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Datasheet Texas Instruments LMR70503 — Даташит

ПроизводительTexas Instruments
СерияLMR70503
Datasheet Texas Instruments LMR70503

SIMPLE SWITCHERВ® 2.8V to 5.5V, 300mA Buck/Boost Negative Output Voltage Regulator

Datasheets

LMR70503 Buck-Boost Converter For Negative Output Voltage in DSBGA datasheet
PDF, 1.6 Мб, Версия: A, Файл опубликован: 4 апр 2013
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DC-DC импульсный понижающий-повышающий стабилизатор, 2.8В-5.5В (Vin), -5.5В--900мВ, 320мА, DSBGA-8
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Статус

LMR70503TM/NOPBLMR70503TMX/NOPB
Статус продуктаВ производствеВ производстве
Доступность образцов у производителяНетДа

Корпус / Упаковка / Маркировка

LMR70503TM/NOPBLMR70503TMX/NOPB
N12
Pin88
Package TypeYFXYFX
Industry STD TermDSBGADSBGA
JEDEC CodeR-XBGA-NR-XBGA-N
Package QTY2503000
CarrierSMALL T&RLARGE T&R
МаркировкаS3S3
Thickness (мм).42.42
Pitch (мм).4.4
Max Height (мм).675.675
Mechanical DataСкачатьСкачать

Параметры

Parameters / ModelsLMR70503TM/NOPB
LMR70503TM/NOPB
LMR70503TMX/NOPB
LMR70503TMX/NOPB
Duty Cycle(Max), %9090
Iq(Typ), мА0.30.3
Рабочий диапазон температур, Cот -40 до 125от -40 до 125
Package GroupDSBGADSBGA
RatingCatalogCatalog
Special FeaturesEnableEnable
Switch Current Limit(Min), A0.250.25
Switch Current Limit(Typ), A0.320.32
Switching Frequency(Max), kHz10001000
Switching Frequency(Min), kHz500500
TopologyInvertingInverting
ТипConverterConverter
Vin(Max), В5.55.5
Vin(Min), В2.82.8
Vout(Max), В-0.9-0.9
Vout(Min), В-5.5-5.5

Экологический статус

LMR70503TM/NOPBLMR70503TMX/NOPB
RoHSСовместимСовместим

Application Notes

  • AN-643 EMI/RFI Board Design (Rev. B)
    PDF, 742 Кб, Версия: B, Файл опубликован: 3 май 2004
    Application Note 643 EMI/RFI Board Design
  • Input and Output Capacitor Selection
    PDF, 219 Кб, Файл опубликован: 19 сен 2005
  • AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
    PDF, 3.6 Мб, Версия: A, Файл опубликован: 23 апр 2013
    This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
  • AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)
    PDF, 1.4 Мб, Версия: A, Файл опубликован: 23 апр 2013
    This application note provides thermal power analysis techniques for analyzing the power IC.
  • AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
    PDF, 2.7 Мб, Версия: A, Файл опубликован: 23 апр 2013
    This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
  • Semiconductor and IC Package Thermal Metrics (Rev. C)
    PDF, 201 Кб, Версия: C, Файл опубликован: 19 апр 2016
  • Understanding Buck-Boost Power Stages in Switchmode Power Supplies (Rev. A)
    PDF, 363 Кб, Версия: A, Файл опубликован: 28 май 2002
  • AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
    PDF, 82 Кб, Версия: C, Файл опубликован: 23 апр 2013
    When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
  • AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
    PDF, 374 Кб, Версия: C, Файл опубликован: 23 апр 2013
    This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
  • AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
    PDF, 2.5 Мб, Версия: C, Файл опубликован: 24 апр 2013
    Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
  • AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
    PDF, 9.2 Мб, Версия: B, Файл опубликован: 23 апр 2013
    This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP

Модельный ряд

Серия: LMR70503 (2)

Классификация производителя

  • Semiconductors> Power Management> Non-isolated DC/DC Switching Regulator> Buck/Boost, Inverting or Split-Rail> Buck/Boost, Inverting or Split-Rail Converter (Integrated Switch)

На английском языке: Datasheet Texas Instruments LMR70503

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