MSP430FR5721IDAR datasheet Texas Instruments, скачать pdf даташит

Семейство: MSP430FR5720, MSP430FR5721, MSP430FR5722, MSP430FR5723, MSP430FR5724, MSP430FR5725, MSP430FR5726, MSP430FR5727, MSP430FR5728, MSP430FR5729

Статус

Статус продукта	В производстве (Рекомендуется для новых разработок)
Доступность образцов у производителя	Нет

Корпус / Упаковка / Маркировка

Pin	38
Package Type	DA
Industry STD Term	TSSOP
JEDEC Code	R-PDSO-G
Package QTY	2000
Carrier	LARGE T&R
Маркировка	M430FR5721
Width (мм)	6.2
Length (мм)	12.5
Thickness (мм)	1.15
Pitch (мм)	.65
Max Height (мм)	1.2
Mechanical Data	Скачать »

Параметры

ADC	ADC10 - 12ch
AES	N/A
Active Power	125 uA/MHz
Additional Features	Real-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA
BSL	UART
CPU	MSP430
Comparators	16
DMA	3
Featured	fr5
Тактовая частота	8 МГц
GPIO Pins	32
I2C	1
Max VCC	3.6
Min VCC	2
Multiplier	32x32
Non-volatile Memory	4 KB
Рабочий диапазон температур	от -40 до 85 C
Package Group	TSSOP
Package Size: mm2:W x L	38TSSOP: 101 mm2: 8.1 x 12.5(TSSOP) PKG
RAM	1 KB
Rating	Catalog
SPI	3
Security Enabler	Cryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protection
Special I/O	N/A
Standby Power	6.4 LPM3-uA
Timers - 16-bit	5
UART	2
Wakeup Time	78 us

Экологический статус

RoHS	Совместим

Комплекты разработчика и оценочные наборы

Evaluation Modules & Boards: MSP-TS430RHA40A
MSP-TS430RHA40A- 40-pin Target Development Board for MSP430FRxx FRAM MCUs
Статус продукта: В производстве (Рекомендуется для новых разработок)
- Скачать »
Evaluation Modules & Boards: MSP-FET430U40A
40-pin Target Development Board and MSP-FET Programmer Bundle for MSP430F5x MCUs
Статус продукта: В производстве (Рекомендуется для новых разработок)
- Скачать »
JTAG Emulators/ Analyzers: ENERGYTRACE
MSP EnergyTrace Technology
Статус продукта: В производстве (Рекомендуется для новых разработок)
- Скачать »

Application Notes

Скачать » Application Notes, PDF, 3.5 Мб, Версия: A, 02-03-2015
Over-the-Air (OTA) Update With the MSP430FR57xx (Rev. A)
Скачать » Application Notes, PDF, 1.5 Мб, 29-03-2012
MSP430 System-Level ESD Considerations
System-Level ESD has become increasingly demanding with silicon technology scaling towards lower voltages and the need for designing cost-effective and ultra-low power components. This application report addresses three different ESD topics to help board designers and OEMs understand and design robust system-level designs:(1) Component-level ESD testing and system-level ESD testing, their differ
Скачать » Application Notes, PDF, 103 Кб, Версия: B, 04-02-2015
Maximizing Write Speed on the MSP430в„ў FRAM (Rev. B)
Nonvolatile low-power ferroelectric RAM (FRAM) is capable of extremely high-speed write accesses. This application report discusses how to maximize FRAM write speeds specifically in the MSP430FRxx family using simple techniques. The document uses examples from bench tests performed on the MSP430FR5739 device, which can be extended to all MSP430в„ў FRAM-based devices, and discusses tradeoffs such as
Скачать » Application Notes, PDF, 326 Кб, 23-06-2014
MSP430 FRAM Technology вЂ“ How To and Best Practices
FRAM is a non-volatile memory technology that behaves similar to SRAM while enabling a whole host of new applications, but also changing the way firmware should be designed. This application report outlines the how to and best practices of using FRAM technology in MSP430 from an embedded software development perspective. It discusses how to implement a memory layout according to application-specif
Скачать » Application Notes, PDF, 295 Кб, Версия: A, 01-05-2014
MSP430 FRAM Quality and Reliability (Rev. A)
FRAM is a nonvolatile embedded memory technology and is known for its ability to be ultra-low power while being the most flexible and easy-to-use universal memory solution available today. This application report is intended to give new FRAM users and those migrating from flash-based applications knowledge on how FRAM meets key quality and reliability requirements such as data retention and endura
Скачать » Application Notes, PDF, 41 Кб, Версия: A, 13-09-2012
Migrating from the USCI Module to the eUSCI Module (Rev. A)
The purpose of this application report is to enable easy migration for designs based on the USCI_A and USCI_B modules to the eUSCI_A and the eUSCI_B modules. The document highlights the new features in the eUSCI module and the main differences between the USCI and the eUSCI modules.
Скачать » Application Notes, PDF, 154 Кб, Версия: A, 16-02-2012
Migrating from the MSP430F2xx Family to the MSP430FR57xx Family (Rev. A)
This application report enables easy migration from MSP430F2xx Flash-based MCUs to the MSP430FR57xx family FRAM-based MCU. It covers programming, system, and peripheral considerations when migrating firmware. The purpose is to highlight differences between the two families. For more information on the usage of the MSP430FR57xx features, see the MSP430FR57xx Family User's Guide (
Скачать » Application Notes, PDF, 551 Кб, Версия: A, 01-04-2016
General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl
Скачать » Application Notes, PDF, 475 Кб, 05-10-2012
Design Considerations When Using the MSP430 Graphics Library
LCDs are a growing commodity in todays market with products as diverse as children's toys to medical devices. Modern LCDs, along with the graphics displayed on them, are growing in complexity. A graphics library can simplify and accelerate development while creating the desired user experience. TI provides the MSP430 Graphics Library for use in developing products with the MSP430в„ў MCU. This