Datasheet Texas Instruments 74ACT11257 — Даташит

Производитель	Texas Instruments
Серия	74ACT11257

Datasheets

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Статус

Корпус / Упаковка / Маркировка

Параметры

Parameters / Models	74ACT11257DW	74ACT11257DWR	74ACT11257PW
Полоса частот, МГц	100	100	100
Bits	2	2	2
Количество каналов	4	4	4
Configuration	2:1	2:1	2:1
Digital input leakage(Max), uA	5	5	5
ESD Charged Device Model, kV	0.75	0.75	0.75
ESD HBM, kV	2	2	2
F @ Nom Voltage(Max), Mhz	90	90	90
Function	Encoder/Multiplexer	Encoder/Multiplexer	Encoder/Multiplexer
ICC @ Nom Voltage(Max), мА	0.08	0.08	0.08
Рабочий диапазон температур, C	от -40 до 85	от -40 до 85	от -40 до 85
Output Drive (IOL/IOH)(Max), мА	24/-24	24/-24	24/-24
Package Group	SOIC	SOIC	TSSOP
Package Size: mm2:W x L, PKG	20SOIC: 132 mm2: 10.3 x 12.8(SOIC)	20SOIC: 132 mm2: 10.3 x 12.8(SOIC)	20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP)
Rating	Catalog	Catalog	Catalog
Schmitt Trigger	No	No	No
Technology Family	ACT	ACT	ACT
Тип	3-State Output	3-State Output	3-State Output
VCC(Max), В	5.5	5.5	5.5
VCC(Min), В	4.5	4.5	4.5
Voltage(Nom), В	5	5	5
tpd @ Nom Voltage(Max), нс	8	8	8

Экологический статус

Application Notes

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  Selecting the Right Level Translation Solution (Rev. A)
  PDF, 313 Кб, Версия: A, Файл опубликован: 22 июн 2004
  Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
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  Introduction to Logic
  PDF, 93 Кб, Файл опубликован: 30 апр 2015
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  Implications of Slow or Floating CMOS Inputs (Rev. D)
  PDF, 260 Кб, Версия: D, Файл опубликован: 23 июн 2016
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  Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
  PDF, 614 Кб, Версия: C, Файл опубликован: 2 дек 2015
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  Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
  PDF, 337 Кб, Файл опубликован: 8 июл 2004
  Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
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  TI IBIS File Creation Validation and Distribution Processes
  PDF, 380 Кб, Файл опубликован: 29 авг 2002
  The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
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  CMOS Power Consumption and CPD Calculation (Rev. B)
  PDF, 89 Кб, Версия: B, Файл опубликован: 1 июн 1997
  Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
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  Designing With Logic (Rev. C)
  PDF, 186 Кб, Версия: C, Файл опубликован: 1 июн 1997
  Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
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  Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
  PDF, 43 Кб, Файл опубликован: 1 апр 1996
  Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren

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• Semiconductors> Switches and Multiplexers> Buffered Encoders and Decoders