Datasheet Texas Instruments LMZ31710 — Даташит

Производитель	Texas Instruments
Серия	LMZ31710

Datasheets

Цены

Купить LMZ31710 на РадиоЛоцман.Цены — от 664 до 4 377 ₽ 18 предложений от 11 поставщиков TEXAS INSTRUMENTS LMZ31710RVQR DC-DC POL Converter, Adjustable, Buck, 1.2MHz, 600mV to 5.5V out, 10A, QFN-42
Akcel Весь мир	LMZ31710RVQR Texas Instruments	от 664 ₽	Купить
T-electron Россия и страны СНГ	LMZ31710RVQR Texas Instruments	684 ₽	Купить
ЭИК Россия	LMZ31710RVQR Texas Instruments	от 2 907 ₽	Купить
Acme Chip Весь мир	LMZ31710RVQR Texas Instruments	по запросу	Купить

Статус

Корпус / Упаковка / Маркировка

Параметры

Parameters / Models	LMZ31710RVQR	LMZ31710RVQT
Iout(Max), A	10	10
Рабочий диапазон температур, C	от -40 до 85	от -40 до 85
Package Size: mm2:W x L, PKG	42B3QFN: 100 mm2: 10 x 10(B3QFN)	42B3QFN: 100 mm2: 10 x 10(B3QFN)
Package Type	QFN	QFN
Regulated Outputs	1	1
Soft Start	Adjustable	Adjustable
Special Features	Current Sharing,EMI Tested,Frequency Synchronization,Power Good,Remote Sense,Tracking,Light Load Efficiency	Current Sharing,EMI Tested,Frequency Synchronization,Power Good,Remote Sense,Tracking,Light Load Efficiency
Switching Frequency(Max), kHz	1200	1200
Switching Frequency(Min), kHz	200	200
Switching Frequency(Typ), kHz	1000	1000
Vin(Max), В	17	17
Vin(Min), В	2.95	2.95
Vout(Max), В	5.5	5.5
Vout(Min), В	0.6	0.6

Экологический статус

Application Notes

• Скачать
  Using LMZ31710 for Higher Output Voltages
  PDF, 95 Кб, Файл опубликован: 9 ноя 2015
  The LMZ31710 power module has been designed and characterized for operation at output voltages from0.6 V to 5.5 V. However, several applications require higher voltages than the standard point-of-loadvoltages that the LMZ31710 is designed for. Following the guidance in this application note, theLMZ31710 can be used for output voltages up to 9.5 V. All data included in this application note h
• Скачать
  LMZ31710, LMZ31707, LMZ31704 Parallel
  PDF, 217 Кб, Файл опубликован: 2 июл 2013
  The LMZ31710 is a 2.95-V to 17-V input, 10-A output, integrated power solution which integrates the PWM controller, power MOSFETs, inductor and passives in a low-profile, QFN package. For applications requiring greater than 10 A, it is possible to parallel up to six LMZ31710 devices by following the recommendations in this paper.
• Скачать
  Power Module MSL Ratings
  PDF, 137 Кб, Файл опубликован: 20 янв 2017
  All semiconductor devices, including power modules that have a moisture sensitivity level (MSL) rating and a peak reflow classification, which provides needed information when manufacturing with the device. This application report helps to explain these ratings.
• Скачать
  Powering LMZ3 SIMPLE SWITCHER Power Modules From 3.3 V
  PDF, 38 Кб, Файл опубликован: 2 июл 2013
  LMZ31503 Powering LMZ3 SIMPLE SWITCHERВ® Power Modules from 3.3V
• Скачать
  Adjusting LMZ3 Output Voltage with LM10010/1
  PDF, 87 Кб, Файл опубликован: 11 фев 2014
  ThisapplicationnoteoutlinesthemethodstopairanLMZ3powermodulewithanLM10010/1VIDvoltageprogrammertoadjusttheoutputvoltage.TheLMZ3powermoduleisaneasy-to-useintegratedpowersolutionwhichcombinesaDC/DCconverterwithpowerMOSFETs,ashieldedinductor,andpassivecomponentsintoalowprofileQFNpackage,whilest
• Скачать
  Working With QFN Power Modules (Rev. A)
  PDF, 1.7 Мб, Версия: A, Файл опубликован: 8 июн 2017
  TexasInstrumentsQuadFlatpackNo-lead(QFN)powermodulesallowfor boardminiaturization,and holdseveraladvantagesoverotherpowermodulepackages.The QFNpackageshavehigherpowerdensity,asmallerroutingarea,improvedthermalperformance,and improvedelectricalparasitics.Additionally,theabsenceof externalleadseliminatesbent-leadconc
• Скачать
  Soldering Requirements for BQFN Packages (Rev. B)
  PDF, 737 Кб, Версия: B, Файл опубликован: 8 июн 2017
  This documentoutlinesthe solderingrequirementsfor the TPS84and LMZ3devicefamilies
• Скачать
  Uninterruptible Synchronization Clock Circuit
  PDF, 74 Кб, Файл опубликован: 22 ноя 2013
• Скачать
  AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
  PDF, 9.2 Мб, Версия: B, Файл опубликован: 23 апр 2013
  This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
• Скачать
  AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
  PDF, 3.6 Мб, Версия: A, Файл опубликован: 23 апр 2013
  This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
• Скачать
  AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
  PDF, 2.5 Мб, Версия: C, Файл опубликован: 24 апр 2013
  Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
• Скачать
  Semiconductor and IC Package Thermal Metrics (Rev. C)
  PDF, 201 Кб, Версия: C, Файл опубликован: 19 апр 2016
• Скачать
  QFN and SON PCB Attachment (Rev. B)
  PDF, 821 Кб, Версия: B, Файл опубликован: 24 авг 2018
• Скачать
  Input and Output Capacitor Selection
  PDF, 219 Кб, Файл опубликован: 19 сен 2005

Модельный ряд

Классификация производителя

• Semiconductors> Power Management> Power Modules> Non-Isolated Module> Step-Down (Buck) Module