Datasheet Texas Instruments 66AK2H12 — Даташит
Производитель | Texas Instruments |
Серия | 66AK2H12 |

Многоядерная однокристальная система DSP+ARM KeyStone II (SoC)
Datasheets
66AK2Hxx Multicore DSP+ARMВ® KeyStone II System-on-Chip (SoC) datasheet
PDF, 2.4 Мб, Версия: F, Файл опубликован: 2 июн 2017
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Цены
![]() 18 предложений от 15 поставщиков Цифровой сигнальный процессор DSP, DSP Fixed-Point/Floating-Point 1517Pin FCBGA Tray | |||
66AK2H12BAAW24 Texas Instruments | 41 724 ₽ | ||
66AK2H12BAAW24 Texas Instruments | от 41 724 ₽ | ||
66AK2H12BAAW24 Texas Instruments | 116 332 ₽ | ||
66AK2H12DXAAWA24 Texas Instruments | по запросу |
Статус
66AK2H12BAAW2 | 66AK2H12BAAW24 | 66AK2H12BAAWA2 | 66AK2H12BAAWA24 | 66AK2H12BXAAW2 | 66AK2H12DAAW2 | 66AK2H12DAAW24 | 66AK2H12DAAWA2 | 66AK2H12DAAWA24 | 66AK2H12DXAAWA24 | |
---|---|---|---|---|---|---|---|---|---|---|
Статус продукта | В производстве | В производстве | В производстве | В производстве | В производстве | В производстве | В производстве | В производстве | В производстве | В производстве |
Доступность образцов у производителя | Нет | Нет | Да | Нет | Да | Нет | Нет | Нет | Нет | Нет |
Корпус / Упаковка / Маркировка
66AK2H12BAAW2 | 66AK2H12BAAW24 | 66AK2H12BAAWA2 | 66AK2H12BAAWA24 | 66AK2H12BXAAW2 | 66AK2H12DAAW2 | 66AK2H12DAAW24 | 66AK2H12DAAWA2 | 66AK2H12DAAWA24 | 66AK2H12DXAAWA24 | |
---|---|---|---|---|---|---|---|---|---|---|
N | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 |
Pin | 1517 | 1517 | 1517 | 1517 | 1517 | 1517 | 1517 | 1517 | 1517 | 1517 |
Package Type | AAW | AAW | AAW | AAW | AAW | AAW | AAW | AAW | AAW | AAW |
Package QTY | 21 | 21 | 21 | 21 | 21 | 21 | 21 | 21 | 21 | 21 |
Carrier | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) |
Маркировка | @2012 TI | 66AK2H12AAW | 66AK2H12AAW | A1.2GHZ/1.4GHZ | 66AK2H12XAAW | @2012 TI | 66AK2H12AAW | A1.2GHZ | 66AK2H12AAW | @2012 TI |
Width (мм) | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
Length (мм) | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
Thickness (мм) | 3.07 | 3.07 | 3.07 | 3.07 | 3.07 | 3.07 | 3.07 | 3.07 | 3.07 | 3.07 |
Mechanical Data | Скачать | Скачать | Скачать | Скачать | Скачать | Скачать | Скачать | Скачать | Скачать | Скачать |
Параметры
Parameters / Models | 66AK2H12BAAW2![]() | 66AK2H12BAAW24![]() | 66AK2H12BAAWA2![]() | 66AK2H12BAAWA24![]() | 66AK2H12BXAAW2![]() | 66AK2H12DAAW2![]() | 66AK2H12DAAW24![]() | 66AK2H12DAAWA2![]() | 66AK2H12DAAWA24![]() | 66AK2H12DXAAWA24![]() |
---|---|---|---|---|---|---|---|---|---|---|
ARM CPU | 4 ARM Cortex-A15 | 4 ARM Cortex-A15 | 4 ARM Cortex-A15 | 4 ARM Cortex-A15 | 4 ARM Cortex-A15 | 4 ARM Cortex-A15 | 4 ARM Cortex-A15 | 4 ARM Cortex-A15 | 4 ARM Cortex-A15 | 4 ARM Cortex-A15 |
ARM MHz, Max. | 1200,1400 | 1200,1400 | 1200,1400 | 1200,1400 | 1200,1400 | 1200,1400 | 1200,1400 | 1200,1400 | 1200,1400 | 1200,1400 |
Applications | Automation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space | Automation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space | Automation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space | Automation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space | Automation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space | Automation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space | Automation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space | Automation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space | Automation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space | Automation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space |
DRAM | DDR3,DDR3L | DDR3,DDR3L | DDR3,DDR3L | DDR3,DDR3L | DDR3,DDR3L | DDR3,DDR3L | DDR3,DDR3L | DDR3,DDR3L | DDR3,DDR3L | DDR3,DDR3L |
DSP | 8 C66x | 8 C66x | 8 C66x | 8 C66x | 8 C66x | 8 C66x | 8 C66x | 8 C66x | 8 C66x | 8 C66x |
DSP MHz, Max. | 1200 | 1200 | 1200 | 1200 | 1200 | 1200 | 1200 | 1200 | 1200 | 1200 |
EMAC | 4-port 1Gb Switch | 4-port 1Gb Switch | 4-port 1Gb Switch | 4-port 1Gb Switch | 4-port 1Gb Switch | 4-port 1Gb Switch | 4-port 1Gb Switch | 4-port 1Gb Switch | 4-port 1Gb Switch | 4-port 1Gb Switch |
Hardware Accelerators | Packet Accelerator,Security Accelerator | Packet Accelerator,Security Accelerator | Packet Accelerator,Security Accelerator | Packet Accelerator,Security Accelerator | Packet Accelerator,Security Accelerator | Packet Accelerator,Security Accelerator | Packet Accelerator,Security Accelerator | Packet Accelerator,Security Accelerator | Packet Accelerator,Security Accelerator | Packet Accelerator,Security Accelerator |
I2C | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
On-Chip L2 Cache | 4096 KB (ARM Cluster),1024 KB (per C66x DSP core) | 4096 KB (ARM Cluster),1024 KB (per C66x DSP core) | 4096 KB (ARM Cluster),1024 KB (per C66x DSP core) | 4096 KB (ARM Cluster),1024 KB (per C66x DSP core) | 4096 KB (ARM Cluster),1024 KB (per C66x DSP core) | 4096 KB (ARM Cluster),1024 KB (per C66x DSP core) | 4096 KB (ARM Cluster),1024 KB (per C66x DSP core) | 4096 KB (ARM Cluster),1024 KB (per C66x DSP core) | 4096 KB (ARM Cluster),1024 KB (per C66x DSP core) | 4096 KB (ARM Cluster),1024 KB (per C66x DSP core) |
Operating Systems | Integrity,Linux,SYS/BIOS,VxWorks | Integrity,Linux,SYS/BIOS,VxWorks | Integrity,Linux,SYS/BIOS,VxWorks | Integrity,Linux,SYS/BIOS,VxWorks | Integrity,Linux,SYS/BIOS,VxWorks | Integrity,Linux,SYS/BIOS,VxWorks | Integrity,Linux,SYS/BIOS,VxWorks | Integrity,Linux,SYS/BIOS,VxWorks | Integrity,Linux,SYS/BIOS,VxWorks | Integrity,Linux,SYS/BIOS,VxWorks |
Рабочий диапазон температур, C | от -40 до 100,0 до 85 | от -40 до 100,0 до 85 | от -40 до 100,0 до 85 | от -40 до 100,0 до 85 | от -40 до 100,0 до 85 | от -40 до 100,0 до 85 | от -40 до 100,0 до 85 | от -40 до 100,0 до 85 | от -40 до 100,0 до 85 | от -40 до 100,0 до 85 |
Other On-Chip Memory | 6144 KB | 6144 KB | 6144 KB | 6144 KB | 6144 KB | 6144 KB | 6144 KB | 6144 KB | 6144 KB | 6144 KB |
PCI/PCIe | 2 PCIe Gen2 | 2 PCIe Gen2 | 2 PCIe Gen2 | 2 PCIe Gen2 | 2 PCIe Gen2 | 2 PCIe Gen2 | 2 PCIe Gen2 | 2 PCIe Gen2 | 2 PCIe Gen2 | 2 PCIe Gen2 |
Rating | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog |
SPI | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
UART, SCI | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
USB | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Экологический статус
66AK2H12BAAW2 | 66AK2H12BAAW24 | 66AK2H12BAAWA2 | 66AK2H12BAAWA24 | 66AK2H12BXAAW2 | 66AK2H12DAAW2 | 66AK2H12DAAW24 | 66AK2H12DAAWA2 | 66AK2H12DAAWA24 | 66AK2H12DXAAWA24 | |
---|---|---|---|---|---|---|---|---|---|---|
RoHS | Совместим | Совместим | Совместим | Совместим | Совместим | Совместим | Совместим | Совместим | Совместим | Совместим |
Application Notes
- Keystone EDMA FAQPDF, 1.3 Мб, Файл опубликован: 1 сен 2016
This document is a collection of frequently asked questions (FAQs) on enhanced direct memory access (EDMA) on KeyStoneв„ў I (KS1) and KeyStone II (KS2) devices, along with useful collateral and software reference links. - Keystone II DDR3 InitializationPDF, 73 Кб, Файл опубликован: 26 янв 2015
This application report provides a step-to-step initialization guide for the Keystone II device DDR3 SDRAM controller. - Throughput Performance Guide for KeyStone II Devices (Rev. B)PDF, 866 Кб, Версия: B, Файл опубликован: 22 дек 2015
This application report analyzes various performance measurements of the KeyStone II family of processors. It provides a throughput analysis of the various support peripherals to different end-points and memory access. - Keystone II DDR3 Debug GuidePDF, 143 Кб, Файл опубликован: 16 окт 2015
This guide provides tools for use when debugging a failing DDR3 interface on a KeyStone II device. - Power Management of KS2 Device (Rev. C)PDF, 61 Кб, Версия: C, Файл опубликован: 15 июл 2016
This application report lists the steps to enable Class 0 Temperature Compensation (Class 0 TC) mode of SmartReflexв„ў Subsystem (SRSS) module available on such devices. - Hardware Design Guide for KeyStone II DevicesPDF, 1.8 Мб, Файл опубликован: 24 мар 2014
- Keystone NDK FAQPDF, 54 Кб, Файл опубликован: 3 окт 2016
This document is a collection of frequently asked questions (FAQ) on running the NDK examples on the KeyStoneв„ў family of devices. - SERDES Link Commissioning on KeyStone I and II DevicesPDF, 138 Кб, Файл опубликован: 13 апр 2016
The serializer-deserializer (SerDes) performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial conversion on data received from the CPU. This application report explains the SerDes transmit and receive parameters tuning, tools and some debug techniques for TI Keystone I and Keystone II devices. - PCIe Use Cases for KeyStone DevicesPDF, 320 Кб, Файл опубликован: 13 дек 2011
- Optimizing Loops on the C66x DSPPDF, 585 Кб, Файл опубликован: 9 ноя 2010
- Clocking Design Guide for KeyStone DevicesPDF, 1.5 Мб, Файл опубликован: 9 ноя 2010
- The C6000 Embedded Application Binary Interface Migration Guide (Rev. A)PDF, 20 Кб, Версия: A, Файл опубликован: 10 ноя 2010
The C6000 compiler tools support a new ELF-based ABI named EABI. Prior to this time, the compiler only supported a single ABI, which is now named COFF ABI. The following compelling best-in-class features are available under the C6000 EABI:GeneralZero-init globals: “int gvar;” gets set to 0 before main runs.Dynamic linking: Add code to a running system.Native ROM - DDR3 Design Requirements for KeyStone Devices (Rev. B)PDF, 582 Кб, Версия: B, Файл опубликован: 5 июн 2014
- Multicore Programming Guide (Rev. B)PDF, 1.8 Мб, Версия: B, Файл опубликован: 29 авг 2012
As application complexity continues to grow, we have reached a limit on increasing performance by merely scaling clock speed. To meet the ever-increasing processing demand, modern System-On-Chip solutions contain multiple processing cores. The dilemma is how to map applications to multicore devices. In this paper, we present a programming methodology for converting applications to run on multicore - TI DSP BenchmarkingPDF, 62 Кб, Файл опубликован: 13 янв 2016
This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms. - Thermal Design Guide for DSP and ARM Application Processors (Rev. A)PDF, 324 Кб, Версия: A, Файл опубликован: 17 авг 2016
This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
Модельный ряд
Серия: 66AK2H12 (10)
Классификация производителя
- Semiconductors> Processors> Digital Signal Processors> C6000 DSP + ARM Processors> 66AK2x