Datasheet Texas Instruments AM5706 — Даташит
Производитель | Texas Instruments |
Серия | AM5706 |
Ситара Процессор
Datasheets
AM570x Sitaraв„ў Processors datasheet
PDF, 3.7 Мб, Версия: A, Файл опубликован: 16 фев 2017
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Цены
Купить AM5706 на РадиоЛоцман.Цены — от 443 до 138 495 ₽ 25 предложений от 14 поставщиков Сенсоры, Датчики Солнечные батареи | |||
AM5706BCBDD Texas Instruments | 443 ₽ | ||
AM-5706CAR-DGK-E Panasonic | 1 252 ₽ | ||
AM-5706CAR Panasonic | 1 590 ₽ | ||
AM5706BCBDJA Texas Instruments | от 3 265 ₽ |
Статус
AM5706ACBDJEA | XAM5706ACBDJEA | |
---|---|---|
Статус продукта | Анонсирован | Анонсирован |
Доступность образцов у производителя | Нет | Нет |
Корпус / Упаковка / Маркировка
AM5706ACBDJEA | XAM5706ACBDJEA | |
---|---|---|
N | 1 | 2 |
Pin | 538 | 538 |
Package Type | CBD | CBD |
Width (мм) | 17 | 17 |
Length (мм) | 17 | 17 |
Thickness (мм) | .878 | .878 |
Mechanical Data | Скачать | Скачать |
Package QTY | 1 | |
Carrier | JEDEC TRAY (5+1) |
Параметры
Parameters / Models | AM5706ACBDJEA | XAM5706ACBDJEA |
---|---|---|
ARM CPU | 1 ARM Cortex-A15 | 1 ARM Cortex-A15 |
ARM MHz, Max. | 500,1000 | |
ARM MHz (Max.) | 500 1000 | |
ARM MIPS, Max. | 1750,3500 | |
ARM MIPS(Max.) | 1750 3500 | |
Application | Communications Equipment Enterprise Systems Industrial Personal Electronics | Communications Equipment,Enterprise Systems,Industrial,Personal Electronics |
CAN | 2 | |
CAN(#) | 2 | |
CSI-2 | 1 | 1 |
Co-Processor, s | 2 ARM Cortex-M4,4 PRU-ICSS | |
Co-Processor(s) | 2 ARM Cortex-M4 4 PRU-ICSS | |
DMA, Ch | 64-Ch EDMA | |
DMA(Ch) | 64-Ch EDMA | |
DRAM | DDR3(L) | DDR3,DDR3L |
DSP | 1 C66x | 1 C66x |
DSP MHz, Max. | 500,750 | |
DSP MHz (Max.) | 500 750 | |
EMAC | 10/100/1000 2-Port 1Gb Switch | 10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC |
General Purpose Memory | 1 16-bit (GPMC NAND flash NOR Flash SRAM) | 1 16-bit (GPMC, NAND flash,NOR Flash,SRAM) |
I2C | 5 | 5 |
IO Supply, В | 1.8,3.3 | |
IO Supply(V) | 1.8 3.3 | |
Industrial Protocols | 1588 EtherCAT EtherNet/IP POWERLINK PROFIBUS PROFINET RT/IRT SERCOS III | 1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III |
MMC/SD | 4 | 4 |
McASP | 8 | 8 |
On-Chip L1 Cache | 32 KB (ARM Cortex-A15) 32 KB (C66x) | 32KB (L1D and L1I ARM Cortex-A15) |
On-Chip L2 Cache | 1 MB w/ECC (ARM Cortex-A15) 288 KB (C66x) | 1 MB w/ECC (ARM Cortex-A15),288 KB (C66x) |
Operating Systems | Android Integrity Linux Nucleus Neutrino TI-RTOS VxWorks Windows Embedded CE | Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE |
Рабочий диапазон температур, C | от -40 до 105 | |
Operating Temperature Range(C) | -40 to 105 | |
Other Hardware Acceleration | Crypto Accelerator | Crypto Accelerator |
Other On-Chip Memory | 512 KB w/ECC | 512 KB w/ECC |
PCI/PCIe | 2 PCIe | 2 PCIe |
PWM, Ch | 3 | |
PWM(Ch) | 3 | |
Package Group | FCBGA | FCBGA |
QSPI | 1 | 1 |
Rating | Catalog | Catalog |
SPI | 4 | 4 |
Security Enabler | Cryptographic Acceleration Debug Security Device Identity External Memory Protection Initial Secure Programming Physical Security Secure Boot Secure Storage Software IP Protection Trusted Execution Environment | |
Serial I/O | CAN I2C SPI UART USB | CAN,I2C,SPI,UART,USB |
UART, SCI | 10 | |
UART(SCI) | 10 | |
USB | 2 | 2 |
USB 2.0 | 1 | 1 |
USB 3.0 | 1 | 1 |
Video Port, Configurable | 4 | |
Video Port (Configurable) | 4 | |
eCAP | 3 | 3 |
eQEP | 3 | 3 |
Экологический статус
AM5706ACBDJEA | XAM5706ACBDJEA | |
---|---|---|
RoHS | Не совместим | Не совместим |
Бессвинцовая технология (Pb Free) | Нет |
Application Notes
- DSPLIB for Processor SDK RTOSPDF, 461 Кб, Файл опубликован: 4 ноя 2016
- IODELAY Application Note for AM57xx Devices (Rev. A)PDF, 785 Кб, Версия: A, Файл опубликован: 3 авг 2017
- Code Composer Studio Device Support PackagePDF, 87 Кб, Файл опубликован: 19 ноя 2015
This document gives a brief description of download location and installation procedures of the device Chip Support Package (CSP) for Code Composer Studioв„ў (CCS). - AM572x/AM571x Compatibility Guide (Rev. C)PDF, 182 Кб, Версия: C, Файл опубликован: 22 фев 2016
This application report provides a summary of the differences between AM572x Silicon Revision 1.1/2.0 and AM571x Silicon Revision 1.0 high-performance ARMВ® devices. - AM57x Processor SDK Linux: Customization of Multicore Application to Run on a NePDF, 55 Кб, Файл опубликован: 6 окт 2016
When customers develop applications that use multiple programmable cores on the AM57x they require a clear understanding of roles and configurations of multiple software (SW) components such as IPC, CMEM, CMA, Linuxв„ў, and SYS/BIOS on slave cores, in order to arrive at correct configuration for their application. This application report describes memory utilization schemes by A15/DSP/IPU, how they - EMIF Tools (Rev. A)PDF, 207 Кб, Версия: A, Файл опубликован: 5 июн 2017
At the center of every application is the need for memory. With limited on-chip processor memory, external memory serves as a solution for large software systems and data storage, and an unstable external memory interface can result in system failures or hinder software development. To prevent potential system level anomalies and ensure robust systems, hardware must be configured correctly and tes - Keystone EDMA FAQPDF, 1.3 Мб, Файл опубликован: 1 сен 2016
This document is a collection of frequently asked questions (FAQs) on enhanced direct memory access (EDMA) on KeyStoneв„ў I (KS1) and KeyStone II (KS2) devices, along with useful collateral and software reference links. - AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)PDF, 2.2 Мб, Версия: A, Файл опубликован: 1 май 2004
Application Note 1281 Bumped Die (Flip Chip) Packages - TI DSP BenchmarkingPDF, 62 Кб, Файл опубликован: 13 янв 2016
This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms. - Thermal Design Guide for DSP and ARM Application Processors (Rev. A)PDF, 324 Кб, Версия: A, Файл опубликован: 17 авг 2016
This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require - Plastic Ball Grid Array [PBGA] Application Note (Rev. B)PDF, 1.6 Мб, Версия: B, Файл опубликован: 13 авг 2015
- High-Speed Interface Layout Guidelines (Rev. G)PDF, 814 Кб, Версия: G, Файл опубликован: 27 июл 2017
As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.
Модельный ряд
Серия: AM5706 (2)
Классификация производителя
- Semiconductors> Processors> Sitara Processors> ARM Cortex-A15> AM57x