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Datasheet Texas Instruments MSP430F5658 — Даташит

ПроизводительTexas Instruments
СерияMSP430F5658
Datasheet Texas Instruments MSP430F5658

MSP430F56xx Mixed Signal Microcontroller

Datasheets

MSP430F665x, MSP430F645x, MSP430F565x, MSP430F535x Mixed Signal Microcontroller datasheet
PDF, 1.9 Мб, Версия: C, Файл опубликован: 21 окт 2013
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MSP430 CPUXV2 MSP430F5xx Microcontroller IC 16-Bit 20MHz 384KB (384K x 8) FLASH 100-LQFP (14x14)
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Выбираем схему BMS для заряда литий-железофосфатных (LiFePO4) аккумуляторов

Статус

MSP430F5658IPZMSP430F5658IPZRMSP430F5658IZQWRMSP430F5658IZQWT
Статус продуктаВ производствеВ производствеВ производствеВ производстве
Доступность образцов у производителяНетНетНетНет

Корпус / Упаковка / Маркировка

MSP430F5658IPZMSP430F5658IPZRMSP430F5658IZQWRMSP430F5658IZQWT
N1234
Pin100100113113
Package TypePZPZZQWZQW
Industry STD TermLQFPLQFPBGA MICROSTAR JUNIORBGA MICROSTAR JUNIOR
JEDEC CodeS-PQFP-GS-PQFP-GS-PBGA-NS-PBGA-N
Package QTY9010002500250
CarrierJEDEC TRAY (10+1)LARGE T&RLARGE T&RSMALL T&R
МаркировкаF5658F5658F5658F5658
Width (мм)141477
Length (мм)141477
Thickness (мм)1.41.4.74.74
Pitch (мм).5.5.5.5
Max Height (мм)1.61.611
Mechanical DataСкачатьСкачатьСкачатьСкачать

Параметры

Parameters / ModelsMSP430F5658IPZ
MSP430F5658IPZ
MSP430F5658IPZR
MSP430F5658IPZR
MSP430F5658IZQWR
MSP430F5658IZQWR
MSP430F5658IZQWT
MSP430F5658IZQWT
ADCADC12 - 12chADC12 - 12chADC12 - 12chADC12 - 12ch
AESN/AN/AN/AN/A
Active Power, uA/MHz370370370370
Additional FeaturesUSB,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDAUSB,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDAUSB,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDAUSB,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDA
BSLUSBUSBUSBUSB
CPUMSP430MSP430MSP430MSP430
Comparators12121212
DMA6666
Featuredf5f5f5f5
Тактовая частота, МГц20202020
GPIO Pins74747474
I2C3333
Max VCC3.63.63.63.6
Min VCC1.81.81.81.8
Multiplier32x3232x3232x3232x32
Non-volatile Memory, KB384384384384
Рабочий диапазон температур, Cот -40 до 85от -40 до 85от -40 до 85от -40 до 85
Package GroupLQFPLQFPBGA MICROSTAR JUNIORBGA MICROSTAR JUNIOR
Package Size: mm2:W x L, PKG100LQFP: 256 mm2: 16 x 16(LQFP)100LQFP: 256 mm2: 16 x 16(LQFP)113BGA MICROSTAR JUNIOR: 49 mm2: 7 x 7(BGA MICROSTAR JUNIOR)113BGA MICROSTAR JUNIOR: 49 mm2: 7 x 7(BGA MICROSTAR JUNIOR)
RAM, KB34343434
RatingCatalogCatalogCatalogCatalog
SPI6666
Special I/ON/AN/AN/AN/A
Standby Power, LPM3-uA2.62.62.62.6
Timers - 16-bit4444
UART3333
Wakeup Time, us3333

Экологический статус

MSP430F5658IPZMSP430F5658IPZRMSP430F5658IZQWRMSP430F5658IZQWT
RoHSСовместимСовместимСовместимСовместим

Application Notes

  • Using the MSP430 RTC_B Module With Battery Backup Supply (Rev. B)
    PDF, 135 Кб, Версия: B, Файл опубликован: 4 июн 2015
    Some applications need to retain an accurate real-time clock (RTC) through battery changes, power outages, and other events. For these applications, MSP430в„ў devices that contain the RTC_B Real-Time Clock module with a Battery Backup System can be a great fit. This application note demonstrates how to use RTC_B with Battery Backup Supply functionality to retain the time and keep the RTC counting th
  • Starting a USB Design Using MSP430 MCUs (Rev. A)
    PDF, 949 Кб, Версия: A, Файл опубликован: 30 май 2014
    This document is a high-level starting point for those wanting to design USB devices with MSP430в„ў MCUs. It provides an overview of the TI MSP430 hardware and software offerings for USB, as well as guidance in quickly getting started.Among the topics covered:An overview of the MSP430 hardware USB moduleAn introduction to the MSP430 USB Developer's Package
  • Using the MSP430 Timer_D Module in Hi-Resolution Mode
    PDF, 870 Кб, Файл опубликован: 2 окт 2013
    This application report describes the use of the high-resolution feature of the Timer_D module introduced in MSP430F51x1 and MSP430F51x2 devices. Timer_D enables applications that require high resolution such as capacitive touch detection, PWM DACs, advanced LED lighting, and digital controllers for power supplies. This application report provides an advanced description of the use and calibration
  • General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
    PDF, 551 Кб, Версия: A, Файл опубликован: 1 апр 2016
    Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl
  • MSP Code Protection Features
    PDF, 752 Кб, Файл опубликован: 7 дек 2015
    MSP microcontrollers (MCUs) offer a number of features to help control code accessibility in the device, to add different layers of code access management and protection strategies. These include features that can lock or password protect the JTAG/SBW access, IP Encapsulation (IPE) to isolate sensitive code with different permissions than the rest of the program, and bootloader (BSL) access featur
  • ESD Diode Current Specification
    PDF, 520 Кб, Файл опубликован: 7 дек 2015
    This document explains the maximum ESD diode current specified for GPIO on MSP microcontrollers. Sometimes signals on specific pins exceed the supply of the MSP MCU. In such a case, the device can handle this overvoltage condition through the ESD diodes, but the ESD diode specification must be considered during application design. The items to be considered are described in this document.

Модельный ряд

Классификация производителя

  • Semiconductors> Microcontrollers (MCU)> MSP430 ultra-low-power MCUs> MSP430F5x/6x

На английском языке: Datasheet Texas Instruments MSP430F5658

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