Datasheet Texas Instruments DM3725 — Даташит

Производитель	Texas Instruments
Серия	DM3725

Datasheets

Цены

Купить DM3725 на РадиоЛоцман.Цены — от 75 до 6 101 ₽ 23 предложений от 19 поставщиков Процессоры и контроллеры цифровых сигналов (DSP, DSC) Digital Media Proc
EIS Components Весь мир	DM3725CBCD100 Texas Instruments	75 ₽	Купить
Стандарт СИЗ Россия	DM3725CBP Texas Instruments	1 577 ₽	Купить
ЗУМ-СМД Россия	DM3725CUS Texas Instruments	по запросу	Купить
TradeElectronics Россия	DM3725CBP100 Texas Instruments	по запросу	Купить

Статус

Корпус / Упаковка / Маркировка

Параметры

Parameters / Models	DM3725CBC	DM3725CBC100	DM3725CBCA	DM3725CBP	DM3725CBP100	DM3725CBPA	DM3725CBPD100	DM3725CBPDR100	DM3725CUS	DM3725CUS100	DM3725CUSA	DM3725CUSD100
ARM CPU	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8
ARM MHz, Max.	800,1000	800,1000	800,1000	800,1000	800,1000	800,1000	800,1000	800,1000	800,1000	800,1000	800,1000	800,1000
Applications	Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security	Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security	Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security	Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security	Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security	Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security	Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security	Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security	Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security	Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security	Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security	Audio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security
DRAM	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR
DSP	1 C64x	1 C64x	1 C64x	1 C64x	1 C64x	1 C64x	1 C64x	1 C64x	1 C64x	1 C64x	1 C64x	1 C64x
DSP MHz, Max.	660,800	660,800	660,800	660,800	660,800	660,800	660,800	660,800	660,800	660,800	660,800	660,800
I2C	4	4	4	4	4	4	4	4	4	4	4	4
On-Chip L2 Cache	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)
Operating Systems	Android,DSP/BIOS,Neutrino,Integrity,Windows Embedded CE,Linux,VxWorks	Android,DSP/BIOS,Neutrino,Integrity,Windows Embedded CE,Linux,VxWorks	Android,DSP/BIOS,Neutrino,Integrity,Windows Embedded CE,Linux,VxWorks	Android,DSP/BIOS,Neutrino,Integrity,Windows Embedded CE,Linux,VxWorks	Android,DSP/BIOS,Neutrino,Integrity,Windows Embedded CE,Linux,VxWorks	Android,DSP/BIOS,Neutrino,Integrity,Windows Embedded CE,Linux,VxWorks	Android,DSP/BIOS,Neutrino,Integrity,Windows Embedded CE,Linux,VxWorks	Android,DSP/BIOS,Neutrino,Integrity,Windows Embedded CE,Linux,VxWorks	Android,DSP/BIOS,Neutrino,Integrity,Windows Embedded CE,Linux,VxWorks	Android,DSP/BIOS,Neutrino,Integrity,Windows Embedded CE,Linux,VxWorks	Android,DSP/BIOS,Neutrino,Integrity,Windows Embedded CE,Linux,VxWorks	Android,DSP/BIOS,Neutrino,Integrity,Windows Embedded CE,Linux,VxWorks
Рабочий диапазон температур, C	от -40 до 105,-40 до 90,0 до 90	от -40 до 105,-40 до 90,0 до 90	от -40 до 105,-40 до 90,0 до 90	от -40 до 105,-40 до 90,0 до 90	от -40 до 105,-40 до 90,0 до 90	от -40 до 105,-40 до 90,0 до 90	от -40 до 105,-40 до 90,0 до 90	от -40 до 105,-40 до 90,0 до 90	от -40 до 105,-40 до 90,0 до 90	от -40 до 105,-40 до 90,0 до 90	от -40 до 105,-40 до 90,0 до 90	от -40 до 105,-40 до 90,0 до 90
Pin/Package	423FCBGA, 515POP-FCBGA	423FCBGA, 515POP-FCBGA	423FCBGA, 515POP-FCBGA	423FCBGA, 515POP-FCBGA	423FCBGA, 515POP-FCBGA	423FCBGA, 515POP-FCBGA	423FCBGA, 515POP-FCBGA	423FCBGA, 515POP-FCBGA	423FCBGA, 515POP-FCBGA	423FCBGA, 515POP-FCBGA	423FCBGA, 515POP-FCBGA	423FCBGA, 515POP-FCBGA
Rating	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog
SPI	4	4	4	4	4	4	4	4	4	4	4	4
UART, SCI	4	4	4	4	4	4	4	4	4	4	4	4
USB	4	4	4	4	4	4	4	4	4	4	4	4
Video Port, Configurable	1 Dedicated Input,1 Dedicated Output	1 Dedicated Input,1 Dedicated Output	1 Dedicated Input,1 Dedicated Output	1 Dedicated Input,1 Dedicated Output	1 Dedicated Input,1 Dedicated Output	1 Dedicated Input,1 Dedicated Output	1 Dedicated Input,1 Dedicated Output	1 Dedicated Input,1 Dedicated Output	1 Dedicated Input,1 Dedicated Output	1 Dedicated Input,1 Dedicated Output	1 Dedicated Input,1 Dedicated Output	1 Dedicated Input,1 Dedicated Output
Video Resolution/Frame Rate	D1 or Less,720p	D1 or Less,720p	D1 or Less,720p	D1 or Less,720p	D1 or Less,720p	D1 or Less,720p	D1 or Less,720p	D1 or Less,720p	D1 or Less,720p	D1 or Less,720p	D1 or Less,720p	D1 or Less,720p

Экологический статус

Application Notes

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  AM3715 GPMC
  PDF, 19 Кб, Файл опубликован: 3 июн 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:href=http://processors.wiki.ti.com/index.php/Am3715_gpmcThe GPMC is a 16-bit external memory controller. The GPMC data access engine provides a flexible programming model for communicatio
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  AM37x/DM37x Schematic Checklist
  PDF, 19 Кб, Файл опубликован: 3 июн 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x/DM37x_Schematic_Checklist.This article provides many tips related to reset, JTAG, peripherals, etc. It should be used as
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  AM/DM37x Overview
  PDF, 19 Кб, Файл опубликован: 3 июн 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM/DM37x_Overview.This document provides an overview of the AM37x applications processor.All trademarks are property of their respective
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  AM3715/03 Memory Subsystem
  PDF, 19 Кб, Файл опубликован: 3 июн 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM3715/03_Memory_SubsystemThe Memory Subsystem in the AM3715/03 devices consists of the internal SRAM and two dedicated memory contr
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  AM37x EVM Software Developer's Guide
  PDF, 19 Кб, Файл опубликован: 3 июн 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x_EVM_Software_Developer%27s_Guide.This wiki article illustrates the various software components provided with the A
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  PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs
  PDF, 739 Кб, Файл опубликован: 15 июн 2011
  The purpose of a power distribution network (PDN) is to provide clean and reliable power to active devices in the system. The printed circuit board (PCB) is a critical component of the system-level PDN. Therefore, the PCB design is of utmost importance for high-performance low-power microprocessors. This application report provides design requirements and details a step-by-step methodology on how
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  Ethernet Connectivity via GPMC
  PDF, 19 Кб, Файл опубликован: 3 июн 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/Ethernet_Connectivity_via_GPMCThe purpose of this article is to describe a solution for connecting Ethernet to various devices,
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  Setting up AM37x SDRC Registers
  PDF, 19 Кб, Файл опубликован: 3 июн 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/Setting_up_AM37x_SDRC_registersThis wiki article describes how to set the SDRC registers in the OMAP35x SDRC module depending o
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  AM37x CUS Routing Guidelines
  PDF, 19 Кб, Файл опубликован: 3 июн 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x_CUS_Routing_Guidelines.CUS package is designed with a new technology called Via Channelв„ў array. This technology allows for e
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  AM/DM37x Power Estimation Spreadsheet
  PDF, 20 Кб, Файл опубликован: 7 июн 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or tocontribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM/DM37x_Power_Estimation_SpreadsheetThis article discusses the power consumption of the Texas Instruments AM/DM37x high
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  PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors Part II
  PDF, 1.2 Мб, Файл опубликован: 23 июн 2010
  Once the main printed circuit board (PCB) has been designed the assembly guidelines for the 0.5mm package-on-package (PoP) applications processor and companion memory device must be considered. PoP applications processors have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of PCB assembly: PoP applications process
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  PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors Part I
  PDF, 2.0 Мб, Файл опубликован: 23 июн 2010
  Ball grid array (BGA) packages having 0.5mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies. PCBs with package-on-package (PoP) technology have additional assembly requirements and options that need to be considered when designing the PCB.

  Fine-pitch PCB design is a team effort and may require more than

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  Introduction to TMS320C6000 DSP Optimization
  PDF, 535 Кб, Файл опубликован: 6 окт 2011
  The TMS320C6000™ Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications. However to fully leverage the architectural features that C6000™ processors offer code optimization may be required. First this document reviews five key concepts in understanding the C6000 DSP architecture and optimization. Then

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• Semiconductors> Processors> Digital Signal Processors> Media Processors > DaVinci Video Processors