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Datasheet Texas Instruments MSP430FR5735

Производитель:Texas Instruments
Серия:MSP430FR5735

MSP430FR5735 24 MHz ULP microcontroller with 8 KB FRAM, 1 KB SRAM, 32 IO, 10-bit ADC and comparator

Datasheets

Цены

    16-битные микроконтроллеры Mixed Signal MCU
    ПоставщикПроизводительНаименованиеЦена
    ЭлитанTexas InstrumentsMSP430FR5735IRHA118 руб.
    LifeElectronicsTexas InstrumentsMSP430FR5735IDARпо запросу
    TradeElectronicsTexas InstrumentsMSP430FR5735IRHAпо запросу
    МосЧипTexas InstrumentsMSP430FR5735IRHARпо запросу
    КремнийTexas InstrumentsMSP430FR5735IRHATпо запросу
    Все 6 предложений от 6 поставщиков »

Статус

 MSP430FR5735IDAMSP430FR5735IDARMSP430FR5735IRHARMSP430FR5735IRHAT
Статус продуктаВ производствеВ производствеВ производствеВ производстве
Доступность образцов у производителяНетНетДаНет

Корпус / Упаковка / Маркировка

 MSP430FR5735IDAMSP430FR5735IDARMSP430FR5735IRHARMSP430FR5735IRHAT
Pin38384040
Package TypeDADARHARHA
Industry STD TermTSSOPTSSOPVQFNVQFN
JEDEC CodeR-PDSO-GR-PDSO-GS-PQFP-NS-PQFP-N
Package QTY4020002500250
CarrierTUBELARGE T&RLARGE T&RSMALL T&R
МаркировкаM430FR5735M430FR5735FR5735M430
Width (мм)6.26.266
Length (мм)12.512.566
Thickness (мм)1.151.15.9.9
Pitch (мм).65.65.5.5
Max Height (мм)1.21.211
Mechanical DataСкачать »Скачать »Скачать »Скачать »

Параметры

 MSP430FR5735IDAMSP430FR5735IDARMSP430FR5735IRHARMSP430FR5735IRHAT
ADCADC10 - 12chADC10 - 12chADC10 - 12chADC10 - 12ch
AESN/AN/AN/AN/A
Active Power (uA/MHz)91.66791.66791.66791.667
Additional FeaturesReal-Time Clock
Watchdog
Temp Sensor
Brown Out Reset
IrDA
Real-Time Clock
Watchdog
Temp Sensor
Brown Out Reset
IrDA
Real-Time Clock
Watchdog
Temp Sensor
Brown Out Reset
IrDA
Real-Time Clock
Watchdog
Temp Sensor
Brown Out Reset
IrDA
Approx. Price (US$)1.50 | 1ku1.50 | 1ku1.50 | 1ku1.50 | 1ku
BSLUARTUARTUARTUART
CPUMSP430MSP430MSP430MSP430
Comparators(Inputs)16161616
DMA3333
Frequency(MHz)24242424
GPIO Pins(#)32323232
I2C1111
Max VCC3.63.63.63.6
Min VCC2222
Multiplier32x3232x3232x3232x32
Non-volatile Memory (KB)8888
Operating Temperature Range(C)-40 to 85-40 to 85-40 to 85-40 to 85
Package GroupTSSOPTSSOPVQFNVQFN
Package Size: mm2:W x L (PKG)38TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)38TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)40VQFN: 36 mm2: 6 x 6(VQFN)40VQFN: 36 mm2: 6 x 6(VQFN)
RAM(KB)1111
RatingCatalogCatalogCatalogCatalog
SPI3333
Special I/ON/AN/AN/AN/A
Standby Power (LPM3-uA)6.46.46.46.4
Timers - 16-bit5555
UART2222
Wakeup Time (us)78787878

Экологический статус

 MSP430FR5735IDAMSP430FR5735IDARMSP430FR5735IRHARMSP430FR5735IRHAT
RoHSСовместимСовместимСовместимСовместим
Бессвинцовая технология (Pb Free)ДаДаДаДа

Классификация производителя

  • Semiconductors> Microcontrollers (MCU)> MSP430 ultra-low-power MCUs> MSP430FRxx FRAM

Application Notes

  • Скачать » Application Notes, PDF, 3.5 Мб, Rev. A, 02-03-2015
    Over-the-Air (OTA) Update With the MSP430FR57xx (Rev. A)
  • Скачать » Application Notes, PDF, 1.5 Мб, 29-03-2012
    MSP430 System-Level ESD Considerations
    System-Level ESD has become increasingly demanding with silicon technology scaling towards lower voltages and the need for designing cost-effective and ultra-low power components. This application report addresses three different ESD topics to help board designers and OEMs understand and design robust system-level designs:(1) Component-level ESD testing and system-level ESD testing, their differ
  • Скачать » Application Notes, PDF, 103 Кб, Rev. B, 04-02-2015
    Maximizing Write Speed on the MSP430в„ў FRAM (Rev. B)
    Nonvolatile low-power ferroelectric RAM (FRAM) is capable of extremely high-speed write accesses. This application report discusses how to maximize FRAM write speeds specifically in the MSP430FRxx family using simple techniques. The document uses examples from bench tests performed on the MSP430FR5739 device, which can be extended to all MSP430в„ў FRAM-based devices, and discusses tradeoffs such as
  • Скачать » Application Notes, PDF, 326 Кб, 23-06-2014
    MSP430 FRAM Technology – How To and Best Practices
    FRAM is a non-volatile memory technology that behaves similar to SRAM while enabling a whole host of new applications, but also changing the way firmware should be designed. This application report outlines the how to and best practices of using FRAM technology in MSP430 from an embedded software development perspective. It discusses how to implement a memory layout according to application-specif
  • Скачать » Application Notes, PDF, 295 Кб, Rev. A, 01-05-2014
    MSP430 FRAM Quality and Reliability (Rev. A)
    FRAM is a nonvolatile embedded memory technology and is known for its ability to be ultra-low power while being the most flexible and easy-to-use universal memory solution available today. This application report is intended to give new FRAM users and those migrating from flash-based applications knowledge on how FRAM meets key quality and reliability requirements such as data retention and endura
  • Скачать » Application Notes, PDF, 41 Кб, Rev. A, 13-09-2012
    Migrating from the USCI Module to the eUSCI Module (Rev. A)
    The purpose of this application report is to enable easy migration for designs based on the USCI_A and USCI_B modules to the eUSCI_A and the eUSCI_B modules. The document highlights the new features in the eUSCI module and the main differences between the USCI and the eUSCI modules.
  • Скачать » Application Notes, PDF, 154 Кб, Rev. A, 16-02-2012
    Migrating from the MSP430F2xx Family to the MSP430FR57xx Family (Rev. A)
    This application report enables easy migration from MSP430F2xx Flash-based MCUs to the MSP430FR57xx family FRAM-based MCU. It covers programming, system, and peripheral considerations when migrating firmware. The purpose is to highlight differences between the two families. For more information on the usage of the MSP430FR57xx features, see the MSP430FR57xx Family User's Guide (
  • Скачать » Application Notes, PDF, 551 Кб, Rev. A, 01-04-2016
    General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
    Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl

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