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Datasheet Texas Instruments LM22674 — Даташит

ПроизводительTexas Instruments
СерияLM22674
Datasheet Texas Instruments LM22674

SIMPLE SWITCHERВ® 4.5V to 42V, 0.5A Step-Down DC/DC Switching Regulator with Precision Enable

Datasheets

LM22674/-Q1 42 V, 500 mA SIMPLE SWITCHERВ® Step-Down Voltage Regulator with Features datasheet
PDF, 1.3 Мб, Версия: M, Файл опубликован: 4 ноя 2014
Выписка из документа

Цены

43 предложений от 26 поставщиков
Импульсный понижающий DC-DC стабилизатор, регулируемый, 4.5В-42В (Vin), 1.285В-37В, 500мА, SOP-8
ЧипСити
Россия
LM22674MRX-ADJ/NOPB
Texas Instruments
60 ₽
ChipWorker
Весь мир
LM22674MRX-ADJ/NOPB
National Semiconductor
93 ₽
T-electron
Россия и страны СНГ
LM22674MRE-ADJ/NOPB
Texas Instruments
164 ₽
Кремний
Россия и страны СНГ
LM22674MR-5 0
по запросу
Сравнительное тестирование аккумуляторов EVE Energy и Samsung типоразмера 18650

Статус

LM22674MR-5.0/NOPBLM22674MR-ADJ/NOPBLM22674MRE-5.0/NOPBLM22674MRE-ADJ/NOPBLM22674MRX-5.0/NOPBLM22674MRX-ADJ/NOPB
Статус продуктаВ производствеВ производствеВ производствеВ производствеВ производствеВ производстве
Доступность образцов у производителяДаДаНетДаДаДа

Корпус / Упаковка / Маркировка

LM22674MR-5.0/NOPBLM22674MR-ADJ/NOPBLM22674MRE-5.0/NOPBLM22674MRE-ADJ/NOPBLM22674MRX-5.0/NOPBLM22674MRX-ADJ/NOPB
N123456
Pin888888
Package TypeDDADDADDADDADDADDA
Industry STD TermHSOICHSOICHSOICHSOICHSOICHSOIC
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY959525025025002500
CarrierTUBETUBESMALL T&RSMALL T&RLARGE T&RLARGE T&R
МаркировкаL22674ADJ5.0ADJL22674ADJ
Width (мм)3.93.93.93.93.93.9
Length (мм)4.894.894.894.894.894.89
Thickness (мм)1.481.481.481.481.481.48
Pitch (мм)1.271.271.271.271.271.27
Max Height (мм)1.71.71.71.71.71.7
Mechanical DataСкачатьСкачатьСкачатьСкачатьСкачатьСкачать

Параметры

Parameters / ModelsLM22674MR-5.0/NOPB
LM22674MR-5.0/NOPB
LM22674MR-ADJ/NOPB
LM22674MR-ADJ/NOPB
LM22674MRE-5.0/NOPB
LM22674MRE-5.0/NOPB
LM22674MRE-ADJ/NOPB
LM22674MRE-ADJ/NOPB
LM22674MRX-5.0/NOPB
LM22674MRX-5.0/NOPB
LM22674MRX-ADJ/NOPB
LM22674MRX-ADJ/NOPB
Control ModeVoltage ModeVoltage ModeVoltage ModeVoltage ModeVoltage ModeVoltage Mode
Duty Cycle(Max), %909090909090
Iout(Max), A0.50.50.50.50.50.5
Iq(Typ), мА3.43.43.43.43.43.4
Рабочий диапазон температур, Cот -40 до 125от -40 до 125от -40 до 125от -40 до 125от -40 до 125от -40 до 125
Package GroupSO PowerPADSO PowerPADSO PowerPADSO PowerPADSO PowerPADSO PowerPAD
RatingCatalogCatalogCatalogCatalogCatalogCatalog
Regulated Outputs111111
Special FeaturesEnableEnableEnableEnableEnableEnable
Switching Frequency(Max), kHz500500500500500500
Switching Frequency(Min), kHz500500500500500500
ТипConverterConverterConverterConverterConverterConverter
Vin(Max), В424242424242
Vin(Min), В4.54.54.54.54.54.5
Vout(Max), В373737373737
Vout(Min), В1.2851.2851.2851.2851.2851.285

Экологический статус

LM22674MR-5.0/NOPBLM22674MR-ADJ/NOPBLM22674MRE-5.0/NOPBLM22674MRE-ADJ/NOPBLM22674MRX-5.0/NOPBLM22674MRX-ADJ/NOPB
RoHSСовместимСовместимСовместимСовместимСовместимСовместим

Application Notes

  • AN-643 EMI/RFI Board Design (Rev. B)
    PDF, 742 Кб, Версия: B, Файл опубликован: 3 май 2004
    Application Note 643 EMI/RFI Board Design
  • AN-1533 Overvoltage Protection Circuit for Automotive Load Dump (Rev. B)
    PDF, 83 Кб, Версия: B, Файл опубликован: 6 май 2013
    This application report discusses an over voltage protection circuit for automotive load dump.
  • Input and Output Capacitor Selection
    PDF, 219 Кб, Файл опубликован: 19 сен 2005
  • AN-1197 Selecting Inductors for Buck Converters (Rev. B)
    PDF, 558 Кб, Версия: B, Файл опубликован: 23 апр 2013
    This application report provides design information to help select an off-the-shelf inductor for anycontinuous-mode buck converter application.
  • AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
    PDF, 3.6 Мб, Версия: A, Файл опубликован: 23 апр 2013
    This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
  • AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)
    PDF, 1.4 Мб, Версия: A, Файл опубликован: 23 апр 2013
    This application note provides thermal power analysis techniques for analyzing the power IC.
  • AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
    PDF, 2.7 Мб, Версия: A, Файл опубликован: 23 апр 2013
    This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
  • Semiconductor and IC Package Thermal Metrics (Rev. C)
    PDF, 201 Кб, Версия: C, Файл опубликован: 19 апр 2016
  • AN-2020 Thermal Design By Insight, Not Hindsight (Rev. C)
    PDF, 568 Кб, Версия: C, Файл опубликован: 23 апр 2013
    This application report provides an in-depth discussion of thermal design.
  • AN-1997 Error Amplifier Limitations in High-Performance Regulator Applications (Rev. A)
    PDF, 153 Кб, Версия: A, Файл опубликован: 6 май 2013
    The development of realistic predictions to assist the power supply engineer during the control loop design process is facilitated in this application report by appropriate small-signal and bode plot analysis, the validity of which is verified through simulation results.
  • SIMPLE SWITCHER Regulators Take Over Automotive Applications (Rev. A)
    PDF, 72 Кб, Версия: A, Файл опубликован: 23 апр 2013
    Power management applications, typically located on the front line of the automotive electronics system,can be subject to wide input operating voltage extremes resulting from load-dump and cold-crankingconditions. Careful selection of the power management electronics can provide added margin andprotection to the automotive electronics system. The simplest design is provided by a power manage
  • Low EMI Layout Made SIMPLE With LM43600/1/2/3 and LM46000/1/2 (Rev. A)
    PDF, 512 Кб, Версия: A, Файл опубликован: 12 сен 2014
    Printed Circuit Board (PCB) layout for Switched Mode Power Supplies (SMPS) is critical to achieve proper converter operation good thermal performance and excellent radiated EMI performance. Optimized board layout for low radiated EMI is made very simple by the package and pin arrangement of the SIMPLE SWITCHER Synchronous Buck Converter family LM4360x and LM4600x
  • AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
    PDF, 82 Кб, Версия: C, Файл опубликован: 23 апр 2013
    When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
  • AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
    PDF, 374 Кб, Версия: C, Файл опубликован: 23 апр 2013
    This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
  • AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
    PDF, 2.5 Мб, Версия: C, Файл опубликован: 24 апр 2013
    Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
  • AN-1246 Stresses in Wide Input DC-DC Converters (Rev. C)
    PDF, 427 Кб, Версия: C, Файл опубликован: 23 апр 2013
    This application note discusses stresses in wide input DC-DC converters.
  • AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
    PDF, 9.2 Мб, Версия: B, Файл опубликован: 23 апр 2013
    This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP

Модельный ряд

Классификация производителя

  • Semiconductors> Power Management> Non-isolated DC/DC Switching Regulator> Step-Down (Buck)> Buck Converter (Integrated Switch)

На английском языке: Datasheet Texas Instruments LM22674

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