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Datasheet Texas Instruments SN54AC14-SP — Даташит

ПроизводительTexas Instruments
СерияSN54AC14-SP
Datasheet Texas Instruments SN54AC14-SP

Hex Schmitt-trigger Inverters

Datasheets

Rad-Tolerant Class V, Hex Schmitt-Trigger Inverter datasheet
PDF, 261 Кб, Версия: B, Файл опубликован: 7 мар 2012
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Цены

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HEX SCHMITT-TRIGGER INVERTERS
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Выбираем схему BMS для заряда литий-железофосфатных (LiFePO4) аккумуляторов

Статус

5962-8762401VCA5962-8762401VDA5962-8762402VCA5962-8762402VDA
Статус продуктаВ производствеВ производствеВ производствеВ производстве
Доступность образцов у производителяНетНетНетНет

Корпус / Упаковка / Маркировка

5962-8762401VCA5962-8762401VDA5962-8762402VCA5962-8762402VDA
N1234
Pin14141414
Package TypeJWJW
Industry STD TermCDIPCFPCDIPCFP
JEDEC CodeR-GDIP-TR-GDFP-FR-GDIP-TR-GDFP-F
Package QTY1111
CarrierTUBETUBETUBETUBE
Width (мм)6.675.976.675.97
Length (мм)19.569.2119.569.21
Thickness (мм)4.571.594.571.59
Pitch (мм)2.541.272.541.27
Max Height (мм)5.082.035.082.03
Mechanical DataСкачатьСкачатьСкачатьСкачать

Параметры

Parameters / Models5962-8762401VCA
5962-8762401VCA
5962-8762401VDA
5962-8762401VDA
5962-8762402VCA
5962-8762402VCA
5962-8762402VDA
5962-8762402VDA
Bits6666
Тип входаCMOSCMOSCMOSCMOS
Рабочий диапазон температур, Cот -55 до 125от -55 до 125от -55 до 125от -55 до 125
Тип выходаCMOSCMOSCMOSCMOS
Package GroupCDIPCFPCDIPCFP
Package Size: mm2:W x L, PKGSee datasheet (CDIP)See datasheet (CFP)See datasheet (CDIP)See datasheet (CFP)
RatingSpaceSpaceSpaceSpace
Schmitt TriggerYesYesYesYes
Technology FamilyACACACAC
VCC(Max), В6666
VCC(Min), В2222
Voltage(Nom), В3.3,53.3,53.3,53.3,5

Экологический статус

5962-8762401VCA5962-8762401VDA5962-8762402VCA5962-8762402VDA
RoHSSee ti.comSee ti.comSee ti.comSee ti.com

Application Notes

  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Мб, Файл опубликован: 1 окт 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Кб, Файл опубликован: 29 авг 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Live Insertion
    PDF, 150 Кб, Файл опубликован: 1 окт 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Кб, Версия: C, Файл опубликован: 2 дек 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Кб, Файл опубликован: 8 июл 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Designing With Logic (Rev. C)
    PDF, 186 Кб, Версия: C, Файл опубликован: 1 июн 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Introduction to Logic
    PDF, 93 Кб, Файл опубликован: 30 апр 2015
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Кб, Версия: D, Файл опубликован: 23 июн 2016
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Кб, Версия: B, Файл опубликован: 1 июн 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
  • Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
    PDF, 43 Кб, Файл опубликован: 1 апр 1996
    Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren

Модельный ряд

Классификация производителя

  • Semiconductors> Space & High Reliability> Logic Products> Buffers/Drivers/Transceivers> Buffer Drivers

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