Datasheet Texas Instruments AM4376 — Даташит

Производитель	Texas Instruments
Серия	AM4376

Datasheets

Цены

Купить AM4376 на РадиоЛоцман.Цены — от 529 до 2 446 ₽ 20 предложений от 13 поставщиков ARM® Cortex®-A9 Microprocessor IC SitaraTM1 Core, 32-Bit 800MHz 491-NFBGA (17x17)
Стандарт СИЗ Россия	AM4376BZDND30 Texas Instruments	529 ₽	Купить
T-electron Россия и страны СНГ	AM4376BZDND30 Texas Instruments	592 ₽	Купить
AiPCBA Весь мир	AM4376BZDND30 Texas Instruments	1 022 ₽	Купить
Acme Chip Весь мир	AM4376BZDNA100 Texas Instruments	по запросу	Купить

Статус

Корпус / Упаковка / Маркировка

Параметры

Parameters / Models	AM4376BZDN100	AM4376BZDN80	AM4376BZDNA100	AM4376BZDNA80	AM4376BZDND100	AM4376BZDND30	AM4376BZDND80
ARM CPU	1 ARM Cortex-A9	1 ARM Cortex-A9	1 ARM Cortex-A9	1 ARM Cortex-A9	1 ARM Cortex-A9	1 ARM Cortex-A9	1 ARM Cortex-A9
ARM MHz, Max.	300,800,1000	300,800,1000	300,800,1000	300,800,1000	300,800,1000	300,800,1000	300,800,1000
Applications	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics
Co-Processor, s	4 PRU-ICSS	4 PRU-ICSS	4 PRU-ICSS	4 PRU-ICSS	4 PRU-ICSS	4 PRU-ICSS	4 PRU-ICSS
DMIPS	750,2000,2500	750,2000,2500	750,2000,2500	750,2000,2500	750,2000,2500	750,2000,2500	750,2000,2500
DRAM	DDR3,DDR3L,LPDDR2	DDR3,DDR3L,LPDDR2	DDR3,DDR3L,LPDDR2	DDR3,DDR3L,LPDDR2	DDR3,DDR3L,LPDDR2	DDR3,DDR3L,LPDDR2	DDR3,DDR3L,LPDDR2
Display Outputs	1	1	1	1	1	1	1
EMAC	2-Port 10/100 PRU EMAC,2-Port 1Gb Switch	2-Port 10/100 PRU EMAC,2-Port 1Gb Switch	2-Port 10/100 PRU EMAC,2-Port 1Gb Switch	2-Port 10/100 PRU EMAC,2-Port 1Gb Switch	2-Port 10/100 PRU EMAC,2-Port 1Gb Switch	2-Port 10/100 PRU EMAC,2-Port 1Gb Switch	2-Port 10/100 PRU EMAC,2-Port 1Gb Switch
Graphics Acceleration	N/A	N/A	N/A	N/A	N/A	N/A	N/A
Industrial Protocols	1588,BiSS,EnDat 2.2,EtherNet/IP,HIPERFACE DSL,PROFIBUS,PROFINET RT/IRT,SERCOS III,Sigma Delta Filter	1588,BiSS,EnDat 2.2,EtherNet/IP,HIPERFACE DSL,PROFIBUS,PROFINET RT/IRT,SERCOS III,Sigma Delta Filter	1588,BiSS,EnDat 2.2,EtherNet/IP,HIPERFACE DSL,PROFIBUS,PROFINET RT/IRT,SERCOS III,Sigma Delta Filter	1588,BiSS,EnDat 2.2,EtherNet/IP,HIPERFACE DSL,PROFIBUS,PROFINET RT/IRT,SERCOS III,Sigma Delta Filter	1588,BiSS,EnDat 2.2,EtherNet/IP,HIPERFACE DSL,PROFIBUS,PROFINET RT/IRT,SERCOS III,Sigma Delta Filter	1588,BiSS,EnDat 2.2,EtherNet/IP,HIPERFACE DSL,PROFIBUS,PROFINET RT/IRT,SERCOS III,Sigma Delta Filter	1588,BiSS,EnDat 2.2,EtherNet/IP,HIPERFACE DSL,PROFIBUS,PROFINET RT/IRT,SERCOS III,Sigma Delta Filter
On-Chip L2 Cache	256 KB (ARM Cortex-A9)	256 KB (ARM Cortex-A9)	256 KB (ARM Cortex-A9)	256 KB (ARM Cortex-A9)	256 KB (ARM Cortex-A9)	256 KB (ARM Cortex-A9)	256 KB (ARM Cortex-A9)
Operating Systems	Android,Integrity,Linux,Neutrino,SYS/BIOS,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,SYS/BIOS,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,SYS/BIOS,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,SYS/BIOS,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,SYS/BIOS,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,SYS/BIOS,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,SYS/BIOS,VxWorks,Windows Embedded CE
Рабочий диапазон температур, C	от -40 до 90,-40 до 105,0 до 90	от -40 до 90,-40 до 105,0 до 90	от -40 до 90,-40 до 105,0 до 90	от -40 до 90,-40 до 105,0 до 90	от -40 до 90,-40 до 105,0 до 90	от -40 до 90,-40 до 105,0 до 90	от -40 до 90,-40 до 105,0 до 90
Other On-Chip Memory	320 KB	320 KB	320 KB	320 KB	320 KB	320 KB	320 KB
Rating	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog
Security Enabler	Cryptographic acceleration,Debug security,Device identity,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Device identity,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Device identity,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Device identity,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Device identity,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Device identity,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Device identity,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment
Serial I/O	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB
Video Input Ports	1	1	1	1	1	1	1

Экологический статус

Application Notes

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  Sitara AM437x DDR-Less System How-To Instructions and Benchmarks (Rev. A)
  PDF, 252 Кб, Версия: A, Файл опубликован: 21 фев 2017
  This application report describes a system running EtherCAT slave with motor control leveraging the rich feature set of the Texas Instruments Sitara AM437x processor. The application on the Sitara AM437x Industrial Development Kit (IDK) EVM is demonstrated by utilizing internal SRAM, QSPI memory and eliminating external DDR completely. Benchmarking data is presented and shows no impact of the syst
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  nFBGA Packaging (Rev. B)
  PDF, 3.1 Мб, Версия: B, Файл опубликован: 13 ноя 2015
  This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts.
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  0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)
  PDF, 40.5 Мб, Версия: A, Файл опубликован: 9 авг 2015
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  Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
  PDF, 324 Кб, Версия: A, Файл опубликован: 17 авг 2016
  This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
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  Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
  PDF, 1.6 Мб, Версия: B, Файл опубликован: 13 авг 2015
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  High-Speed Interface Layout Guidelines (Rev. G)
  PDF, 814 Кб, Версия: G, Файл опубликован: 27 июл 2017
  As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

Модельный ряд

Классификация производителя

• Semiconductors> Processors> Sitara Processors> ARM Cortex-A9> AM437x