Datasheet ТI SN74LVC1G00DRLR — Даташит

Производитель	Texas Instruments
Серия	SN74LVC1G00
Модель	SN74LVC1G00DRLR

Datasheets

Application Notes

• Скачать
  NanoStarв„ў & NanoFreeв„ў 300Ојm Solder Bump WCSP Application
  PDF, 749 Кб, Файл опубликован: 2 фев 2004
  The NanoStarв„ў Wafer Chip-Scale Package (WCSP) is a family of bare die packages developed for applications that require the smallest possible package. WCSP provides electrical interconnection via solder spheres attached to the die and is aligned with JEDEC package standard MOв€’211. NanoStarв„ў, with advanced materials engineering technology, has demonstrated excellent board level rel
• Скачать
  Designing and Manufacturing with TI's X2SON Packages
  PDF, 134 Кб, Файл опубликован: 23 авг 2017
• Скачать
  LVC Characterization Information
  PDF, 114 Кб, Файл опубликован: 1 дек 1996
  This document provides characterization information about low-voltage logic (LVL) that operates from a 3.3-V power supply. It addresses the issues of interfacing to 5-V logic ac performance power considerations input and output characteristics and signal integrity for this family of devices.
• Скачать
  Use of the CMOS Unbuffered Inverter in Oscillator Circuits
  PDF, 796 Кб, Файл опубликован: 6 ноя 2003
  CMOS devices have a high input impedance high gain and high bandwidth. These characteristics are similar to ideal amplifier characteristics and hence a CMOS buffer or inverter can be used in an oscillator circuit in conjunction with other passive components. Now CMOS oscillator circuits are widely used in high-speed applications because they are economical easy to use and take significantly

Модельный ряд

Классификация производителя

• Semiconductors > Logic > Little Logic