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Datasheet Texas Instruments MSP430F5227IYFFR

Datasheet Texas Instruments MSP430F5227IYFFR

ПроизводительTexas Instruments

Ultra-Low Power 1.8V Split-Rail I/O 64-DSBGA -40 to 85


  • Скачать » Datasheet PDF, 2.1 Мб, Версия: G, Файл опубликован: 28 июн 2016
    MSP430F522x, MSP430F521x Mixed-Signal Microcontrollers datasheet
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    Design MSP430F5229, MSP430F5227, MSP430F5224, MSP430F5222
    MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
    SLAS718G – NOVEMBER 2012 – REVISED JUNE 2016 MSP430F522x, MSP430F521x Mixed-Signal Microcontrollers
    1 Device Overview
    1.1 Features 1 Dual-Supply Voltage Device
    – Primary Supply (AVCC, DVCC): Powered From External Supply:
    3.6 V Down to 1.8 V Up to 22 General-Purpose I/Os With up to
    Four External Interrupts
    – Low-Voltage Interface Supply (DVIO): Powered From Separate External Supply:
    1.62 V to 1.98 V Up to 31 General-Purpose I/Os With up to
    12 External Interrupts Serial Communications Ultra-Low Power Consumption
    – Active Mode (AM):
    All System Clocks Active
    290 ВµA/MHz at 8 MHz, 3.0 V, Flash Program
    Execution (Typical)
    150 ВµA/MHz at 8 MHz, 3.0 V, RAM Program
    Execution (Typical) ...


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Семейство: MSP430F5212, MSP430F5214, MSP430F5217, MSP430F5219, MSP430F5222, MSP430F5224, MSP430F5227, MSP430F5229


Статус продуктаВ производстве (Рекомендуется для новых разработок)
Доступность образцов у производителяНет

Корпус / Упаковка / Маркировка

Package TypeYFF
Industry STD TermDSBGA
Package QTY2500
CarrierLARGE T&R
Thickness (мм).4
Pitch (мм).4
Max Height (мм).625
Mechanical DataСкачать »


ADCADC10 - 10ch
Active Power404 uA/MHz
Additional FeaturesReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA
Тактовая частота25 МГц
GPIO Pins53
Max VCC3.6
Min VCC1.8
Non-volatile Memory64 KB
Рабочий диапазон температурот -40 до 85 C
Package GroupDSBGA
Package Size: mm2:W x LSee datasheet (DSBGA) PKG
Special I/O1.8V I/O
Standby Power2.5 LPM3-uA
Timers - 16-bit4
Wakeup Time3.5 us

Экологический статус


Комплекты разработчика и оценочные наборы

  • Evaluation Modules & Boards: MSP-TS430RGC64C
    MSP-TS430RGC64C - 64-pin Target Development Board for MSP430F5x MCUs
    Статус продукта: В производстве (Рекомендуется для новых разработок)
  • Development Kits: MSP-FET430U64C
    64-pin Target Development Board and MSP-FET Programmer Bundle for MSP430F5x MCUs
    Статус продукта: В производстве (Рекомендуется для новых разработок)
  • JTAG Emulators/ Analyzers: ENERGYTRACE
    MSP EnergyTrace Technology
    Статус продукта: В производстве (Рекомендуется для новых разработок)

Application Notes

  • Скачать » Application Notes PDF, 72 Кб, Файл опубликован: 30 ноя 2012
    Designing with MSP430F522x and MSP430F521x Devices
    The MSP430F522x and MSP430F521x devices support a split supply I/O system that is essential in systems in which the MCU is required to interface with external devices (such as sensors or other processors) that operate at different voltage level compared to the MCU device supply. Additionally, the split supply input voltage range of the F522x and F521x devices starts as low as 1.62 V (see the devic
  • Скачать » Application Notes PDF, 870 Кб, Файл опубликован: 2 окт 2013
    Using the MSP430 Timer_D Module in Hi-Resolution Mode
    This application report describes the use of the high-resolution feature of the Timer_D module introduced in MSP430F51x1 and MSP430F51x2 devices. Timer_D enables applications that require high resolution such as capacitive touch detection, PWM DACs, advanced LED lighting, and digital controllers for power supplies. This application report provides an advanced description of the use and calibration
  • Скачать » Application Notes PDF, 151 Кб, Версия: D, Файл опубликован: 3 ноя 2016
    Migrating from the MSP430F5xx,F6xx Family to the MSP430FR58xx/FR59xx/68xx Family (Rev. D)
    This application report helps enable easy migration from MSP430F5xx and MSP430F6xx flash-based MCUs to the MSP430FR58xx/FR59xx/68xx/69xx FRAM-based MCUs. For the migration guide to MSP430FR57xx, see Migrating From the MSP430F2xx Family to the MSP430FR57xx Family. It covers programming, system, and peripheral considerations when migrating firmware. The intent is to highlight differences between the
  • Скачать » Application Notes PDF, 551 Кб, Версия: A, Файл опубликован: 1 апр 2016
    General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
    Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl
  • Скачать » Application Notes PDF, 752 Кб, Файл опубликован: 7 дек 2015
    MSP Code Protection Features
    MSP microcontrollers (MCUs) offer a number of features to help control code accessibility in the device, to add different layers of code access management and protection strategies. These include features that can lock or password protect the JTAG/SBW access, IP Encapsulation (IPE) to isolate sensitive code with different permissions than the rest of the program, and bootloader (BSL) access featur
  • Скачать » Application Notes PDF, 475 Кб, Файл опубликован: 5 окт 2012
    Design Considerations When Using the MSP430 Graphics Library
    LCDs are a growing commodity in todays market with products as diverse as children's toys to medical devices. Modern LCDs, along with the graphics displayed on them, are growing in complexity. A graphics library can simplify and accelerate development while creating the desired user experience. TI provides the MSP430 Graphics Library for use in developing products with the MSP430в„ў MCU. This
  • Скачать » Application Notes PDF, 520 Кб, Файл опубликован: 7 дек 2015
    ESD Diode Current Specification
    This document explains the maximum ESD diode current specified for GPIO on MSP microcontrollers. Sometimes signals on specific pins exceed the supply of the MSP MCU. In such a case, the device can handle this overvoltage condition through the ESD diodes, but the ESD diode specification must be considered during application design. The items to be considered are described in this document.

Модельный ряд

Серия: MSP430F5227 (4)

Классификация производителя

  • Semiconductors > Microcontrollers (MCU) > MSP430 ultra-low-power MCUs > MSP430F5x/6x

На английском языке: Datasheet Texas Instruments MSP430F5227IYFFR

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