LT3999 ABSOLUTE MAXIMUM RATINGS (Note 1) SWA, SWB ... –0.3V to 80V Storage Temperature Range .. –65°C to 150°C VIN, UVLO .. –0.3V to 60V Lead Temperature (Soldering, 10 sec) OVLO/DC, SYNC ... –0.3V to 8V MSOP ...300°C Operating Junction Temperature Range (Note 2) LT3999E .. –40°C to 125°C LT3999I ... –40°C to 125°C LT3999H .. –40°C to 150°C LT3999MP ... –55°C to 150°C PIN CONFIGURATION TOP VIEW TOP VIEW SWA 1 10 SWB SWA 1 10 SWB RBIAS 2 9 ILIM/SS RBIAS 2 9 ILIM/SS V 11 11 IN 3 8 SYNC VIN 3 8 SYNC UVLO 4 GND 7 RT GND OVLO/DC 5 6 RDC UVLO 4 7 RT OVLO/DC 5 6 RDC MSE PACKAGE 10-LEAD PLASTIC MSOP DD PACKAGE θJA = 40°CW, θJC = 10°CW 10-LEAD (3mm × 3mm) PLASTIC DFN EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB θJA = 43°C/W, θJC = 5.5°C/W EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB ORDER INFORMATIONLEAD FREE FINISHTAPE AND REELPART MARKING*PACKAGE DESCRIPTIONTEMPERATURE RANGE LT3999EMSE#PBF LT3999EMSE#TRPBF LTGKR 10-Lead Plastic MSOP –40°C to 125°C LT3999IMSE#PBF LT3999IMSE#TRPBF LTGKR 10-Lead Plastic MSOP –40°C to 125°C LT3999HMSE#PBF LT3999HMSE#TRPBF LTGKR 10-Lead Plastic MSOP –40°C to 150°C LT3999MPMSE#PBF LT3999MPMSE#TRPBF LTGKR 10-Lead Plastic MSOP –55°C to 150°C LT3999EDD#PBF LT3999EDD#TRPBF LGKQ 10-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C LT3999IDD#PBF LT3999IDD#TRPBF LGKQ 10-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container. Consult LTC Marketing for information on nonstandard lead based finish parts. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/ 3999fa 2 For more information www.linear.com/LT3999 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Package Description Typical Application Related Parts
