Datasheet Texas Instruments XAM5708ACBDJEA — Даташит
| Производитель | Texas Instruments |
| Серия | AM5708 |
| Модель | XAM5708ACBDJEA |
Datasheets
AM570x Sitaraв„ў Processors datasheet
PDF, 3.7 Мб, Версия: A, Файл опубликован: 16 фев 2017
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Цены
, Sitara Processor | |||
| XAM5708ACBDJEA Texas Instruments | 3 293 ₽ | ||
Статус
| Статус продукта | Анонсирован (Компонент анонсирован, но еще не запущен в серийное производство. Образцы могут быть как доступны, так и нет) |
| Доступность образцов у производителя | Нет |
Корпус / Упаковка / Маркировка
| Pin | 538 |
| Package Type | CBD |
| Package QTY | 1 |
| Carrier | JEDEC TRAY (5+1) |
| Width (мм) | 17 |
| Length (мм) | 17 |
| Thickness (мм) | .878 |
| Mechanical Data | Скачать |
Параметры
| ARM CPU | 1 ARM Cortex-A15 |
| ARM MHz | 1000 Max. |
| ARM MIPS | 3500 Max. |
| Application | Communications Equipment,Enterprise Systems,Industrial,Personal Electronics |
| CAN | 2 |
| CSI-2 | 1 |
| Co-Processor | 2 ARM Cortex-M4,4 PRU-ICSS s |
| DMA | 64-Ch EDMA Ch |
| DRAM | DDR3,DDR3L |
| DSP | 1 C66x |
| DSP MHz | 750 Max. |
| Display Options | 1 HDMI out,2 LCD out |
| EMAC | 10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC |
| General Purpose Memory | 1 16-bit (GPMC, NAND flash,NOR Flash,SRAM) |
| Graphics Acceleration | 1 3D,1 2D |
| HDMI | 1 |
| I2C | 5 |
| IO Supply | 1.8,3.3 В |
| Industrial Protocols | 1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III |
| LCD | 2 |
| MMC/SD | 4 |
| McASP | 8 |
| On-Chip L1 Cache | 32KB (L1D and L1I ARM Cortex-A15) |
| On-Chip L2 Cache | 1 MB w/ECC (ARM Cortex-A15),288 KB (C66x) |
| Operating Systems | Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE |
| Рабочий диапазон температур | от -40 до 105 C |
| Other Hardware Acceleration | Crypto Accelerator |
| Other On-Chip Memory | 512 KB w/ECC |
| PCI/PCIe | 2 PCIe |
| PWM | 3 Ch |
| Package Group | FCBGA |
| QSPI | 1 |
| Rating | Catalog |
| SPI | 4 |
| Serial I/O | CAN,I2C,SPI,UART,USB |
| UART | 10 SCI |
| USB | 2 |
| USB 2.0 | 1 |
| USB 3.0 | 1 |
| Video Port | 4 Configurable |
| Video Resolution/Frame Rate | 1080p60 |
| eCAP | 3 |
| eQEP | 3 |
Экологический статус
| RoHS | See ti.com |
Комплекты разработчика и оценочные наборы
- Development Kits: TMDXIDK5718
AM571x Industrial Development Kit (IDK)
Статус продукта: В производстве (Рекомендуется для новых разработок) - Evaluation Modules & Boards: TMDSCM572X
TMDSEVM572x Camera Module
Статус продукта: В производстве (Рекомендуется для новых разработок) - Evaluation Modules & Boards: TMDSEVM572X
AM572x Evaluation Module
Статус продукта: В производстве (Рекомендуется для новых разработок) - Development Kits: TMDXIDK57X-LCD
AM57x IDK LCD Kit
Статус продукта: В производстве (Рекомендуется для новых разработок) - JTAG Emulators/ Analyzers: TMDSEMU110-U
XDS110 JTAG Debug Probe
Статус продукта: В производстве (Рекомендуется для новых разработок) - JTAG Emulators/ Analyzers: TMDSEMU110-ETH
XDS110 EnergyTraceв„ў High Dynamic Range (ETHDR) Debug Probe Add-On
Статус продукта: Анонсирован (Компонент анонсирован, но еще не запущен в серийное производство. Образцы могут быть как доступны, так и нет)
Application Notes
- AM571x Power Consumption SummaryPDF, 70 Кб, Файл опубликован: 27 мар 2017
This application report discusses the power consumption for common system application usage scenarios for the AM571x Sitaraв„ў processors. The metrics contained in this document serve to provide users with a better understanding of AM571x active power behaviors: making it easier to determine a suitable configuration to meet a given power budget. - DSPLIB for Processor SDK RTOSPDF, 461 Кб, Файл опубликован: 4 ноя 2016
- Sitara Processor Power Distribution Networks: Implementation and AnalysisPDF, 6.7 Мб, Файл опубликован: 4 апр 2017
The purpose of a power distribution network (PDN) is primarily to provide clean and reliable power to the active devices on the system. The printed circuit board (PCB) is a critical component of the system-level PDN delivery network. As such, optimal design of the PCB power distribution network is of utmost importance for high performance microprocessors. This application report provides implement - AM572x/AM571x Compatibility Guide (Rev. C)PDF, 182 Кб, Версия: C, Файл опубликован: 22 фев 2016
This application report provides a summary of the differences between AM572x Silicon Revision 1.1/2.0 and AM571x Silicon Revision 1.0 high-performance ARMВ® devices. - Code Composer Studio Device Support PackagePDF, 87 Кб, Файл опубликован: 19 ноя 2015
This document gives a brief description of download location and installation procedures of the device Chip Support Package (CSP) for Code Composer Studioв„ў (CCS). - AM57x Processor SDK Linux: Customization of Multicore Application to Run on a NePDF, 55 Кб, Файл опубликован: 6 окт 2016
When customers develop applications that use multiple programmable cores on the AM57x they require a clear understanding of roles and configurations of multiple software (SW) components such as IPC, CMEM, CMA, Linuxв„ў, and SYS/BIOS on slave cores, in order to arrive at correct configuration for their application. This application report describes memory utilization schemes by A15/DSP/IPU, how they - AM57xx BGA PCB DesignPDF, 69 Кб, Файл опубликован: 25 авг 2017
This application report is designed to help customers understand what is involved with PCB design for AM57xx BGAs. - IODELAY Application Note for AM57xx Devices (Rev. A)PDF, 785 Кб, Версия: A, Файл опубликован: 3 авг 2017
- Keystone EDMA FAQPDF, 1.3 Мб, Файл опубликован: 1 сен 2016
This document is a collection of frequently asked questions (FAQs) on enhanced direct memory access (EDMA) on KeyStoneв„ў I (KS1) and KeyStone II (KS2) devices, along with useful collateral and software reference links. - AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)PDF, 2.2 Мб, Версия: A, Файл опубликован: 1 май 2004
Application Note 1281 Bumped Die (Flip Chip) Packages - PRU-ICSS Migration Guide: AM335x to AM57x (Rev. A)PDF, 71 Кб, Версия: A, Файл опубликован: 13 июл 2017
This software migration guide assists in porting legacy software developed for the Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-CSS) on AM335x to AM57x platforms. - Processor-SDK RTOS Power Management and MeasurementPDF, 78 Кб, Файл опубликован: 2 авг 2017
Processor-SDK RTOS provides out-of-the-box power management examples that empower customers to tailor Sitara processors’ (ARM and DSP) power-performance points per use case. You can configure all supported operating points and run CPU Idle and Dhrystone benchmarking workloads while employing a minimal kernel with real-time assurance. This application report provides an overview of the Processor-SD - PRU-ICSS Feature ComparisonPDF, 29 Кб, Файл опубликован: 5 июн 2017
This application report documents the feature differences between the PRU subsystems available on different TI processors. - TI DSP BenchmarkingPDF, 62 Кб, Файл опубликован: 13 янв 2016
This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms. - Plastic Ball Grid Array [PBGA] Application Note (Rev. B)PDF, 1.6 Мб, Версия: B, Файл опубликован: 13 авг 2015
- High-Speed Interface Layout Guidelines (Rev. G)PDF, 814 Кб, Версия: G, Файл опубликован: 27 июл 2017
As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.
Модельный ряд
Серия: AM5708 (2)
- AM5708ACBDJEA XAM5708ACBDJEA
Классификация производителя
- Semiconductors > Processors > Sitara Processors > ARM Cortex-A15 > AM57x
