Datasheet Texas Instruments 74AC11074 — Даташит

Производитель	Texas Instruments
Серия	74AC11074

Datasheets

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Статус

Корпус / Упаковка / Маркировка

Параметры

Parameters / Models	74AC11074D	74AC11074DE4	74AC11074DR	74AC11074DRG4	74AC11074N	74AC11074PWLE	74AC11074PWR
3-State Output	No	No	No	No	No	No	No
Approx. Price (US$)						0.71 | 1ku
Bits	2	2	2	2	2		2
Bits(#)						2
F @ Nom Voltage(Max), Mhz	100	100	100	100	100		100
F @ Nom Voltage(Max)(Mhz)						100
ICC @ Nom Voltage(Max), мА	0.04	0.04	0.04	0.04	0.04		0.04
ICC @ Nom Voltage(Max)(mA)						0.04
Тип входа						CMOS
Рабочий диапазон температур, C	от -40 до 85	от -40 до 85	от -40 до 85	от -40 до 85	от -40 до 85		от -40 до 85
Operating Temperature Range(C)						-40 to 85
Output Drive (IOL/IOH)(Max), мА	24/-24	24/-24	24/-24	24/-24	24/-24		24/-24
Output Drive (IOL/IOH)(Max)(mA)						24/-24
Тип выхода						CMOS
Package Group	SOIC	SOIC	SOIC	SOIC	PDIP	TSSOP	TSSOP
Package Size: mm2:W x L, PKG	14SOIC: 52 mm2: 6 x 8.65(SOIC)	14SOIC: 52 mm2: 6 x 8.65(SOIC)	14SOIC: 52 mm2: 6 x 8.65(SOIC)	14SOIC: 52 mm2: 6 x 8.65(SOIC)	See datasheet (PDIP)		14TSSOP: 32 mm2: 6.4 x 5(TSSOP)
Package Size: mm2:W x L (PKG)						See datasheet (PDIP)
Rating	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog
Schmitt Trigger	No	No	No	No	No	No	No
Technology Family	AC	AC	AC	AC	AC	AC	AC
VCC(Max), В	5.5	5.5	5.5	5.5	5.5		5.5
VCC(Max)(V)						5.5
VCC(Min), В	3	3	3	3	3		3
VCC(Min)(V)						3
Voltage(Nom), В	3.3,5	3.3,5	3.3,5	3.3,5	3.3,5		3.3,5
Voltage(Nom)(V)						3.3 5
tpd @ Nom Voltage(Max), нс	11.4,8.2	11.4,8.2	11.4,8.2	11.4,8.2	11.4,8.2		11.4,8.2
tpd @ Nom Voltage(Max)(ns)						11.4 8.2

Экологический статус

Application Notes

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  Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
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  Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
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  PDF, 89 Кб, Версия: B, Файл опубликован: 1 июн 1997
  Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
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  PDF, 1.7 Мб, Файл опубликован: 1 окт 1996
  This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
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  PDF, 186 Кб, Версия: C, Файл опубликован: 1 июн 1997
  Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
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  Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren
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  Shelf-Life Evaluation of Lead-Free Component Finishes
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  The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a

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• Semiconductors> Logic> Flip-Flop/Latch/Register> D-Type Flip-Flop