Datasheet Texas Instruments LM2825N-12/NOPB — Даташит
Производитель | Texas Instruments |
Серия | LM2825 |
Модель | LM2825N-12/NOPB |

Datasheets
LM2825 Integrated Power Supply 1A DC-DC Converter datasheet
PDF, 970 Кб, Версия: C, Файл опубликован: 3 апр 2013
Цены
![]() 13 предложений от 13 поставщиков Преобразователь DC/DC, Conv DC-DC 15V to 40V Step Down Single-Out 12V 1A 24Pin PDIP Tube | |||
LM2825N-12/NOPB Texas Instruments | 344 ₽ | ||
LM2825N-12/NOPB Texas Instruments | 2 631 ₽ | ||
LM2825N-12/NOPB Texas Instruments | по запросу | ||
LM2825N-12/NOPB Texas Instruments | по запросу |
Статус
Статус продукта | Скоро будет снят с производства (Производитель объявил о скором прекращении производства прибора) |
Доступность образцов у производителя | Нет |
Корпус / Упаковка / Маркировка
Pin | 24 | 24 |
Package Type | NFL | NFL |
Industry STD Term | PDIP | PDIP |
JEDEC Code | R-PDIP-T | R-PDIP-T |
Package QTY | 12 | 12 |
Carrier | TUBE | TUBE |
Маркировка | LM2825N-12 | 12V, 1A OUTPUT |
Width (мм) | 13.716 | 13.716 |
Length (мм) | 31.75 | 31.75 |
Thickness (мм) | 5.715 | 5.715 |
Pitch (мм) | 2.54 | 2.54 |
Max Height (мм) | 7.24 | 7.24 |
Mechanical Data | Скачать | Скачать |
Рекомендуемая замена
Replacement | LMZ14201HTZE/NOPB |
Replacement Code | F |
Экологический статус
RoHS | Совместим |
Application Notes
- AN-643 EMI/RFI Board Design (Rev. B)PDF, 742 Кб, Версия: B, Файл опубликован: 3 май 2004
Application Note 643 EMI/RFI Board Design - Input and Output Capacitor SelectionPDF, 219 Кб, Файл опубликован: 19 сен 2005
- AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)PDF, 3.6 Мб, Версия: A, Файл опубликован: 23 апр 2013
This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor. - AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)PDF, 1.4 Мб, Версия: A, Файл опубликован: 23 апр 2013
This application note provides thermal power analysis techniques for analyzing the power IC. - AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)PDF, 2.7 Мб, Версия: A, Файл опубликован: 23 апр 2013
This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time. - Semiconductor and IC Package Thermal Metrics (Rev. C)PDF, 201 Кб, Версия: C, Файл опубликован: 19 апр 2016
- Sensing and Monitoring for Control and Protection SeminarPDF, 245 Кб, Файл опубликован: 17 фев 2003
- AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)PDF, 82 Кб, Версия: C, Файл опубликован: 23 апр 2013
When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current - AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)PDF, 374 Кб, Версия: C, Файл опубликован: 23 апр 2013
This application report provides SIMPLE SWITCHER™ PCB layout guidelines. - AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)PDF, 2.5 Мб, Версия: C, Файл опубликован: 24 апр 2013
Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti - AN-1038 LM2825 Application Information Guide (Rev. D)PDF, 601 Кб, Версия: D, Файл опубликован: 23 апр 2013
This application note provides information on the LM2825 application. - AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)PDF, 9.2 Мб, Версия: B, Файл опубликован: 23 апр 2013
This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
Модельный ряд
Серия: LM2825 (5)
- LM2825HN-ADJ/NOPB LM2825N-12/NOPB LM2825N-3.3/NOPB LM2825N-5.0/NOPB LM2825N-ADJ/NOPB
Классификация производителя
- Semiconductors > Power Management > Non-isolated DC/DC Switching Regulator > Step-Down (Buck) > Buck Converter (Integrated Switch)
Варианты написания:
LM2825N12/NOPB, LM2825N 12/NOPB