Datasheet Texas Instruments AM5716 — Даташит
Производитель | Texas Instruments |
Серия | AM5716 |

Ситара Процессор
Datasheets
AM571x Sitara Processors Silicon Revision 2.0 datasheet
PDF, 4.2 Мб, Версия: F, Файл опубликован: 11 сен 2017
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Цены
![]() 25 предложений от 13 поставщиков SITARA PROCESSOR / MPU AM571x RISC 32bit 28nm 500MHz 760-Pin FCBGA Tray | |||
AM5716AABCX Texas Instruments | 2 764 ₽ | ||
AM5716AABCX Texas Instruments | 2 908 ₽ | ||
AM5716AABCX Texas Instruments | от 7 559 ₽ | ||
AM5716AABCDA Texas Instruments | 9 198 ₽ |
Статус
AM5716AABCD | AM5716AABCDA | AM5716AABCDEA | AM5716AABCX | AM5716AABCXA | AM5716AABCXEA | AM5716AABCXEQ1 | AM5716AABCXQ1 | |
---|---|---|---|---|---|---|---|---|
Статус продукта | В производстве | В производстве | В производстве | В производстве | В производстве | В производстве | В производстве | В производстве |
Доступность образцов у производителя | Да | Да | Да | Да | Да | Да | Нет | Нет |
Корпус / Упаковка / Маркировка
AM5716AABCD | AM5716AABCDA | AM5716AABCDEA | AM5716AABCX | AM5716AABCXA | AM5716AABCXEA | AM5716AABCXEQ1 | AM5716AABCXQ1 | |
---|---|---|---|---|---|---|---|---|
N | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 |
Pin | 760 | 760 | 760 | 760 | 760 | 760 | 760 | 760 |
Package Type | ABC | ABC | ABC | ABC | ABC | ABC | ABC | ABC |
Industry STD Term | FCBGA | FCBGA | FCBGA | FCBGA | FCBGA | FCBGA | FCBGA | FCBGA |
JEDEC Code | S-PBGA-N | S-PBGA-N | S-PBGA-N | S-PBGA-N | S-PBGA-N | S-PBGA-N | S-PBGA-N | S-PBGA-N |
Package QTY | 60 | 60 | 60 | 60 | 60 | 60 | 60 | 60 |
Carrier | EIAJ TRAY (5+1) | EIAJ TRAY (5+1) | EIAJ TRAY (5+1) | EIAJ TRAY (5+1) | EIAJ TRAY (5+1) | EIAJ TRAY (5+1) | EIAJ TRAY (5+1) | EIAJ TRAY (5+1) |
Маркировка | AM5716AABCD | AM5716AABCDA | SITARATM | SITARATM | AM5716AABCXA | AM5716AABCXEA | AM5716AABCXEQ1 | AM5716AABCXQ1 |
Width (мм) | 23 | 23 | 23 | 23 | 23 | 23 | 23 | 23 |
Length (мм) | 23 | 23 | 23 | 23 | 23 | 23 | 23 | 23 |
Thickness (мм) | 2.39 | 2.39 | 2.39 | 2.39 | 2.39 | 2.39 | 2.39 | 2.39 |
Pitch (мм) | .8 | .8 | .8 | .8 | .8 | .8 | .8 | .8 |
Max Height (мм) | 2.96 | 2.96 | 2.96 | 2.96 | 2.96 | 2.96 | 2.96 | 2.96 |
Mechanical Data | Скачать | Скачать | Скачать | Скачать | Скачать | Скачать | Скачать | Скачать |
Параметры
Parameters / Models | AM5716AABCD![]() | AM5716AABCDA![]() | AM5716AABCDEA![]() | AM5716AABCX![]() | AM5716AABCXA![]() | AM5716AABCXEA![]() | AM5716AABCXEQ1![]() | AM5716AABCXQ1![]() |
---|---|---|---|---|---|---|---|---|
ARM CPU | 1 ARM Cortex-A15 | 1 ARM Cortex-A15 | 1 ARM Cortex-A15 | 1 ARM Cortex-A15 | 1 ARM Cortex-A15 | 1 ARM Cortex-A15 | 1 ARM Cortex-A15 | 1 ARM Cortex-A15 |
ARM MHz, Max. | 500,1500 | 500,1500 | 500,1500 | 500,1500 | 500,1500 | 500,1500 | 500,1500 | 500,1500 |
ARM MIPS, Max. | 1750,5250 | 1750,5250 | 1750,5250 | 1750,5250 | 1750,5250 | 1750,5250 | 1750,5250 | 1750,5250 |
Application | Communications Equipment,Enterprise Systems,Industrial,Personal Electronics | Communications Equipment,Enterprise Systems,Industrial,Personal Electronics | Communications Equipment,Enterprise Systems,Industrial,Personal Electronics | Communications Equipment,Enterprise Systems,Industrial,Personal Electronics | Communications Equipment,Enterprise Systems,Industrial,Personal Electronics | Communications Equipment,Enterprise Systems,Industrial,Personal Electronics | Communications Equipment,Enterprise Systems,Industrial,Personal Electronics | Communications Equipment,Enterprise Systems,Industrial,Personal Electronics |
CAN | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
CSI-2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
Co-Processor, s | 2 ARM Cortex-M4,4 PRU-ICSS | 2 ARM Cortex-M4,4 PRU-ICSS | 2 ARM Cortex-M4,4 PRU-ICSS | 2 ARM Cortex-M4,4 PRU-ICSS | 2 ARM Cortex-M4,4 PRU-ICSS | 2 ARM Cortex-M4,4 PRU-ICSS | 2 ARM Cortex-M4,4 PRU-ICSS | 2 ARM Cortex-M4,4 PRU-ICSS |
DMA, Ch | 64-Ch EDMA | 64-Ch EDMA | 64-Ch EDMA | 64-Ch EDMA | 64-Ch EDMA | 64-Ch EDMA | 64-Ch EDMA | 64-Ch EDMA |
DRAM | DDR3,DDR3L | DDR3,DDR3L | DDR3,DDR3L | DDR3,DDR3L | DDR3,DDR3L | DDR3,DDR3L | DDR3,DDR3L | DDR3,DDR3L |
DSP | 1 C66x | 1 C66x | 1 C66x | 1 C66x | 1 C66x | 1 C66x | 1 C66x | 1 C66x |
DSP MHz, Max. | 500,750 | 500,750 | 500,750 | 500,750 | 500,750 | 500,750 | 500,750 | 500,750 |
EMAC | 10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC | 10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC | 10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC | 10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC | 10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC | 10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC | 10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC | 10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC |
General Purpose Memory | 1 16-bit (GPMC, NAND flash,NOR Flash,SRAM) | 1 16-bit (GPMC, NAND flash,NOR Flash,SRAM) | 1 16-bit (GPMC, NAND flash,NOR Flash,SRAM) | 1 16-bit (GPMC, NAND flash,NOR Flash,SRAM) | 1 16-bit (GPMC, NAND flash,NOR Flash,SRAM) | 1 16-bit (GPMC, NAND flash,NOR Flash,SRAM) | 1 16-bit (GPMC, NAND flash,NOR Flash,SRAM) | 1 16-bit (GPMC, NAND flash,NOR Flash,SRAM) |
I2C | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
IO Supply, В | 1.8,3.3 | 1.8,3.3 | 1.8,3.3 | 1.8,3.3 | 1.8,3.3 | 1.8,3.3 | 1.8,3.3 | 1.8,3.3 |
Industrial Protocols | 1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III | 1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III | 1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III | 1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III | 1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III | 1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III | 1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III | 1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III |
MMC/SD | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
McASP | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
On-Chip L1 Cache | 32KB (L1D and L1I ARM Cortex-A15) | 32KB (L1D and L1I ARM Cortex-A15) | 32KB (L1D and L1I ARM Cortex-A15) | 32KB (L1D and L1I ARM Cortex-A15) | 32KB (L1D and L1I ARM Cortex-A15) | 32KB (L1D and L1I ARM Cortex-A15) | 32KB (L1D and L1I ARM Cortex-A15) | 32KB (L1D and L1I ARM Cortex-A15) |
On-Chip L2 Cache | 1 MB w/ECC (ARM Cortex-A15),288 KB (C66x) | 1 MB w/ECC (ARM Cortex-A15),288 KB (C66x) | 1 MB w/ECC (ARM Cortex-A15),288 KB (C66x) | 1 MB w/ECC (ARM Cortex-A15),288 KB (C66x) | 1 MB w/ECC (ARM Cortex-A15),288 KB (C66x) | 1 MB w/ECC (ARM Cortex-A15),288 KB (C66x) | 1 MB w/ECC (ARM Cortex-A15),288 KB (C66x) | 1 MB w/ECC (ARM Cortex-A15),288 KB (C66x) |
Operating Systems | Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE | Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE | Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE | Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE | Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE | Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE | Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE | Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE |
Рабочий диапазон температур, C | от -40 до 105,-40 до 125,0 до 90 | от -40 до 105,-40 до 125,0 до 90 | от -40 до 105,-40 до 125,0 до 90 | от -40 до 105,-40 до 125,0 до 90 | от -40 до 105,-40 до 125,0 до 90 | от -40 до 105,-40 до 125,0 до 90 | от -40 до 105,-40 до 125,0 до 90 | от -40 до 105,-40 до 125,0 до 90 |
Other Hardware Acceleration | Crypto Accelerator | Crypto Accelerator | Crypto Accelerator | Crypto Accelerator | Crypto Accelerator | Crypto Accelerator | Crypto Accelerator | Crypto Accelerator |
Other On-Chip Memory | 512 KB w/ECC | 512 KB w/ECC | 512 KB w/ECC | 512 KB w/ECC | 512 KB w/ECC | 512 KB w/ECC | 512 KB w/ECC | 512 KB w/ECC |
PCI/PCIe | 2 PCIe | 2 PCIe | 2 PCIe | 2 PCIe | 2 PCIe | 2 PCIe | 2 PCIe | 2 PCIe |
PWM, Ch | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
Package Group | FCBGA | FCBGA | FCBGA | FCBGA | FCBGA | FCBGA | FCBGA | FCBGA |
QSPI | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
RTC | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Rating | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog |
SATA | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
SPI | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
Serial I/O | CAN,I2C,SPI,UART,USB | CAN,I2C,SPI,UART,USB | CAN,I2C,SPI,UART,USB | CAN,I2C,SPI,UART,USB | CAN,I2C,SPI,UART,USB | CAN,I2C,SPI,UART,USB | CAN,I2C,SPI,UART,USB | CAN,I2C,SPI,UART,USB |
UART, SCI | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
USB | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
USB 2.0 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
USB 3.0 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Video Port, Configurable | 6+ | 6+ | 6+ | 6+ | 6+ | 6+ | 6+ | 6+ |
eCAP | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
eQEP | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
Экологический статус
AM5716AABCD | AM5716AABCDA | AM5716AABCDEA | AM5716AABCX | AM5716AABCXA | AM5716AABCXEA | AM5716AABCXEQ1 | AM5716AABCXQ1 | |
---|---|---|---|---|---|---|---|---|
RoHS | Совместим | Совместим | Совместим | Совместим | Совместим | Совместим | Совместим | Совместим |
Application Notes
- AM572x GP EVM Power SimulationsPDF, 22.4 Мб, Файл опубликован: 8 окт 2015
The purpose of this application report is to present the flow, the environment settings and TI requirements used to perform the analysis of critical power nets of a platform using an application processor. The Power Delivery Network (PDN) performance is measured by extracting and analyzing three printed circuit board (PCB) parameters: DC resistivity, capacitor loop inductance, and broadband target - IODELAY Application Note for AM57xx Devices (Rev. A)PDF, 785 Кб, Версия: A, Файл опубликован: 3 авг 2017
- EMIF Tools (Rev. A)PDF, 207 Кб, Версия: A, Файл опубликован: 5 июн 2017
At the center of every application is the need for memory. With limited on-chip processor memory, external memory serves as a solution for large software systems and data storage, and an unstable external memory interface can result in system failures or hinder software development. To prevent potential system level anomalies and ensure robust systems, hardware must be configured correctly and tes - Code Composer Studio Device Support PackagePDF, 87 Кб, Файл опубликован: 19 ноя 2015
This document gives a brief description of download location and installation procedures of the device Chip Support Package (CSP) for Code Composer Studioв„ў (CCS). - AM57x Processor SDK Linux: Customization of Multicore Application to Run on a NePDF, 55 Кб, Файл опубликован: 6 окт 2016
When customers develop applications that use multiple programmable cores on the AM57x they require a clear understanding of roles and configurations of multiple software (SW) components such as IPC, CMEM, CMA, Linuxв„ў, and SYS/BIOS on slave cores, in order to arrive at correct configuration for their application. This application report describes memory utilization schemes by A15/DSP/IPU, how they - AM572x/AM571x Compatibility Guide (Rev. C)PDF, 182 Кб, Версия: C, Файл опубликован: 22 фев 2016
This application report provides a summary of the differences between AM572x Silicon Revision 1.1/2.0 and AM571x Silicon Revision 1.0 high-performance ARMВ® devices. - AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)PDF, 2.2 Мб, Версия: A, Файл опубликован: 1 май 2004
Application Note 1281 Bumped Die (Flip Chip) Packages - TI DSP BenchmarkingPDF, 62 Кб, Файл опубликован: 13 янв 2016
This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms. - Thermal Design Guide for DSP and ARM Application Processors (Rev. A)PDF, 324 Кб, Версия: A, Файл опубликован: 17 авг 2016
This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require - Plastic Ball Grid Array [PBGA] Application Note (Rev. B)PDF, 1.6 Мб, Версия: B, Файл опубликован: 13 авг 2015
- High-Speed Interface Layout Guidelines (Rev. G)PDF, 814 Кб, Версия: G, Файл опубликован: 27 июл 2017
As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.
Модельный ряд
Серия: AM5716 (8)
Классификация производителя
- Semiconductors> Processors> Sitara Processors> ARM Cortex-A15> AM57x