Datasheet Texas Instruments LMZ10504 — Даташит
| Производитель | Texas Instruments |
| Серия | LMZ10504 |
4A, SIMPLE SWITCHERВ® Power Module with 5.5V Maximum Input Voltage
Datasheets
LMZ10504 4-A SIMPLE SWITCHERВ® Power Module With 5.5-V Maximum Input Voltage datasheet
PDF, 1.4 Мб, Версия: O, Файл опубликован: 1 июн 2017
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Цены
 Купить LMZ10504 на РадиоЛоцман.Цены — от 199 до 2 640 ₽43 предложений от 26 поставщиков SIMPLE SWITCHER® Power Module, Uin=2.95-5.5V, Uout=0.8-5V, Iout=4A, частота преобразования 1МГц, темп. нест. Uout 2% | |||
| LMZ10504TZ-ADJ National Semiconductor | 199 ₽ | ||
| LMZ10504TZ-ADJ Texas Instruments | 441 ₽ | ||
| LMZ10504TZX-ADJ/NOPB Texas Instruments | 556 ₽ | ||
| LMZ10504TZ-ADJ National Semiconductor | по запросу | ||
Статус
| LMZ10504TZ-ADJ/NOPB | LMZ10504TZE-ADJ/NOPB | LMZ10504TZX-ADJ/NOPB | |
|---|---|---|---|
| Статус продукта | В производстве | В производстве | В производстве |
| Доступность образцов у производителя | Да | Нет | Да |
Корпус / Упаковка / Маркировка
| LMZ10504TZ-ADJ/NOPB | LMZ10504TZE-ADJ/NOPB | LMZ10504TZX-ADJ/NOPB | |
|---|---|---|---|
| N | 1 | 2 | 3 |
| Pin | 7 | 7 | 7 |
| Package Type | NDW | NDW | NDW |
| Industry STD Term | TO-PMOD | TO-PMOD | TO-PMOD |
| JEDEC Code | R-MSFM-P | R-MSFM-P | R-MSFM-P |
| Package QTY | 250 | 45 | 500 |
| Carrier | SMALL T&R | TUBE | LARGE T&R |
| Маркировка | TZ-ADJ | LMZ10504 | LMZ10504 |
| Width (мм) | 9.85 | 9.85 | 9.85 |
| Length (мм) | 10.16 | 10.16 | 10.16 |
| Thickness (мм) | 4.57 | 4.57 | 4.57 |
| Pitch (мм) | 1.27 | 1.27 | 1.27 |
| Max Height (мм) | 4.8 | 4.8 | 4.8 |
| Mechanical Data | Скачать | Скачать | Скачать |
Параметры
| Parameters / Models | LMZ10504TZ-ADJ/NOPB | LMZ10504TZE-ADJ/NOPB | LMZ10504TZX-ADJ/NOPB |
|---|---|---|---|
| Iout(Max), A | 4 | 4 | 4 |
| Iq(Typ), мА | 1.7 | 1.7 | 1.7 |
| Рабочий диапазон температур, C | от -40 до 125 | от -40 до 125 | от -40 до 125 |
| Package Size: mm2:W x L, PKG | 7TO-PMOD: 140 mm2: 13.77 x 10.16(TO-PMOD) | 7TO-PMOD: 140 mm2: 13.77 x 10.16(TO-PMOD) | 7TO-PMOD: 140 mm2: 13.77 x 10.16(TO-PMOD) |
| Package Type | Leaded | Leaded | Leaded |
| Regulated Outputs | 1 | 1 | 1 |
| Soft Start | Adjustable | Adjustable | Adjustable |
| Special Features | EMI Tested,Enable,Tracking | EMI Tested,Enable,Tracking | EMI Tested,Enable,Tracking |
| Switching Frequency(Max), kHz | 1160 | 1160 | 1160 |
| Switching Frequency(Min), kHz | 750 | 750 | 750 |
| Switching Frequency(Typ), kHz | 1000 | 1000 | 1000 |
| Vin(Max), В | 5.5 | 5.5 | 5.5 |
| Vin(Min), В | 2.95 | 2.95 | 2.95 |
| Vout(Max), В | 5 | 5 | 5 |
| Vout(Min), В | 0.8 | 0.8 | 0.8 |
Экологический статус
| LMZ10504TZ-ADJ/NOPB | LMZ10504TZE-ADJ/NOPB | LMZ10504TZX-ADJ/NOPB | |
|---|---|---|---|
| RoHS | Не совместим | Не совместим | Не совместим |
Application Notes
- Understanding and Applying Current-Mode Control TheoryPDF, 409 Кб, Файл опубликован: 19 авг 2007
- AN-643 EMI/RFI Board Design (Rev. B)PDF, 742 Кб, Версия: B, Файл опубликован: 3 май 2004
Application Note 643 EMI/RFI Board Design - Input and Output Capacitor SelectionPDF, 219 Кб, Файл опубликован: 19 сен 2005
- AN-2145 Power Considerations for SDI Products (Rev. B)PDF, 63 Кб, Версия: B, Файл опубликован: 26 апр 2013
This application report discusses the issues and trade-offs that VCC ripple has on the performance of SDI components. - AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)PDF, 3.6 Мб, Версия: A, Файл опубликован: 23 апр 2013
This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor. - Design Summary LMZ1xxx and LMZ2xxx Power Module Family (Rev. B)PDF, 996 Кб, Версия: B, Файл опубликован: 20 янв 2016
- AN-2026 Effect of PCB Design on Thermal Performance of SIMPLE SWITCHER Modules (Rev. A)PDF, 455 Кб, Версия: A, Файл опубликован: 23 апр 2013
This application report focuses on the low current modules that come in a 7 lead, 10.16 x 4.57 x 9.81 mmpackage. - AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)PDF, 2.7 Мб, Версия: A, Файл опубликован: 23 апр 2013
This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time. - Semiconductor and IC Package Thermal Metrics (Rev. C)PDF, 201 Кб, Версия: C, Файл опубликован: 19 апр 2016
- AN-2020 Thermal Design By Insight, Not Hindsight (Rev. C)PDF, 568 Кб, Версия: C, Файл опубликован: 23 апр 2013
This application report provides an in-depth discussion of thermal design. - Power Supply Design Considerations for Modern FPGAs (Power Designer 121)PDF, 295 Кб, Файл опубликован: 2 фев 2010
Power Supply Design Considerations for Modern FPGAs - AN-2078 PCB Layout for Texas Instruments SIMPLE SWITCHER Power Modules (Rev. A)PDF, 1.1 Мб, Версия: A, Файл опубликован: 23 апр 2013
This application report discusses the best PCB layout methods, practices and techniques to maximize themodule’s performance. - AN-2013 LMZ1050x/LMZ1050xEXT SIMPLE SWITCHER Power Module (Rev. D)PDF, 694 Кб, Версия: D, Файл опубликован: 17 сен 2015
- AN-2052 Texas Instruments SIMPLE SWITCHER Power Modules and EMI (Rev. C)PDF, 99 Кб, Версия: C, Файл опубликован: 23 апр 2013
While the principles discussed in this application report apply more broadly to power design, we will focuson DC to DC convertor design given its broad application. It affects virtually every hardware engineer whoat some point has to design a power convertor. In this application report we will consider two commontrade-offs related to low EMI design; thermal performance and EMI and also solut - AN-2146 Power Design for SDI and Other Noise-Sensitive Devices (Rev. A)PDF, 1.4 Мб, Версия: A, Файл опубликован: 26 апр 2013
This application report discusses various solutions for meeting the power requirements of serial digital interface (SDI) video components. - AN-2027 Inverting Application for the LMZ14203 SIMPLE SWITCHER Power Module (Rev. A)PDF, 244 Кб, Версия: A, Файл опубликован: 6 май 2013
This application report illustrates how to apply the LMZ14203 integrated buck module into the buck-boost configuration such that a positive input voltage can be used to create a regulated negative output voltage. - AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)PDF, 82 Кб, Версия: C, Файл опубликован: 23 апр 2013
When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current - AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)PDF, 374 Кб, Версия: C, Файл опубликован: 23 апр 2013
This application report provides SIMPLE SWITCHER™ PCB layout guidelines. - AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)PDF, 2.5 Мб, Версия: C, Файл опубликован: 24 апр 2013
Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti - AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)PDF, 9.2 Мб, Версия: B, Файл опубликован: 23 апр 2013
This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
Модельный ряд
Серия: LMZ10504 (3)
Классификация производителя
- Semiconductors> Power Management> Power Modules> Non-Isolated Module> Step-Down (Buck) Module
