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Datasheet Texas Instruments 66AK2L06 — Даташит

ПроизводительTexas Instruments
Серия66AK2L06
Datasheet Texas Instruments 66AK2L06

Многоядерная однокристальная система DSP+ARM KeyStone II (SoC)

Datasheets

66AK2L06 Multicore DSP+ARM KeyStone II System-on-Chip (SoC) datasheet
PDF, 1.9 Мб, Файл опубликован: 21 апр 2015
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Статус

66AK2L06XCMS66AK2L06XCMS266AK2L06XCMSA66AK2L06XCMSA2
Статус продуктаВ производствеВ производствеВ производствеВ производстве
Доступность образцов у производителяДаДаДаДа

Корпус / Упаковка / Маркировка

66AK2L06XCMS66AK2L06XCMS266AK2L06XCMSA66AK2L06XCMSA2
N1234
Pin900900900900
Package TypeCMSCMSCMSCMS
Package QTY44444444
Маркировка66AK2L06XCMS66AK2L06XCMSA1GHZ@2013
Width (мм)25252525
Length (мм)25252525
Thickness (мм)2.982.982.982.98
Mechanical DataСкачатьСкачатьСкачатьСкачать

Параметры

Parameters / Models66AK2L06XCMS
66AK2L06XCMS
66AK2L06XCMS2
66AK2L06XCMS2
66AK2L06XCMSA
66AK2L06XCMSA
66AK2L06XCMSA2
66AK2L06XCMSA2
ARM CPU2 ARM Cortex-A152 ARM Cortex-A152 ARM Cortex-A152 ARM Cortex-A15
ARM MHz, Max.1200120012001200
ApplicationsAvionics and Defense,Medical,Test and MeasurementAvionics and Defense,Medical,Test and MeasurementAvionics and Defense,Medical,Test and MeasurementAvionics and Defense,Medical,Test and Measurement
DRAMDDR3,DDR3LDDR3,DDR3LDDR3,DDR3LDDR3,DDR3L
DSP4 C66x4 C66x4 C66x4 C66x
DSP MHz, Max.1200120012001200
EMAC4-port 1Gb Switch4-port 1Gb Switch4-port 1Gb Switch4-port 1Gb Switch
Hardware AcceleratorsFFT Coprocessor,Digital Front EndFFT Coprocessor,Digital Front EndFFT Coprocessor,Digital Front EndFFT Coprocessor,Digital Front End
I2C3333
JESD204B4 Lanes4 Lanes4 Lanes4 Lanes
On-Chip L2 Cache1024 KB (ARM Cluster),1024 KB (per C66x DSP core)1024 KB (ARM Cluster),1024 KB (per C66x DSP core)1024 KB (ARM Cluster),1024 KB (per C66x DSP core)1024 KB (ARM Cluster),1024 KB (per C66x DSP core)
Operating SystemsIntegrity,Linux,SYS/BIOS,VxWorksIntegrity,Linux,SYS/BIOS,VxWorksIntegrity,Linux,SYS/BIOS,VxWorksIntegrity,Linux,SYS/BIOS,VxWorks
Рабочий диапазон температур, Cот -40 до 100,0 до 100от -40 до 100,0 до 100от -40 до 100,0 до 100от -40 до 100,0 до 100
Other On-Chip Memory3072 KB3072 KB3072 KB3072 KB
PCI/PCIe2 PCIe Gen22 PCIe Gen22 PCIe Gen22 PCIe Gen2
RatingCatalogCatalogCatalogCatalog
SPI3333
UART, SCI4444
USB1111

Экологический статус

66AK2L06XCMS66AK2L06XCMS266AK2L06XCMSA66AK2L06XCMSA2
RoHSСовместимСовместимСовместимСовместим

Application Notes

  • TPS544Bxx/TPS544Cxx Powering TCI6630K2L in Smart Reflex Class 0 TC Mode
    PDF, 154 Кб, Файл опубликован: 18 сен 2015
    This application report describes an application circuit example of the TPS544B/Cxx family of power management IC (PMIC) powering the Smart-Reflex digital core supply of the TCI6630K2L SoC. Smart-Reflex Class 0 Temperature Compensation (Class 0 TC) mode of operation of the TCI6630K2L device is emphasized. Assumption is that temperature compensation mode is enabled using the function provided in th
  • 66AK2L06 JESD Attach to ADC12J4000/DAC38J84 Getting Started Guide (Rev. B)
    PDF, 8.8 Мб, Версия: B, Файл опубликован: 20 июн 2016
  • Keystone EDMA FAQ
    PDF, 1.3 Мб, Файл опубликован: 1 сен 2016
    This document is a collection of frequently asked questions (FAQs) on enhanced direct memory access (EDMA) on KeyStoneв„ў I (KS1) and KeyStone II (KS2) devices, along with useful collateral and software reference links.
  • System solution for avionics & defense
    PDF, 1.2 Мб, Файл опубликован: 23 сен 2015
  • Keystone II DDR3 Initialization
    PDF, 73 Кб, Файл опубликован: 26 янв 2015
    This application report provides a step-to-step initialization guide for the Keystone II device DDR3 SDRAM controller.
  • Power Management of KS2 Device (Rev. C)
    PDF, 61 Кб, Версия: C, Файл опубликован: 15 июл 2016
    This application report lists the steps to enable Class 0 Temperature Compensation (Class 0 TC) mode of SmartReflexв„ў Subsystem (SRSS) module available on such devices.
  • Throughput Performance Guide for KeyStone II Devices (Rev. B)
    PDF, 866 Кб, Версия: B, Файл опубликован: 22 дек 2015
    This application report analyzes various performance measurements of the KeyStone II family of processors. It provides a throughput analysis of the various support peripherals to different end-points and memory access.
  • Keystone II DDR3 Debug Guide
    PDF, 143 Кб, Файл опубликован: 16 окт 2015
    This guide provides tools for use when debugging a failing DDR3 interface on a KeyStone II device.
  • Hardware Design Guide for KeyStone II Devices
    PDF, 1.8 Мб, Файл опубликован: 24 мар 2014
  • SERDES Link Commissioning on KeyStone I and II Devices
    PDF, 138 Кб, Файл опубликован: 13 апр 2016
    The serializer-deserializer (SerDes) performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial conversion on data received from the CPU. This application report explains the SerDes transmit and receive parameters tuning, tools and some debug techniques for TI Keystone I and Keystone II devices.
  • PCIe Use Cases for KeyStone Devices
    PDF, 320 Кб, Файл опубликован: 13 дек 2011
  • Optimizing Loops on the C66x DSP
    PDF, 585 Кб, Файл опубликован: 9 ноя 2010
  • The C6000 Embedded Application Binary Interface Migration Guide (Rev. A)
    PDF, 20 Кб, Версия: A, Файл опубликован: 10 ноя 2010
    The C6000 compiler tools support a new ELF-based ABI named EABI. Prior to this time, the compiler only supported a single ABI, which is now named COFF ABI. The following compelling best-in-class features are available under the C6000 EABI:GeneralZero-init globals: “int gvar;” gets set to 0 before main runs.Dynamic linking: Add code to a running system.Native ROM
  • Clocking Design Guide for KeyStone Devices
    PDF, 1.5 Мб, Файл опубликован: 9 ноя 2010
  • DDR3 Design Requirements for KeyStone Devices (Rev. B)
    PDF, 582 Кб, Версия: B, Файл опубликован: 5 июн 2014
  • Multicore Programming Guide (Rev. B)
    PDF, 1.8 Мб, Версия: B, Файл опубликован: 29 авг 2012
    As application complexity continues to grow, we have reached a limit on increasing performance by merely scaling clock speed. To meet the ever-increasing processing demand, modern System-On-Chip solutions contain multiple processing cores. The dilemma is how to map applications to multicore devices. In this paper, we present a programming methodology for converting applications to run on multicore
  • TI DSP Benchmarking
    PDF, 62 Кб, Файл опубликован: 13 янв 2016
    This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.
  • Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
    PDF, 324 Кб, Версия: A, Файл опубликован: 17 авг 2016
    This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require

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Классификация производителя

  • Semiconductors> Processors> Digital Signal Processors> C6000 DSP + ARM Processors> 66AK2x

На английском языке: Datasheet Texas Instruments 66AK2L06

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