Datasheet Texas Instruments LM2736XMK/NOPB — Даташит
| Производитель | Texas Instruments |
| Серия | LM2736 |
| Модель | LM2736XMK/NOPB |
Тонкий SOT23, 750 мА, понижающий регулятор постоянного тока 6-SOT-23-THIN от -40 до 125
Datasheets
LM2736 Thin SOT 750 mA Load Step-Down DC-DC Regulator datasheet
PDF, 1.5 Мб, Версия: H, Файл опубликован: 29 дек 2014
Выписка из документа
Цены
 Купить LM2736XMK/NOPB на РадиоЛоцман.Цены — от 37 до 481 ₽26 предложений от 15 поставщиков Conv DC-DC 3V to 18V Step Down Single-Out 1.25V to 16V 0.75A 6Pin TSOT-23 T/R | |||
| LM2736XMK/NOPB Texas Instruments | 37 ₽ | ||
| LM2736XMK/NOPB Texas Instruments | 54 ₽ | ||
| LM2736XMK/NOPB Texas Instruments | 73 ₽ | ||
| LM2736XMK/NOPB Texas Instruments | 223 ₽ | ||
Статус
| Статус продукта | В производстве (Рекомендуется для новых разработок) |
| Доступность образцов у производителя | Да |
Корпус / Упаковка / Маркировка
| Pin | 6 |
| Package Type | DDC |
| Industry STD Term | SOT-23-THIN |
| JEDEC Code | R-PDSO-G |
| Package QTY | 1000 |
| Carrier | LARGE T&R |
| Маркировка | SHAB |
| Width (мм) | 1.6 |
| Length (мм) | 2.9 |
| Thickness (мм) | .87 |
| Pitch (мм) | .95 |
| Max Height (мм) | 1.1 |
| Mechanical Data | Скачать |
Параметры
| Control Mode | Current Mode |
| Duty Cycle(Max) | 96 % |
| Iout(Max) | 0.75 A |
| Iq(Typ) | 1.5 мА |
| Рабочий диапазон температур | от -40 до 125 C |
| Package Group | SOT-23-THIN |
| Rating | Catalog |
| Regulated Outputs | 1 |
| Special Features | Enable,Light Load Efficiency,Pre-Bias Start-Up |
| Switching Frequency(Max) | 1900 kHz |
| Switching Frequency(Min) | 400 kHz |
| Тип | Converter |
| Vin(Max) | 18 В |
| Vin(Min) | 3 В |
| Vout(Max) | 16 В |
| Vout(Min) | 1.25 В |
Экологический статус
| RoHS | Совместим |
Application Notes
- AN-643 EMI/RFI Board Design (Rev. B)PDF, 742 Кб, Версия: B, Файл опубликован: 3 май 2004
Application Note 643 EMI/RFI Board Design - Input and Output Capacitor SelectionPDF, 219 Кб, Файл опубликован: 19 сен 2005
- AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)PDF, 3.6 Мб, Версия: A, Файл опубликован: 23 апр 2013
This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor. - AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)PDF, 1.4 Мб, Версия: A, Файл опубликован: 23 апр 2013
This application note provides thermal power analysis techniques for analyzing the power IC. - AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)PDF, 2.7 Мб, Версия: A, Файл опубликован: 23 апр 2013
This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time. - Semiconductor and IC Package Thermal Metrics (Rev. C)PDF, 201 Кб, Версия: C, Файл опубликован: 19 апр 2016
- AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)PDF, 82 Кб, Версия: C, Файл опубликован: 23 апр 2013
When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current - AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)PDF, 374 Кб, Версия: C, Файл опубликован: 23 апр 2013
This application report provides SIMPLE SWITCHER™ PCB layout guidelines. - AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)PDF, 2.5 Мб, Версия: C, Файл опубликован: 24 апр 2013
Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti - Power Management Considerations for FPGAs and ASICsPDF, 745 Кб, Файл опубликован: 22 мар 2007
- AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)PDF, 9.2 Мб, Версия: B, Файл опубликован: 23 апр 2013
This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
Модельный ряд
Серия: LM2736 (6)
- LM2736XMK LM2736XMK/NOPB LM2736XMKX/NOPB LM2736YMK LM2736YMK/NOPB LM2736YMKX/NOPB
Классификация производителя
- Semiconductors > Power Management > Non-isolated DC/DC Switching Regulator > Step-Down (Buck) > Buck Converter (Integrated Switch)
