Datasheet Texas Instruments AM3351 — Даташит

Производитель	Texas Instruments
Серия	AM3351

Datasheets

Статус

Корпус / Упаковка / Маркировка

Параметры

Parameters / Models	AM3351BZCE30	AM3351BZCE30R	AM3351BZCE60	AM3351BZCE60R	AM3351BZCEA30	AM3351BZCEA60
ARM CPU	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8
ARM MHz, Max.	300,600	300,600	300,600	300,600	300,600	300,600
Applications	Automotive,Industrial,Personal Electronics	Automotive,Industrial,Personal Electronics	Automotive,Industrial,Personal Electronics	Automotive,Industrial,Personal Electronics	Automotive,Industrial,Personal Electronics	Automotive,Industrial,Personal Electronics
Co-Processor, s	N/A	N/A	N/A	N/A	N/A	N/A
DMIPS	600,1200	600,1200	600,1200	600,1200	600,1200	600,1200
DRAM	DDR2,DDR3,DDR3L,LPDDR	DDR2,DDR3,DDR3L,LPDDR	DDR2,DDR3,DDR3L,LPDDR	DDR2,DDR3,DDR3L,LPDDR	DDR2,DDR3,DDR3L,LPDDR	DDR2,DDR3,DDR3L,LPDDR
Display Outputs	1	1	1	1	1	1
EMAC	10/100/1000	10/100/1000	10/100/1000	10/100/1000	10/100/1000	10/100/1000
On-Chip L2 Cache	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)
Operating Systems	Android,Linux,Windows Embedded CE	Android,Linux,Windows Embedded CE	Android,Linux,Windows Embedded CE	Android,Linux,Windows Embedded CE	Android,Linux,Windows Embedded CE	Android,Linux,Windows Embedded CE
Рабочий диапазон температур, C	от -40 до 105,0 до 90	от -40 до 105,0 до 90	от -40 до 105,0 до 90	от -40 до 105,0 до 90	от -40 до 105,0 до 90	от -40 до 105,0 до 90
Other On-Chip Memory	128 KB	128 KB	128 KB	128 KB	128 KB	128 KB
Rating	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog
Security Enabler	Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment
Serial I/O	I2C,SPI,UART,USB	I2C,SPI,UART,USB	I2C,SPI,UART,USB	I2C,SPI,UART,USB	I2C,SPI,UART,USB	I2C,SPI,UART,USB

Экологический статус

Application Notes

• Скачать
  AM335x Low Power Design Guide (Rev. A)
  PDF, 300 Кб, Версия: A, Файл опубликован: 28 фев 2017
  This document discusses techniques to develop a low power, low cost system based on the AM335x series processor. The goal is to explain how system design choices affect power consumption and how power consumption can vary significantly depending on how the developer’s application runs in that system under specific conditions.
• Скачать
  AM335x and AM43xx Sitara Processors USB Layout Guidelines (Rev. A)
  PDF, 76 Кб, Версия: A, Файл опубликован: 21 авг 2014
  This application report discusses best-practice layout guidelines when implementing a universal serial bus (USB).
• Скачать
  Processor SDK RTOS Customization: Modifying Board library to change UART instanc
  PDF, 783 Кб, Файл опубликован: 4 мар 2016
• Скачать
  AM335x Thermal Considerations
  PDF, 16 Кб, Файл опубликован: 15 апр 2013
  This article discusses the thermal considerations of the AM335x devices. It offers guidance on analysis of the processor's thermal performance, suggests improvements for an end system to aid in overcoming some of the existing challenges of producing a good thermal design, and provides real power/thermal data measured with AM335x EVMs for user evaluation.
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  nFBGA Packaging (Rev. B)
  PDF, 3.1 Мб, Версия: B, Файл опубликован: 13 ноя 2015
  This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts.
• Скачать
  0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)
  PDF, 40.5 Мб, Версия: A, Файл опубликован: 9 авг 2015
• Скачать
  Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
  PDF, 324 Кб, Версия: A, Файл опубликован: 17 авг 2016
  This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
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  Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
  PDF, 1.6 Мб, Версия: B, Файл опубликован: 13 авг 2015
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  High-Speed Interface Layout Guidelines (Rev. G)
  PDF, 814 Кб, Версия: G, Файл опубликован: 27 июл 2017
  As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

Модельный ряд

Классификация производителя

• Semiconductors> Processors> Sitara Processors> ARM Cortex-A8> AM335x