Datasheet Texas Instruments AM3359 — Даташит
| Производитель | Texas Instruments |
| Серия | AM3359 |
Ситара Процессор
Datasheets
AM335x Sitaraв„ў Processors datasheet
PDF, 3.2 Мб, Версия: J, Файл опубликован: 12 апр 2016
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Цены
 Купить AM3359 на РадиоЛоцман.Цены — от 74 до 20 542 ₽34 предложений от 22 поставщиков ARM® Cortex®-A8 Microprocessor IC SitaraTM1 Core, 32-Bit 300MHz 324-NFBGA (15x15) | |||
| AM3359BZCZD60 Texas Instruments | 74 ₽ | ||
| AM3359ZCZD72 Texas Instruments | 962 ₽ | ||
| AM3359BZCZD30 Texas Instruments | по запросу | ||
| AM3359BZCZD80 Texas Instruments | по запросу | ||
Статус
| AM3359BZCZA80 | |
|---|---|
| Статус продукта | В производстве |
| Доступность образцов у производителя | Нет |
Корпус / Упаковка / Маркировка
| AM3359BZCZA80 | |
|---|---|
| N | 1 |
| Pin | 324 |
| Package Type | ZCZ |
| Package QTY | 126 |
| Маркировка | AM3359BZCZA80 |
| Width (мм) | 15 |
| Length (мм) | 15 |
| Thickness (мм) | .9 |
| Mechanical Data | Скачать |
Параметры
| Parameters / Models | AM3359BZCZA80 |
|---|---|
| ARM CPU | 1 ARM Cortex-A8 |
| ARM MHz, Max. | 800 |
| Applications | Automotive,Industrial,Personal Electronics |
| Co-Processor, s | 2 PRU-ICSS |
| DMIPS | 1600 |
| DRAM | DDR2,DDR3,DDR3L,LPDDR |
| Display Outputs | 1 |
| EMAC | 2-Port 10/100 PRU EMAC,2-Port 1Gb Switch |
| Graphics Acceleration | 1 3D |
| Industrial Protocols | 1588,EtherCAT,EtherNet/IP,Ethernet POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III |
| On-Chip L2 Cache | 256 KB (ARM Cortex-A8) |
| Operating Systems | Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE |
| Рабочий диапазон температур, C | от -40 до 105 |
| Other On-Chip Memory | 128 KB |
| Rating | Catalog |
| Security Enabler | Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment |
| Serial I/O | CAN,I2C,SPI,UART,USB |
Экологический статус
| AM3359BZCZA80 | |
|---|---|
| RoHS | Совместим |
Application Notes
- AM335x Low Power Design Guide (Rev. A)PDF, 300 Кб, Версия: A, Файл опубликован: 28 фев 2017
This document discusses techniques to develop a low power, low cost system based on the AM335x series processor. The goal is to explain how system design choices affect power consumption and how power consumption can vary significantly depending on how the developer’s application runs in that system under specific conditions. - AM335x Reliability Considerations in PLC Applications (Rev. A)PDF, 112 Кб, Версия: A, Файл опубликован: 27 апр 2017
Programmable Logic Controllers (PLC) are used as the main control in an automation system with high-reliability expectations and long life in harsh environments. Processors used in these applications require an assessment of performance verses expected power on hours to achieve the optimal performance for the application. - Processor SDK RTOS Customization: Modifying Board library to change UART instancPDF, 783 Кб, Файл опубликован: 4 мар 2016
- AM335x Thermal ConsiderationsPDF, 16 Кб, Файл опубликован: 15 апр 2013
This article discusses the thermal considerations of the AM335x devices. It offers guidance on analysis of the processor's thermal performance, suggests improvements for an end system to aid in overcoming some of the existing challenges of producing a good thermal design, and provides real power/thermal data measured with AM335x EVMs for user evaluation. - nFBGA Packaging (Rev. B)PDF, 3.1 Мб, Версия: B, Файл опубликован: 13 ноя 2015
This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts. - 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)PDF, 40.5 Мб, Версия: A, Файл опубликован: 9 авг 2015
- Thermal Design Guide for DSP and ARM Application Processors (Rev. A)PDF, 324 Кб, Версия: A, Файл опубликован: 17 авг 2016
This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require - Plastic Ball Grid Array [PBGA] Application Note (Rev. B)PDF, 1.6 Мб, Версия: B, Файл опубликован: 13 авг 2015
- High-Speed Interface Layout Guidelines (Rev. G)PDF, 814 Кб, Версия: G, Файл опубликован: 27 июл 2017
As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.
Модельный ряд
Серия: AM3359 (1)
Классификация производителя
- Semiconductors> Processors> Sitara Processors> ARM Cortex-A8> AM335x
