Data sheet acquired from Harris Semiconductor SCHS062B Revised July 2003 The CD4089B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (NSR suffix), and 16-lead thin shrink small-outline packages (PW and PWR suffixes). Copyright 2003, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 11-Jul-2015 PACKAGING INFORMATION
Orderable Device CD4089BE CD4089BEE4 CD4089BF3A CD4089BNSR CD4089BPWR Status
(1) Package Type Package Pins Package Drawing Qty PDIP PDIP CDIP SO TSSOP N N J NS PW 16 16 16 16 16 25 25 1 2000 2000 Eco Plan
(2) Lead/Ball Finish
(6) MSL Peak Temp
(3) Op Temp (°C) -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 Device Marking
(4/5) Samples ACTIVE ACTIVE LIFEBUY ACTIVE ACTIVE Pb-Free (RoHS) Pb-Free (RoHS) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) CU NIPDAU CU NIPDAU A42 CU NIPDAU CU NIPDAU N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type Level-1-260C-UNLIM Level-1-260C-UNLIM CD4089BE CD4089BE CD4089BF3A CD4089B CM089B (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan -The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) -please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoH …
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