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Datasheet Texas Instruments AM3357 — Даташит

ПроизводительTexas Instruments
СерияAM3357
Datasheet Texas Instruments AM3357

Ситара Процессор

Datasheets

AM335x Sitaraв„ў Processors datasheet
PDF, 3.2 Мб, Версия: J, Файл опубликован: 12 апр 2016
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Цены

26 предложений от 19 поставщиков
ARM® Cortex®-A8 Microprocessor IC SitaraTM1 Core, 32-Bit 720MHz 324-NFBGA (15x15)
EIS Components
Весь мир
AM3357BZCZD30
Texas Instruments
1 013 ₽
ЧипСити
Россия
AM3357BZCZD30
Texas Instruments
1 058 ₽
AiPCBA
Весь мир
AM3357BZCZD30
Texas Instruments
1 114 ₽
LifeElectronics
Россия
AM3357BZCZD30
Texas Instruments
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Статус

AM3357BZCZA30AM3357BZCZA60AM3357BZCZA80AM3357BZCZD30AM3357BZCZD60
Статус продуктаВ производствеВ производствеВ производствеВ производствеВ производстве
Доступность образцов у производителяНетДаДаДаНет

Корпус / Упаковка / Маркировка

AM3357BZCZA30AM3357BZCZA60AM3357BZCZA80AM3357BZCZD30AM3357BZCZD60
N12345
Pin324324324324324
Package TypeZCZZCZZCZZCZZCZ
Package QTY126126126126126
МаркировкаAM3357BZCZA30AM3357BZCZA60AM3357BZCZA80AM3357BZCZD30AM3357BZCZD60
Width (мм)1515151515
Length (мм)1515151515
Thickness (мм).9.9.9.9.9
Mechanical DataСкачатьСкачатьСкачатьСкачатьСкачать

Параметры

Parameters / ModelsAM3357BZCZA30
AM3357BZCZA30
AM3357BZCZA60
AM3357BZCZA60
AM3357BZCZA80
AM3357BZCZA80
AM3357BZCZD30
AM3357BZCZD30
AM3357BZCZD60
AM3357BZCZD60
ARM CPU1 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A8
ARM MHz, Max.300,600,800300,600,800300,600,800300,600,800300,600,800
ApplicationsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal Electronics
Co-Processor, s2 PRU-ICSS2 PRU-ICSS2 PRU-ICSS2 PRU-ICSS2 PRU-ICSS
DMIPS600,1200,1600600,1200,1600600,1200,1600600,1200,1600600,1200,1600
DRAMDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDR
Display Outputs11111
EMAC2-Port 10/100 PRU EMAC,2-Port 1Gb Switch2-Port 10/100 PRU EMAC,2-Port 1Gb Switch2-Port 10/100 PRU EMAC,2-Port 1Gb Switch2-Port 10/100 PRU EMAC,2-Port 1Gb Switch2-Port 10/100 PRU EMAC,2-Port 1Gb Switch
Industrial Protocols1588,EtherCAT,EtherNet/IP,Ethernet POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherCAT,EtherNet/IP,Ethernet POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherCAT,EtherNet/IP,Ethernet POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherCAT,EtherNet/IP,Ethernet POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherCAT,EtherNet/IP,Ethernet POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III
On-Chip L2 Cache256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)
Operating SystemsAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE
Рабочий диапазон температур, Cот -40 до 105,-40 до 90от -40 до 105,-40 до 90от -40 до 105,-40 до 90от -40 до 105,-40 до 90от -40 до 105,-40 до 90
Other On-Chip Memory128 KB128 KB128 KB128 KB128 KB
RatingCatalogCatalogCatalogCatalogCatalog
Security EnablerCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment
Serial I/OCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USB

Экологический статус

AM3357BZCZA30AM3357BZCZA60AM3357BZCZA80AM3357BZCZD30AM3357BZCZD60
RoHSСовместимСовместимСовместимСовместимСовместим

Application Notes

  • AM335x Low Power Design Guide (Rev. A)
    PDF, 300 Кб, Версия: A, Файл опубликован: 28 фев 2017
    This document discusses techniques to develop a low power, low cost system based on the AM335x series processor. The goal is to explain how system design choices affect power consumption and how power consumption can vary significantly depending on how the developer’s application runs in that system under specific conditions.
  • AM335x Reliability Considerations in PLC Applications (Rev. A)
    PDF, 112 Кб, Версия: A, Файл опубликован: 27 апр 2017
    Programmable Logic Controllers (PLC) are used as the main control in an automation system with high-reliability expectations and long life in harsh environments. Processors used in these applications require an assessment of performance verses expected power on hours to achieve the optimal performance for the application.
  • Processor SDK RTOS Customization: Modifying Board library to change UART instanc
    PDF, 783 Кб, Файл опубликован: 4 мар 2016
  • AM335x Thermal Considerations
    PDF, 16 Кб, Файл опубликован: 15 апр 2013
    This article discusses the thermal considerations of the AM335x devices. It offers guidance on analysis of the processor's thermal performance, suggests improvements for an end system to aid in overcoming some of the existing challenges of producing a good thermal design, and provides real power/thermal data measured with AM335x EVMs for user evaluation.
  • nFBGA Packaging (Rev. B)
    PDF, 3.1 Мб, Версия: B, Файл опубликован: 13 ноя 2015
    This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts.
  • 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)
    PDF, 40.5 Мб, Версия: A, Файл опубликован: 9 авг 2015
  • Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
    PDF, 324 Кб, Версия: A, Файл опубликован: 17 авг 2016
    This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
  • Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
    PDF, 1.6 Мб, Версия: B, Файл опубликован: 13 авг 2015
  • High-Speed Interface Layout Guidelines (Rev. G)
    PDF, 814 Кб, Версия: G, Файл опубликован: 27 июл 2017
    As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

Модельный ряд

Классификация производителя

  • Semiconductors> Processors> Sitara Processors> ARM Cortex-A8> AM335x

На английском языке: Datasheet Texas Instruments AM3357

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