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Datasheet Texas Instruments 5962-9172701QLA — Даташит

ПроизводительTexas Instruments
СерияSN54BCT8374A
Модель5962-9172701QLA
Datasheet Texas Instruments 5962-9172701QLA

Scan Test Devices With Octal D-type Edge-Triggered Flip-Flops 24-CDIP -55 to 125

Datasheets

Scan Test Devices With Octal D-Type Edge-Triggered Flip-Flops datasheet
PDF, 435 Кб, Версия: E, Файл опубликован: 1 июл 1996
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Цены

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SCAN TEST DEVICES WITH OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
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Россия и страны СНГ
5962-9172701QLA
Texas Instruments
3 784 ₽
AiPCBA
Весь мир
5962-9172701QLA
Texas Instruments
4 416 ₽
Элитан
Россия
5962-9172701QLA
Texas Instruments
11 258 ₽
Flash-Turtle
Весь мир
5962-9172701QLA
Texas Instruments
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Статус

Статус продуктаВ производстве (Рекомендуется для новых разработок)
Доступность образцов у производителяНет

Корпус / Упаковка / Маркировка

Pin24
Package TypeJT
Industry STD TermCDIP
JEDEC CodeR-GDIP-T
Package QTY1
CarrierTUBE
Width (мм)6.92
Length (мм)32
Thickness (мм)4.7
Pitch (мм)2.54
Max Height (мм)5.08
Mechanical DataСкачать

Экологический статус

RoHSSee ti.com

Application Notes

  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Кб, Версия: A, Файл опубликован: 1 авг 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Кб, Файл опубликован: 8 июл 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Introduction to Logic
    PDF, 93 Кб, Файл опубликован: 30 апр 2015
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Кб, Версия: C, Файл опубликован: 2 дек 2015
  • Live Insertion
    PDF, 150 Кб, Файл опубликован: 1 окт 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Power-Up Behavior of Clocked Devices (Rev. A)
    PDF, 34 Кб, Версия: A, Файл опубликован: 6 фев 2015
  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Мб, Файл опубликован: 1 окт 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • Designing With Logic (Rev. C)
    PDF, 186 Кб, Версия: C, Файл опубликован: 1 июн 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Кб, Версия: D, Файл опубликован: 23 июн 2016
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Кб, Файл опубликован: 29 авг 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con

Модельный ряд

Классификация производителя

  • Semiconductors > Space & High Reliability > Logic Products > Flip-Flop/Latch/Registers

Варианты написания:

59629172701QLA, 5962 9172701QLA

На английском языке: Datasheet Texas Instruments 5962-9172701QLA

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