Datasheet Texas Instruments SN74LVC374A-Q1 — Даташит

Производитель	Texas Instruments
Серия	SN74LVC374A-Q1

Datasheets

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Корпус / Упаковка / Маркировка

Параметры

Parameters / Models	CLVC374AQDWRG4Q1	CLVC374AQPWRG4Q1	SN74LVC374AQDWRQ1	SN74LVC374AQPWRQ1
3-State Output	Yes	Yes	Yes	Yes
Approx. Price (US$)			0.21 | 1ku	0.21 | 1ku
Bits	8	8
Bits(#)			8	8
F @ Nom Voltage(Max), Mhz	100	100
F @ Nom Voltage(Max)(Mhz)			100	100
ICC @ Nom Voltage(Max), мА	0.01	0.01
ICC @ Nom Voltage(Max)(mA)			0.01	0.01
Тип входа			TTL CMOS	TTL CMOS
Рабочий диапазон температур, C	от -40 до 125	от -40 до 125
Operating Temperature Range(C)			-40 to 125	-40 to 125
Output Drive (IOL/IOH)(Max), мА	24/-24	24/-24
Output Drive (IOL/IOH)(Max)(mA)			24/-24	24/-24
Тип выхода			CMOS	CMOS
Package Group	SOIC	TSSOP	SOIC	TSSOP
Package Size: mm2:W x L, PKG	20SOIC: 132 mm2: 10.3 x 12.8(SOIC)	20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP)
Package Size: mm2:W x L (PKG)			20SOIC: 132 mm2: 10.3 x 12.8(SOIC)	20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP)
Rating	Automotive	Automotive	Automotive	Automotive
Schmitt Trigger	No	No	No	No
Technology Family	LVC	LVC	LVC	LVC
VCC(Max), В	3.6	3.6
VCC(Max)(V)			3.6	3.6
VCC(Min), В	2	2
VCC(Min)(V)			2	2
Voltage(Nom), В	2.7,3.3	2.7,3.3
Voltage(Nom)(V)			2.7 3.3	2.7 3.3
tpd @ Nom Voltage(Max), нс	9.5,8.5	9.5,8.5
tpd @ Nom Voltage(Max)(ns)			9.5 8.5	9.5 8.5

Экологический статус

Application Notes

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  TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
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  LVC Characterization Information
  PDF, 114 Кб, Файл опубликован: 1 дек 1996
  This document provides characterization information about low-voltage logic (LVL) that operates from a 3.3-V power supply. It addresses the issues of interfacing to 5-V logic ac performance power considerations input and output characteristics and signal integrity for this family of devices.
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  Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features
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  TI Little Logic devices are logic-gate devices assembled in a small single- dual- or triple- gate package. Little Logic devices are widely used in portable equipment such as mobile phones MP3 players and notebook computers. Little Logic devices also are used in desktop computers and telecommunications. Little Logic gates are common components for easy PC board routing schematic design and b
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  Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices
  PDF, 115 Кб, Файл опубликован: 1 дек 1997
  This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn
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Классификация производителя

• Semiconductors> Logic> Flip-Flop/Latch/Register> D-Type Flip-Flop