Datasheet EPC2361 (Efficient Power Conversion) - 10

eGaN® FET DATASHEET
EPC2361
ADDITIONAL RESOURCES AVAILABLE
Solder mask defined pads are recommended for best reliability. Exposed board Conductive
Recommended
pad Solder Expansion mask Overlap PCB PCB
Non-solder mask defined Solder mask defined
Figure 15: Solder mask defined versus non-solder mask defined pad
Recommended Device Device
PCB PCB
Asymmetrical solder ball Symmetrical solder ball
(Sensitive to registration) (Regardless of registration)
Non-solder mask defined Solder mask defined
Figure 16: Effect of solder mask design on the solder ball symmetry • Assembly resources –
https://epc-co.com/epc/Portals/0/epc/documents/product-training/Appnote_GaNassembly.pdf
• Library of Altium footprints for production FETs and ICs –
https://epc-co.com/epc/documents/altium-files/EPC%20Altium%20Library.zip
(for preliminary device Altium footprints, contact EPC) Efficient Power Conversion Corporation (EPC) reserves the right to make changes without further notice to any products herein to improve reliability, function or design. EPC does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. Information subject to eGaN® is a registered trademark of Efficient Power Conversion Corporation. change without notice. EPC Patent Listing: https://epc-co.com/epc/about-epc/patents Revised February 2024 EPC – POWER CONVERSION TECHNOLOGY LEADER | EPC-CO.COM | ©2024 | For more information:
[email protected]
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