Datasheet Texas Instruments 66AK2H14 — Даташит

Производитель	Texas Instruments
Серия	66AK2H14

Datasheets

Цены

Купить 66AK2H14 на РадиоЛоцман.Цены — от 65 до 272 165 ₽ 10 предложений от 10 поставщиков Цифровой сигнальный процессор DSP, DSP Fixed-Point/Floating-Point 32Bit 1200MHz/1400MHz 19600MIPS 1517Pin FCBGA
ЧипСити Россия	66AK2H14BAAW24 Texas Instruments	51 543 ₽	Купить
Maybo Весь мир	66AK2H14DXAAWA24 Texas Instruments	102 917 ₽	Купить
Элитан Россия	66AK2H14DXAAWA24 Texas Instruments	272 165 ₽	Купить
ЗУМ-СМД Россия	66AK2H14AAW Texas Instruments	по запросу	Купить

Статус

Корпус / Упаковка / Маркировка

Параметры

Parameters / Models	66AK2H14BAAW24	66AK2H14BAAWA24	66AK2H14BXAAW24	66AK2H14DAAW24	66AK2H14DAAWA24	66AK2H14DXAAWA24
ARM CPU	4 ARM Cortex-A15	4 ARM Cortex-A15	4 ARM Cortex-A15	4 ARM Cortex-A15	4 ARM Cortex-A15	4 ARM Cortex-A15
ARM MHz, Max.	1200,1400	1200,1400	1200,1400	1200,1400	1200,1400	1200,1400
Applications	Automation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space	Automation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space	Automation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space	Automation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space	Automation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space	Automation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space
DRAM	DDR3,DDR3L	DDR3,DDR3L	DDR3,DDR3L	DDR3,DDR3L	DDR3,DDR3L	DDR3,DDR3L
DSP	8 C66x	8 C66x	8 C66x	8 C66x	8 C66x	8 C66x
DSP MHz, Max.	1200	1200	1200	1200	1200	1200
EMAC	10G Ethernet	10G Ethernet	10G Ethernet	10G Ethernet	10G Ethernet	10G Ethernet
Hardware Accelerators	Packet Accelerator,Security Accelerator	Packet Accelerator,Security Accelerator	Packet Accelerator,Security Accelerator	Packet Accelerator,Security Accelerator	Packet Accelerator,Security Accelerator	Packet Accelerator,Security Accelerator
I2C	3	3	3	3	3	3
On-Chip L2 Cache	4096 KB (ARM Cluster),1024 KB (per C66x DSP core)	4096 KB (ARM Cluster),1024 KB (per C66x DSP core)	4096 KB (ARM Cluster),1024 KB (per C66x DSP core)	4096 KB (ARM Cluster),1024 KB (per C66x DSP core)	4096 KB (ARM Cluster),1024 KB (per C66x DSP core)	4096 KB (ARM Cluster),1024 KB (per C66x DSP core)
Operating Systems	Integrity,Linux,SYS/BIOS,VxWorks	Integrity,Linux,SYS/BIOS,VxWorks	Integrity,Linux,SYS/BIOS,VxWorks	Integrity,Linux,SYS/BIOS,VxWorks	Integrity,Linux,SYS/BIOS,VxWorks	Integrity,Linux,SYS/BIOS,VxWorks
Рабочий диапазон температур, C	от -40 до 100,0 до 85	от -40 до 100,0 до 85	от -40 до 100,0 до 85	от -40 до 100,0 до 85	от -40 до 100,0 до 85	от -40 до 100,0 до 85
Other On-Chip Memory	6144 KB	6144 KB	6144 KB	6144 KB	6144 KB	6144 KB
PCI/PCIe	2 PCIe Gen2	2 PCIe Gen2	2 PCIe Gen2	2 PCIe Gen2	2 PCIe Gen2	2 PCIe Gen2
Rating	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog
SPI	3	3	3	3	3	3
UART, SCI	2	2	2	2	2	2
USB	1	1	1	1	1	1

Экологический статус

Application Notes

• Скачать
  PCI Express (PCIe) Resource Wiki for Keystone Devices (Rev. A)
  PDF, 57 Кб, Версия: A, Файл опубликован: 19 май 2017
• Скачать
  Keystone II DDR3 Initialization
  PDF, 73 Кб, Файл опубликован: 26 янв 2015
  This application report provides a step-to-step initialization guide for the Keystone II device DDR3 SDRAM controller.
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  Throughput Performance Guide for KeyStone II Devices (Rev. B)
  PDF, 866 Кб, Версия: B, Файл опубликован: 22 дек 2015
  This application report analyzes various performance measurements of the KeyStone II family of processors. It provides a throughput analysis of the various support peripherals to different end-points and memory access.
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  Keystone II DDR3 Debug Guide
  PDF, 143 Кб, Файл опубликован: 16 окт 2015
  This guide provides tools for use when debugging a failing DDR3 interface on a KeyStone II device.
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  Power Management of KS2 Device (Rev. C)
  PDF, 61 Кб, Версия: C, Файл опубликован: 15 июл 2016
  This application report lists the steps to enable Class 0 Temperature Compensation (Class 0 TC) mode of SmartReflexв„ў Subsystem (SRSS) module available on such devices.
• Скачать
  Hardware Design Guide for KeyStone II Devices
  PDF, 1.8 Мб, Файл опубликован: 24 мар 2014
• Скачать
  SERDES Link Commissioning on KeyStone I and II Devices
  PDF, 138 Кб, Файл опубликован: 13 апр 2016
  The serializer-deserializer (SerDes) performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial conversion on data received from the CPU. This application report explains the SerDes transmit and receive parameters tuning, tools and some debug techniques for TI Keystone I and Keystone II devices.
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  PCIe Use Cases for KeyStone Devices
  PDF, 320 Кб, Файл опубликован: 13 дек 2011
• Скачать
  The C6000 Embedded Application Binary Interface Migration Guide (Rev. A)
  PDF, 20 Кб, Версия: A, Файл опубликован: 10 ноя 2010
  The C6000 compiler tools support a new ELF-based ABI named EABI. Prior to this time, the compiler only supported a single ABI, which is now named COFF ABI. The following compelling best-in-class features are available under the C6000 EABI:GeneralZero-init globals: “int gvar;” gets set to 0 before main runs.Dynamic linking: Add code to a running system.Native ROM
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  Clocking Design Guide for KeyStone Devices
  PDF, 1.5 Мб, Файл опубликован: 9 ноя 2010
• Скачать
  Optimizing Loops on the C66x DSP
  PDF, 585 Кб, Файл опубликован: 9 ноя 2010
• Скачать
  DDR3 Design Requirements for KeyStone Devices (Rev. B)
  PDF, 582 Кб, Версия: B, Файл опубликован: 5 июн 2014
• Скачать
  Multicore Programming Guide (Rev. B)
  PDF, 1.8 Мб, Версия: B, Файл опубликован: 29 авг 2012
  As application complexity continues to grow, we have reached a limit on increasing performance by merely scaling clock speed. To meet the ever-increasing processing demand, modern System-On-Chip solutions contain multiple processing cores. The dilemma is how to map applications to multicore devices. In this paper, we present a programming methodology for converting applications to run on multicore
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  TI DSP Benchmarking
  PDF, 62 Кб, Файл опубликован: 13 янв 2016
  This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.
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  Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
  PDF, 324 Кб, Версия: A, Файл опубликован: 17 авг 2016
  This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require

Модельный ряд

Классификация производителя

• Semiconductors> Processors> Digital Signal Processors> C6000 DSP + ARM Processors> 66AK2x