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Datasheet Cree XHP50A-00-0000-0D0HG427H

Производитель	Cree
Серия	XHP50
Модель	XHP50A-00-0000-0D0HG427H

Сверхмощные белые светодиоды серии XLamp Extreme High Power (XHP)

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CLD-DS111 Rev 0F Product family data sheet cree® Xlamp® XhP50 leds Product descriPtion
SC5 TechnologyTM Platform, features
the Binned at 85 °C PCB layout 3000 mA (6 V), 1500 mA (12 V) 1.2 °C/W Wide viewing angle: 120° Unlimited floor life at 30 єC/85% RH J-STD-020C
® table of contents
Characteristics .2 Flux Characteristics, easyWhite® Order Codes and Bins .3 Flux Characteristics, ANSI White Order Codes and Bins .6 Relative Spectral Power Distribution .9 Relative Flux vs. Junction Temperature .9 electrical Characteristics .10 Relative Flux vs. Current .11 Relative Chromaticity vs Current.12 Relative Chromaticity vs Temperature .13 Typical Spatial Distribution .13 Thermal Design .14 Performance Groups Luminous Flux .15 Performance Groups Chromaticity 15 Cree's Standard White Chromaticity Regions Plotted on the CIe 1931 Curve .18 Cree's Standard Cool White Kits Plotted on ANSI Standard Chromaticity Regions .21 Cree's Standard Warm and Neutral White Kits Plotted on ANSI Standard Chromaticity Regions .22 Bin and Order-Code Format .23 Powered by Cree's groundbreaking Available in white XLamp XHP50 LeD is a member of Configurable to 6 V or 12 V by Cree's extreme High Power (XHP) class and reliability to radically reduce At its maximum current, the XHP50 LeD delivers twice the light output of the industry's brightest single-die LeD, the XLamp XM-L2 LeD, with increasing The the package LeD than also footprint. of LEDs that redefines lumen density Maximum drive current: system costs by up to 40 percent. Low thermal resistance: similar lumens per watt and without Reflow solderable - JEDEC XHP50 achieves UL recognized component (e349212) LeD longer lifetime at higher operating temperatures previous technology. The result is significantly lower thermal, mechanical and optical costs at the system level. WWW.CRee.COM/XLAMP Reflow Soldering Characteristics .24 Notes .25 Mechanical Dimensions.26 Electrical Configuration .27 Tape and Reel .27 Packaging .28
Copyright © 2014-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and easyWhite® are registered trademarks and SC5 TechnologyTM is a trademark of Cree, Inc. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp xlamp ® xHp50 leds characteristics
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CLD-DS111 Rev 0F Product family data sheet cree® Xlamp® XhP50 leds Product descriPtion
SC5 TechnologyTM Platform, features
the Binned at 85 °C PCB layout 3000 mA (6 V), 1500 mA (12 V) 1.2 °C/W Wide viewing angle: 120° Unlimited floor life at 30 єC/85% RH J-STD-020C
® table of contents
Characteristics .2 Flux Characteristics, easyWhite® Order Codes and Bins .3 Flux Characteristics, ANSI White Order Codes and Bins .6 Relative Spectral Power Distribution .9 Relative Flux vs. Junction Tem...