Data SheetADR130ABSOLUTE MAXIMUM RATINGS Table 3.THERMAL RESISTANCEParameterRatings θJA is specified for the worst-case conditions, that is, a device VIN to GND 20 V soldered in a circuit board for surface-mount packages. Internal Power Dissipation 40 mW Storage Temperature Range −65°C to +150°C Table 4. Thermal Resistance Specified Temperature Range −40°C to +120°C Package TypeθJAθJCUnit Lead Temperature (Soldering, 60 sec) 300°C 6-Lead TSOT (UJ-6) 186 67 °C/W Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress ESD CAUTION rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. C | Page 5 of 16 Document Outline Features Applications Pin Configuration General Description Revision History Specifications Electrical Characteristics Absolute Maximum Ratings Thermal Resistance ESD Caution Typical Performance Characteristics Terminology Theory of Operation Power Dissipation Considerations Input Capacitor Output Capacitor Application Notes Basic Voltage Reference Connection Stacking Reference ICs for Arbitrary Outputs Precision Current Source Outline Dimensions Ordering Guide
