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Datasheet Texas Instruments SN54AC86 — Даташит

ПроизводительTexas Instruments
СерияSN54AC86
Datasheet Texas Instruments SN54AC86

Quadruple 2-Input Exclusive-OR Gates

Datasheets

SN54AC86, SN74AC86 datasheet
PDF, 1.2 Мб, Версия: C, Файл опубликован: 23 окт 2003
Выписка из документа

Цены

7 предложений от 7 поставщиков
XOR Gate, AC Series, 4-Func, 2-Input, CMOS, CDIP14
ТаймЧипс
Россия
SN54AC86FK
Texas Instruments
по запросу
Akcel
Весь мир
SN54AC86J
Texas Instruments
по запросу
МосЧип
Россия
SN54AC86_06
Texas Instruments
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T-electron
Россия и страны СНГ
SN54AC86
Texas Instruments
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Выбираем схему BMS для заряда литий-железофосфатных (LiFePO4) аккумуляторов

Статус

5962-89550012A5962-8955001CA5962-8955001DASNJ54AC86FKSNJ54AC86JSNJ54AC86W
Статус продуктаВ производствеВ производствеВ производствеВ производствеВ производствеВ производстве
Доступность образцов у производителяНетНетНетНетНетНет

Корпус / Упаковка / Маркировка

5962-89550012A5962-8955001CA5962-8955001DASNJ54AC86FKSNJ54AC86JSNJ54AC86W
N123456
Pin201414201414
Package TypeFKJWFKJW
Industry STD TermLCCCCDIPCFPLCCCCDIPCFP
JEDEC CodeS-CQCC-NR-GDIP-TR-GDFP-FS-CQCC-NR-GDIP-TR-GDFP-F
Package QTY111111
CarrierTUBETUBETUBETUBETUBETUBE
Width (мм)8.896.675.978.896.675.97
Length (мм)8.8919.569.218.8919.569.21
Thickness (мм)1.834.571.591.834.571.59
Pitch (мм)1.272.541.271.272.541.27
Max Height (мм)2.035.082.032.035.082.03
Mechanical DataСкачатьСкачатьСкачатьСкачатьСкачатьСкачать
Маркировка86FKSNJ54AC86J5962-8955001DA

Параметры

Parameters / Models5962-89550012A
5962-89550012A
5962-8955001CA
5962-8955001CA
5962-8955001DA
5962-8955001DA
SNJ54AC86FK
SNJ54AC86FK
SNJ54AC86J
SNJ54AC86J
SNJ54AC86W
SNJ54AC86W
Bits444444
F @ Nom Voltage(Max), Mhz100100100100100100
ICC @ Nom Voltage(Max), мА0.040.040.040.040.040.04
Тип входаCMOSCMOSCMOSCMOSCMOSCMOS
Рабочий диапазон температур, Cот -55 до 125от -55 до 125от -55 до 125от -55 до 125от -55 до 125от -55 до 125
Output Drive (IOL/IOH)(Max), мА24/-2424/-2424/-2424/-2424/-2424/-24
Тип выходаCMOSCMOSCMOSCMOSCMOSCMOS
Package GroupLCCCCDIPCFPLCCCCDIPCFP
Package Size: mm2:W x L, PKG20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)See datasheet (CFP)20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)See datasheet (CFP)
RatingMilitaryMilitaryMilitaryMilitaryMilitaryMilitary
Schmitt TriggerNoNoNoNoNoNo
Technology FamilyACACACACACAC
VCC(Max), В5.55.55.55.55.55.5
VCC(Min), В222222
tpd @ Nom Voltage(Max), нс12.5,912.5,912.5,912.5,912.5,912.5,9

Экологический статус

5962-89550012A5962-8955001CA5962-8955001DASNJ54AC86FKSNJ54AC86JSNJ54AC86W
RoHSSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.com

Application Notes

  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Мб, Файл опубликован: 1 окт 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Кб, Файл опубликован: 29 авг 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Live Insertion
    PDF, 150 Кб, Файл опубликован: 1 окт 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Кб, Версия: C, Файл опубликован: 2 дек 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Кб, Файл опубликован: 8 июл 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Designing With Logic (Rev. C)
    PDF, 186 Кб, Версия: C, Файл опубликован: 1 июн 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Introduction to Logic
    PDF, 93 Кб, Файл опубликован: 30 апр 2015
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Кб, Версия: D, Файл опубликован: 23 июн 2016
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Кб, Версия: B, Файл опубликован: 1 июн 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
  • Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
    PDF, 43 Кб, Файл опубликован: 1 апр 1996
    Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren

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Классификация производителя

  • Semiconductors> Space & High Reliability> Logic Products> Gate Products

На английском языке: Datasheet Texas Instruments SN54AC86

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