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Datasheet Texas Instruments SN54AS760 — Даташит

ПроизводительTexas Instruments
СерияSN54AS760
Datasheet Texas Instruments SN54AS760

Octal Buffers & Line Drivers With Open-Collector Outputs

Datasheets

Octal Buffers & Line Drivers With Open-Collector Outputs datasheet
PDF, 1.2 Мб, Версия: A, Файл опубликован: 1 янв 1995
Выписка из документа

Цены

OCTAL BUFFERS AND LINE DRIVERS WITH OPEN-COLLECTOR OUTPUTS
SN54AS760FK
Texas Instruments
по запросу
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Статус

5962-87767012A5962-8776701RASNJ54AS760FKSNJ54AS760J
Статус продуктаВ производствеВ производствеВ производствеВ производстве
Доступность образцов у производителяНетНетНетНет

Корпус / Упаковка / Маркировка

5962-87767012A5962-8776701RASNJ54AS760FKSNJ54AS760J
N1234
Pin20202020
Package TypeFKJFKJ
Industry STD TermLCCCCDIPLCCCCDIP
JEDEC CodeS-CQCC-NR-GDIP-TS-CQCC-NR-GDIP-T
Package QTY1111
CarrierTUBETUBETUBETUBE
Width (мм)8.896.928.896.92
Length (мм)8.8924.28.8924.2
Thickness (мм)1.834.571.834.57
Pitch (мм)1.272.541.272.54
Max Height (мм)2.035.082.035.08
Mechanical DataСкачатьСкачатьСкачатьСкачать
Маркировка87767012A5962-8776701RA

Параметры

Parameters / Models5962-87767012A
5962-87767012A
5962-8776701RA
5962-8776701RA
SNJ54AS760FK
SNJ54AS760FK
SNJ54AS760J
SNJ54AS760J
Bits8888
Тип входаTTLTTLTTLTTL
Рабочий диапазон температур, Cот -55 до 125от -55 до 125от -55 до 125от -55 до 125
Тип выходаTTLTTLTTLTTL
Package GroupLCCCCDIPLCCCCDIP
Package Size: mm2:W x L, PKG20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)
RatingMilitaryMilitaryMilitaryMilitary
Schmitt TriggerNoNoNoNo
Technology FamilyASASASAS
VCC(Max), В5.55.55.55.5
VCC(Min), В4.54.54.54.5
Voltage(Nom), В5555

Экологический статус

5962-87767012A5962-8776701RASNJ54AS760FKSNJ54AS760J
RoHSSee ti.comSee ti.comSee ti.comSee ti.com

Application Notes

  • Advanced Schottky Load Management
    PDF, 277 Кб, Файл опубликован: 1 фев 1997
    Designers of high-speed systems that include advanced Schottky (AS) devices must consider the operating environment in their work. They must be aware of the individual device characteristics and their interaction with other devices. This document provides a detailed discussion of the waveform characteristics equivalent circuit models transmission line fanout and termination for AS load manageme
  • Advanced Schottky (ALS and AS) Logic Families
    PDF, 1.9 Мб, Файл опубликован: 1 авг 1995
    This document introduces the advanced Schottky family of clamped TTL integrated circuits (ICs). Detailed electrical characteristics of the 'AS and 'ALS devices with table formats are provided. Guidelines for designing high-performance digital systems using the Advanced Schottky family are given along with a brief summary of the solutions to most design decisions needed to implement systems using t
  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Мб, Файл опубликован: 1 окт 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Кб, Файл опубликован: 29 авг 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Live Insertion
    PDF, 150 Кб, Файл опубликован: 1 окт 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Кб, Версия: C, Файл опубликован: 2 дек 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Кб, Файл опубликован: 8 июл 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Designing With Logic (Rev. C)
    PDF, 186 Кб, Версия: C, Файл опубликован: 1 июн 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Introduction to Logic
    PDF, 93 Кб, Файл опубликован: 30 апр 2015

Модельный ряд

Классификация производителя

  • Semiconductors> Space & High Reliability> Logic Products> Buffers/Drivers/Transceivers> Buffer Drivers

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