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Datasheet Texas Instruments MSP430FR5720 — Даташит

ПроизводительTexas Instruments
СерияMSP430FR5720
Datasheet Texas Instruments MSP430FR5720

MSP430FR5724 8 MHz ULP microcontroller with 4 KB FRAM, 1 KB SRAM, 21 IO, 10-bit ADC and comparator

Datasheets

MSP430FR572x Mixed-Signal Microcontrollers datasheet
PDF, 2.2 Мб, Версия: B, Файл опубликован: 25 апр 2016
Выписка из документа

Цены

29 предложений от 18 поставщиков
MSP430FR5724 8MHz ULP microcontroller with 4KB FRAM, 1KB SRAM, 21 IO, 10Bit ADC and comparator 24-VQFN -40℃ to 85℃_x0000__x0000_
EIS Components
Весь мир
MSP430FR5720IPW
Texas Instruments
103 ₽
T-electron
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MSP430FR5720IRGER
Texas Instruments
126 ₽
MSP430FR5720IRGER
Texas Instruments
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MSP430FR5720IRGE
Texas Instruments
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Выбираем схему BMS для заряда литий-железофосфатных (LiFePO4) аккумуляторов

Статус

MSP430FR5720IPWMSP430FR5720IPWRMSP430FR5720IRGERMSP430FR5720IRGET
Статус продуктаВ производствеВ производствеВ производствеВ производстве
Доступность образцов у производителяНетДаДаНет

Корпус / Упаковка / Маркировка

MSP430FR5720IPWMSP430FR5720IPWRMSP430FR5720IRGERMSP430FR5720IRGET
N1234
Pin28282424
Package TypePWPWRGERGE
Industry STD TermTSSOPTSSOPVQFNVQFN
JEDEC CodeR-PDSO-GR-PDSO-GS-PQFP-NS-PQFP-N
Package QTY5020003000250
CarrierTUBELARGE T&RLARGE T&RSMALL T&R
Маркировка430FR5720430FR572057205720
Width (мм)4.44.444
Length (мм)9.79.744
Thickness (мм)11.88.88
Pitch (мм).65.65.5.5
Max Height (мм)1.21.211
Mechanical DataСкачатьСкачатьСкачатьСкачать

Параметры

Parameters / ModelsMSP430FR5720IPW
MSP430FR5720IPW
MSP430FR5720IPWR
MSP430FR5720IPWR
MSP430FR5720IRGER
MSP430FR5720IRGER
MSP430FR5720IRGET
MSP430FR5720IRGET
ADCADC10 - 8chADC10 - 8chADC10 - 8chADC10 - 8ch
AESN/AN/AN/AN/A
Active Power, uA/MHz125125125125
Additional FeaturesReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDAReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDAReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDAReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA
BSLUARTUARTUARTUART
CPUMSP430MSP430MSP430MSP430
Comparators12121212
DMA3333
Featuredfr5fr5fr5fr5
Тактовая частота, МГц8888
GPIO Pins21212121
I2C1111
Max VCC3.63.63.63.6
Min VCC2222
Multiplier32x3232x3232x3232x32
Non-volatile Memory, KB4444
Рабочий диапазон температур, Cот -40 до 85от -40 до 85от -40 до 85от -40 до 85
Package GroupTSSOPTSSOPVQFNVQFN
Package Size: mm2:W x L, PKG28TSSOP: 62 mm2: 6.4 x 9.7(TSSOP)28TSSOP: 62 mm2: 6.4 x 9.7(TSSOP)24VQFN: 16 mm2: 4 x 4(VQFN)24VQFN: 16 mm2: 4 x 4(VQFN)
RAM, KB1111
RatingCatalogCatalogCatalogCatalog
SPI2222
Security EnablerCryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protectionCryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protectionCryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protectionCryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protection
Special I/ON/AN/AN/AN/A
Standby Power, LPM3-uA6.46.46.46.4
Timers - 16-bit3333
UART1111
Wakeup Time, us78787878

Экологический статус

MSP430FR5720IPWMSP430FR5720IPWRMSP430FR5720IRGERMSP430FR5720IRGET
RoHSСовместимСовместимСовместимСовместим

Application Notes

  • Over-the-Air (OTA) Update With the MSP430FR57xx (Rev. A)
    PDF, 3.5 Мб, Версия: A, Файл опубликован: 2 мар 2015
  • MSP430 System-Level ESD Considerations
    PDF, 1.5 Мб, Файл опубликован: 29 мар 2012
    System-Level ESD has become increasingly demanding with silicon technology scaling towards lower voltages and the need for designing cost-effective and ultra-low power components. This application report addresses three different ESD topics to help board designers and OEMs understand and design robust system-level designs:(1) Component-level ESD testing and system-level ESD testing, their differ
  • Maximizing Write Speed on the MSP430в„ў FRAM (Rev. B)
    PDF, 103 Кб, Версия: B, Файл опубликован: 4 фев 2015
    Nonvolatile low-power ferroelectric RAM (FRAM) is capable of extremely high-speed write accesses. This application report discusses how to maximize FRAM write speeds specifically in the MSP430FRxx family using simple techniques. The document uses examples from bench tests performed on the MSP430FR5739 device, which can be extended to all MSP430в„ў FRAM-based devices, and discusses tradeoffs such as
  • MSP430 FRAM Technology – How To and Best Practices
    PDF, 326 Кб, Файл опубликован: 23 июн 2014
    FRAM is a non-volatile memory technology that behaves similar to SRAM while enabling a whole host of new applications, but also changing the way firmware should be designed. This application report outlines the how to and best practices of using FRAM technology in MSP430 from an embedded software development perspective. It discusses how to implement a memory layout according to application-specif
  • MSP430 FRAM Quality and Reliability (Rev. A)
    PDF, 295 Кб, Версия: A, Файл опубликован: 1 май 2014
    FRAM is a nonvolatile embedded memory technology and is known for its ability to be ultra-low power while being the most flexible and easy-to-use universal memory solution available today. This application report is intended to give new FRAM users and those migrating from flash-based applications knowledge on how FRAM meets key quality and reliability requirements such as data retention and endura
  • Migrating from the USCI Module to the eUSCI Module (Rev. A)
    PDF, 41 Кб, Версия: A, Файл опубликован: 13 сен 2012
    The purpose of this application report is to enable easy migration for designs based on the USCI_A and USCI_B modules to the eUSCI_A and the eUSCI_B modules. The document highlights the new features in the eUSCI module and the main differences between the USCI and the eUSCI modules.
  • Migrating from the MSP430F2xx Family to the MSP430FR57xx Family (Rev. A)
    PDF, 154 Кб, Версия: A, Файл опубликован: 16 фев 2012
    This application report enables easy migration from MSP430F2xx Flash-based MCUs to the MSP430FR57xx family FRAM-based MCU. It covers programming, system, and peripheral considerations when migrating firmware. The purpose is to highlight differences between the two families. For more information on the usage of the MSP430FR57xx features, see the MSP430FR57xx Family User's Guide (
  • General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
    PDF, 551 Кб, Версия: A, Файл опубликован: 1 апр 2016
    Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl
  • Design Considerations When Using the MSP430 Graphics Library
    PDF, 475 Кб, Файл опубликован: 5 окт 2012
    LCDs are a growing commodity in todays market with products as diverse as children's toys to medical devices. Modern LCDs, along with the graphics displayed on them, are growing in complexity. A graphics library can simplify and accelerate development while creating the desired user experience. TI provides the MSP430 Graphics Library for use in developing products with the MSP430в„ў MCU. This

Модельный ряд

Классификация производителя

  • Semiconductors> Microcontrollers (MCU)> MSP430 ultra-low-power MCUs> MSP430FRxx FRAM

На английском языке: Datasheet Texas Instruments MSP430FR5720

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