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Datasheet Texas Instruments AM5706 — Даташит

ПроизводительTexas Instruments
СерияAM5706

Ситара Процессор

Datasheets

AM570x Sitaraв„ў Processors datasheet
PDF, 3.7 Мб, Версия: A, Файл опубликован: 16 фев 2017
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Цены

25 предложений от 14 поставщиков
Сенсоры, Датчики Солнечные батареи
HXD Co.
Весь мир
AM5706BCBDD
Texas Instruments
443 ₽
ChipWorker
Весь мир
AM-5706CAR-DGK-E
Panasonic
1 252 ₽
ЧипСити
Россия
AM-5706CAR
Panasonic
1 590 ₽
LIXINC Electronics
Весь мир
AM5706BCBDJA
Texas Instruments
от 3 265 ₽

Статус

AM5706ACBDJEAXAM5706ACBDJEA
Статус продуктаАнонсированАнонсирован
Доступность образцов у производителяНетНет

Корпус / Упаковка / Маркировка

AM5706ACBDJEAXAM5706ACBDJEA
N12
Pin538538
Package TypeCBDCBD
Width (мм)1717
Length (мм)1717
Thickness (мм).878.878
Mechanical DataСкачатьСкачать
Package QTY1
CarrierJEDEC TRAY (5+1)

Параметры

Parameters / ModelsAM5706ACBDJEAXAM5706ACBDJEA
XAM5706ACBDJEA
ARM CPU1 ARM Cortex-A151 ARM Cortex-A15
ARM MHz, Max.500,1000
ARM MHz (Max.)500
1000
ARM MIPS, Max.1750,3500
ARM MIPS(Max.)1750
3500
ApplicationCommunications Equipment
Enterprise Systems
Industrial
Personal Electronics
Communications Equipment,Enterprise Systems,Industrial,Personal Electronics
CAN2
CAN(#)2
CSI-211
Co-Processor, s2 ARM Cortex-M4,4 PRU-ICSS
Co-Processor(s)2 ARM Cortex-M4
4 PRU-ICSS
DMA, Ch64-Ch EDMA
DMA(Ch)64-Ch EDMA
DRAMDDR3(L)DDR3,DDR3L
DSP1 C66x1 C66x
DSP MHz, Max.500,750
DSP MHz (Max.)500
750
EMAC10/100/1000
2-Port 1Gb Switch
10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC
General Purpose Memory1 16-bit (GPMC
NAND flash
NOR Flash
SRAM)
1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)
I2C55
IO Supply, В1.8,3.3
IO Supply(V)1.8
3.3
Industrial Protocols1588
EtherCAT
EtherNet/IP
POWERLINK
PROFIBUS
PROFINET RT/IRT
SERCOS III
1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III
MMC/SD44
McASP88
On-Chip L1 Cache32 KB (ARM Cortex-A15)
32 KB (C66x)
32KB (L1D and L1I ARM Cortex-A15)
On-Chip L2 Cache1 MB w/ECC (ARM Cortex-A15)
288 KB (C66x)
1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)
Operating SystemsAndroid
Integrity
Linux
Nucleus
Neutrino
TI-RTOS
VxWorks
Windows Embedded CE
Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE
Рабочий диапазон температур, Cот -40 до 105
Operating Temperature Range(C)-40 to 105
Other Hardware AccelerationCrypto AcceleratorCrypto Accelerator
Other On-Chip Memory512 KB w/ECC512 KB w/ECC
PCI/PCIe2 PCIe2 PCIe
PWM, Ch3
PWM(Ch)3
Package GroupFCBGAFCBGA
QSPI11
RatingCatalogCatalog
SPI44
Security EnablerCryptographic Acceleration
Debug Security
Device Identity
External Memory Protection
Initial Secure Programming
Physical Security
Secure Boot
Secure Storage
Software IP Protection
Trusted Execution Environment
Serial I/OCAN
I2C
SPI
UART
USB
CAN,I2C,SPI,UART,USB
UART, SCI10
UART(SCI)10
USB22
USB 2.011
USB 3.011
Video Port, Configurable4
Video Port (Configurable)4
eCAP33
eQEP33

Экологический статус

AM5706ACBDJEAXAM5706ACBDJEA
RoHSНе совместимНе совместим
Бессвинцовая технология (Pb Free)Нет

Application Notes

  • DSPLIB for Processor SDK RTOS
    PDF, 461 Кб, Файл опубликован: 4 ноя 2016
  • IODELAY Application Note for AM57xx Devices (Rev. A)
    PDF, 785 Кб, Версия: A, Файл опубликован: 3 авг 2017
  • Code Composer Studio Device Support Package
    PDF, 87 Кб, Файл опубликован: 19 ноя 2015
    This document gives a brief description of download location and installation procedures of the device Chip Support Package (CSP) for Code Composer Studioв„ў (CCS).
  • AM572x/AM571x Compatibility Guide (Rev. C)
    PDF, 182 Кб, Версия: C, Файл опубликован: 22 фев 2016
    This application report provides a summary of the differences between AM572x Silicon Revision 1.1/2.0 and AM571x Silicon Revision 1.0 high-performance ARMВ® devices.
  • AM57x Processor SDK Linux: Customization of Multicore Application to Run on a Ne
    PDF, 55 Кб, Файл опубликован: 6 окт 2016
    When customers develop applications that use multiple programmable cores on the AM57x they require a clear understanding of roles and configurations of multiple software (SW) components such as IPC, CMEM, CMA, Linuxв„ў, and SYS/BIOS on slave cores, in order to arrive at correct configuration for their application. This application report describes memory utilization schemes by A15/DSP/IPU, how they
  • EMIF Tools (Rev. A)
    PDF, 207 Кб, Версия: A, Файл опубликован: 5 июн 2017
    At the center of every application is the need for memory. With limited on-chip processor memory, external memory serves as a solution for large software systems and data storage, and an unstable external memory interface can result in system failures or hinder software development. To prevent potential system level anomalies and ensure robust systems, hardware must be configured correctly and tes
  • Keystone EDMA FAQ
    PDF, 1.3 Мб, Файл опубликован: 1 сен 2016
    This document is a collection of frequently asked questions (FAQs) on enhanced direct memory access (EDMA) on KeyStoneв„ў I (KS1) and KeyStone II (KS2) devices, along with useful collateral and software reference links.
  • AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)
    PDF, 2.2 Мб, Версия: A, Файл опубликован: 1 май 2004
    Application Note 1281 Bumped Die (Flip Chip) Packages
  • TI DSP Benchmarking
    PDF, 62 Кб, Файл опубликован: 13 янв 2016
    This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.
  • Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
    PDF, 324 Кб, Версия: A, Файл опубликован: 17 авг 2016
    This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
  • Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
    PDF, 1.6 Мб, Версия: B, Файл опубликован: 13 авг 2015
  • High-Speed Interface Layout Guidelines (Rev. G)
    PDF, 814 Кб, Версия: G, Файл опубликован: 27 июл 2017
    As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

Модельный ряд

Серия: AM5706 (2)

Классификация производителя

  • Semiconductors> Processors> Sitara Processors> ARM Cortex-A15> AM57x

На английском языке: Datasheet Texas Instruments AM5706

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