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Datasheet Texas Instruments 74AC11244 — Даташит

ПроизводительTexas Instruments
Серия74AC11244
Datasheet Texas Instruments 74AC11244

Octal Buffers/Drivers

Datasheets

Octal Buffer/Driver With 3-State Outputs datasheet
PDF, 788 Кб, Версия: B, Файл опубликован: 15 сен 1998
Выписка из документа

Цены

33 предложений от 21 поставщиков
Буфер / драйвер, неинвертирующий, 3 состояния, 3В до 5.5В, TSSOP-24
Akcel
Весь мир
74AC11244DWR
Texas Instruments
от 38 ₽
ЧипСити
Россия
74AC11244NSR
Texas Instruments
39 ₽
74AC11244DWR
Texas Instruments
76 ₽
Элитан
Россия
74AC11244DW
Texas Instruments
311 ₽
Сравнительное тестирование аккумуляторов EVE Energy и Samsung типоразмера 18650

Статус

74AC11244DBLE74AC11244DBR74AC11244DW74AC11244DWG474AC11244DWR74AC11244PW74AC11244PWLE74AC11244PWR
Статус продуктаСнят с производстваВ производствеВ производствеВ производствеВ производствеВ производствеСнят с производстваВ производстве
Доступность образцов у производителяНетНетНетНетНетНетНетНет

Корпус / Упаковка / Маркировка

74AC11244DBLE74AC11244DBR74AC11244DW74AC11244DWG474AC11244DWR74AC11244PW74AC11244PWLE74AC11244PWR
N12345678
Pin2424242424242424
Package TypeDBDBDWDWDWPWPWPW
Industry STD TermSSOPSSOPSOICSOICSOICTSSOPTSSOPTSSOP
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-G
Width (мм)5.35.37.57.57.54.44.44.4
Length (мм)8.28.215.415.415.47.87.87.8
Thickness (мм)1.951.952.352.352.35111
Pitch (мм).65.651.271.271.27.65.65.65
Max Height (мм)222.652.652.651.21.21.2
Mechanical DataСкачатьСкачатьСкачатьСкачатьСкачатьСкачатьСкачатьСкачать
Package QTY200025252000602000
CarrierLARGE T&RTUBETUBELARGE T&RTUBELARGE T&R
МаркировкаAE244AC11244AC11244AC11244AE244AE244

Параметры

Parameters / Models74AC11244DBLE
74AC11244DBLE
74AC11244DBR
74AC11244DBR
74AC11244DW
74AC11244DW
74AC11244DWG4
74AC11244DWG4
74AC11244DWR
74AC11244DWR
74AC11244PW
74AC11244PW
74AC11244PWLE
74AC11244PWLE
74AC11244PWR
74AC11244PWR
Approx. Price (US$)1.24 | 1ku1.24 | 1ku
Bits888888
Bits(#)88
F @ Nom Voltage(Max), Mhz606060606060
F @ Nom Voltage(Max)(Mhz)6060
ICC @ Nom Voltage(Max), мА0.080.080.080.080.080.08
ICC @ Nom Voltage(Max)(mA)0.080.08
Тип входаCMOSCMOS
Рабочий диапазон температур, Cот -40 до 85от -40 до 85от -40 до 85от -40 до 85от -40 до 85от -40 до 85
Operating Temperature Range(C)-40 to 85-40 to 85
Output Drive (IOL/IOH)(Max), мА-24/24-24/24-24/24-24/24-24/24-24/24
Output Drive (IOL/IOH)(Max)(mA)-24/24-24/24
Тип выходаCMOSCMOS
Package GroupSSOPSSOPSOICSOICSOICTSSOPTSSOPTSSOP
Package Size: mm2:W x L, PKG24SSOP: 64 mm2: 7.8 x 8.2(SSOP)24SOIC: 160 mm2: 10.3 x 15.5(SOIC)24SOIC: 160 mm2: 10.3 x 15.5(SOIC)24SOIC: 160 mm2: 10.3 x 15.5(SOIC)24TSSOP: 50 mm2: 6.4 x 7.8(TSSOP)24TSSOP: 50 mm2: 6.4 x 7.8(TSSOP)
Package Size: mm2:W x L (PKG)See datasheet (PDIP)See datasheet (PDIP)
RatingCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalog
Schmitt TriggerNoNoNoNoNoNoNoNo
Technology FamilyACACACACACACACAC
VCC(Max), В5.55.55.55.55.55.5
VCC(Max)(V)5.55.5
VCC(Min), В333333
VCC(Min)(V)33
Voltage(Nom), В555555
Voltage(Nom)(V)55
tpd @ Nom Voltage(Max), нс7.37.37.37.37.37.3
tpd @ Nom Voltage(Max)(ns)7.37.3

Экологический статус

74AC11244DBLE74AC11244DBR74AC11244DW74AC11244DWG474AC11244DWR74AC11244PW74AC11244PWLE74AC11244PWR
RoHSНе совместимСовместимСовместимСовместимСовместимСовместимНе совместимСовместим
Бессвинцовая технология (Pb Free)НетНет

Application Notes

  • Live Insertion
    PDF, 150 Кб, Файл опубликован: 1 окт 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Introduction to Logic
    PDF, 93 Кб, Файл опубликован: 30 апр 2015
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Кб, Версия: D, Файл опубликован: 23 июн 2016
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Кб, Версия: C, Файл опубликован: 2 дек 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Кб, Файл опубликован: 8 июл 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Кб, Файл опубликован: 29 авг 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Кб, Версия: B, Файл опубликован: 1 июн 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Мб, Файл опубликован: 1 окт 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • Designing With Logic (Rev. C)
    PDF, 186 Кб, Версия: C, Файл опубликован: 1 июн 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
    PDF, 43 Кб, Файл опубликован: 1 апр 1996
    Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren
  • Shelf-Life Evaluation of Lead-Free Component Finishes
    PDF, 1.3 Мб, Файл опубликован: 24 май 2004
    The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a

Модельный ряд

Классификация производителя

  • Semiconductors> Logic> Buffer/Driver/Transceiver> Non-Inverting Buffer/Driver

На английском языке: Datasheet Texas Instruments 74AC11244

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