6659
Width (мм)141477
Length (мм)141477
Thickness (мм)1.41.4.74.74
Pitch (мм).5.5.5.5
Max Height (мм)1.61.611
Mechanical DataСкачатьСкачатьСкачатьСкачать

Параметры

Parameters / ModelsMSP430F6659IPZ
MSP430F6659IPZ
MSP430F6659IPZR
MSP430F6659IPZR
MSP430F6659IZQWR
MSP430F6659IZQWR
MSP430F6659IZQWT
MSP430F6659IZQWT
ADCADC12 - 12chADC12 - 12chADC12 - 12chADC12 - 12ch
AESN/AN/AN/AN/A
Active Power, uA/MHz370370370370
Additional FeaturesUSB,LCD,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDAUSB,LCD,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDAUSB,LCD,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDAUSB,LCD,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDA
BSLUSBUSBUSBUSB
CPUMSP430MSP430MSP430MSP430
Comparators12121212
DMA6666
Featuredf6f6f6f6
Тактовая частота, МГц20202020
GPIO Pins74747474
I2C3333
Max VCC3.63.63.63.6
Min VCC1.81.81.81.8
Multiplier32x3232x3232x3232x32
Non-volatile Memory, KB512512512512
Рабочий диапазон температур, Cот -40 до 85от -40 до 85от -40 до 85от -40 до 85
Package GroupLQFPLQFPBGA MICROSTAR JUNIORBGA MICROSTAR JUNIOR
Package Size: mm2:W x L, PKG100LQFP: 256 mm2: 16 x 16(LQFP)100LQFP: 256 mm2: 16 x 16(LQFP)113BGA MICROSTAR JUNIOR: 49 mm2: 7 x 7(BGA MICROSTAR JUNIOR)113BGA MICROSTAR JUNIOR: 49 mm2: 7 x 7(BGA MICROSTAR JUNIOR)
RAM, KB66666666
RatingCatalogCatalogCatalogCatalog
SPI6666
Special I/ON/AN/AN/AN/A
Standby Power, LPM3-uA2.62.62.62.6
Timers - 16-bit4444
UART3333
Wakeup Time, us3333

Экологический статус

MSP430F6659IPZMSP430F6659IPZRMSP430F6659IZQWRMSP430F6659IZQWT
RoHSСовместимСовместимСовместимСовместим

Application Notes

  • Using the MSP430 RTC_B Module With Battery Backup Supply (Rev. B)
    PDF, 135 Кб, Версия: B, Файл опубликован: 4 июн 2015
    Some applications need to retain an accurate real-time clock (RTC) through battery changes, power outages, and other events. For these applications, MSP430в„ў devices that contain the RTC_B Real-Time Clock module with a Battery Backup System can be a great fit. This application note demonstrates how to use RTC_B with Battery Backup Supply functionality to retain the time and keep the RTC counting th
  • Starting a USB Design Using MSP430 MCUs (Rev. A)
    PDF, 949 Кб, Версия: A, Файл опубликован: 30 май 2014
    This document is a high-level starting point for those wanting to design USB devices with MSP430в„ў MCUs. It provides an overview of the TI MSP430 hardware and software offerings for USB, as well as guidance in quickly getting started.Among the topics covered:An overview of the MSP430 hardware USB moduleAn introduction to the MSP430 USB Developer's Package
  • Designing With MSP430 and Segment LCDs (Rev. A)
    PDF, 2.1 Мб, Версия: A, Файл опубликован: 20 июл 2015
    Segment liquid crystal displays (LCDs) are needed to provide information to users in a wide variety of applications from smart meters to electronic shelf labels (ESL) to medical equipment. Several MSP430в„ў microcontroller families include built-in low-power LCD driver circuitry that allows the MSP430 MCU to directly control the segmented LCD glass. This application note helps explain how segmented
  • General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
    PDF, 551 Кб, Версия: A, Файл опубликован: 1 апр 2016
    Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl
  • Design Considerations When Using the MSP430 Graphics Library
    PDF, 475 Кб, Файл опубликован: 5 окт 2012
    LCDs are a growing commodity in todays market with products as diverse as children's toys to medical devices. Modern LCDs, along with the graphics displayed on them, are growing in complexity. A graphics library can simplify and accelerate development while creating the desired user experience. TI provides the MSP430 Graphics Library for use in developing products with the MSP430в„ў MCU. This
  • MSP Code Protection Features
    PDF, 752 Кб, Файл опубликован: 7 дек 2015
    MSP microcontrollers (MCUs) offer a number of features to help control code accessibility in the device, to add different layers of code access management and protection strategies. These include features that can lock or password protect the JTAG/SBW access, IP Encapsulation (IPE) to isolate sensitive code with different permissions than the rest of the program, and bootloader (BSL) access featur
  • ESD Diode Current Specification
    PDF, 520 Кб, Файл опубликован: 7 дек 2015
    This document explains the maximum ESD diode current specified for GPIO on MSP microcontrollers. Sometimes signals on specific pins exceed the supply of the MSP MCU. In such a case, the device can handle this overvoltage condition through the ESD diodes, but the ESD diode specification must be considered during application design. The items to be considered are described in this document.

Модельный ряд

Классификация производителя

  • Semiconductors> Microcontrollers (MCU)> MSP430 ultra-low-power MCUs> MSP430F5x/6x

На английском языке: Datasheet Texas Instruments MSP430F6659

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