Datasheet Texas Instruments SN54ACT244-SP — Даташит
| Производитель | Texas Instruments |
| Серия | SN54ACT244-SP |
Octal Buffers/Drivers With 3-State Outputs
Datasheets
SNx4ACT244 Octal Buffers and Drivers With 3-State Outputs datasheet
PDF, 1.4 Мб, Версия: D, Файл опубликован: 25 авг 2016
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Цены
5 предложений от 5 поставщиков OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS | |||
| SN54ACT244J Texas Instruments | по запросу | ||
| SN54ACT244W Texas Instruments | по запросу | ||
| SN54ACT244DC Texas Instruments | по запросу | ||
| SN54ACT244FK Texas Instruments | по запросу | ||
Статус
| 5962-8776001SRA | 5962-8776001SSA | |
|---|---|---|
| Статус продукта | В производстве | В производстве |
| Доступность образцов у производителя | Нет | Нет |
Корпус / Упаковка / Маркировка
| 5962-8776001SRA | 5962-8776001SSA | |
|---|---|---|
| N | 1 | 2 |
| Pin | 20 | 20 |
| Package Type | J | W |
| Industry STD Term | CDIP | CFP |
| JEDEC Code | R-GDIP-T | R-GDFP-F |
| Package QTY | 1 | 1 |
| Carrier | TUBE | TUBE |
| Width (мм) | 6.92 | 6.92 |
| Length (мм) | 24.2 | 13.09 |
| Thickness (мм) | 4.57 | 1.84 |
| Pitch (мм) | 2.54 | 1.27 |
| Max Height (мм) | 5.08 | 2.45 |
| Mechanical Data | Скачать | Скачать |
Параметры
| Parameters / Models | 5962-8776001SRA | 5962-8776001SSA |
|---|---|---|
| Bits | 8 | 8 |
| Тип входа | TTL | TTL |
| Рабочий диапазон температур, C | от -55 до 125 | от -55 до 125 |
| Тип выхода | CMOS | CMOS |
| Package Group | CDIP | CFP |
| Package Size: mm2:W x L, PKG | See datasheet (CDIP) | See datasheet (CFP) |
| Rating | Space | Space |
| Schmitt Trigger | No | No |
| Technology Family | ACT | ACT |
| VCC(Max), В | 5.5 | 5.5 |
| VCC(Min), В | 4.5 | 4.5 |
| Voltage(Nom), В | 5 | 5 |
Экологический статус
| 5962-8776001SRA | 5962-8776001SSA | |
|---|---|---|
| RoHS | See ti.com | See ti.com |
Application Notes
- TI IBIS File Creation Validation and Distribution ProcessesPDF, 380 Кб, Файл опубликован: 29 авг 2002
The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con - Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)PDF, 614 Кб, Версия: C, Файл опубликован: 2 дек 2015
- Semiconductor Packing Material Electrostatic Discharge (ESD) ProtectionPDF, 337 Кб, Файл опубликован: 8 июл 2004
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge - Selecting the Right Level Translation Solution (Rev. A)PDF, 313 Кб, Версия: A, Файл опубликован: 22 июн 2004
Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati - Designing With Logic (Rev. C)PDF, 186 Кб, Версия: C, Файл опубликован: 1 июн 1997
Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w - Introduction to LogicPDF, 93 Кб, Файл опубликован: 30 апр 2015
- Implications of Slow or Floating CMOS Inputs (Rev. D)PDF, 260 Кб, Версия: D, Файл опубликован: 23 июн 2016
- CMOS Power Consumption and CPD Calculation (Rev. B)PDF, 89 Кб, Версия: B, Файл опубликован: 1 июн 1997
Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale - Using High Speed CMOS and Advanced CMOS in Systems With Multiple VccPDF, 43 Кб, Файл опубликован: 1 апр 1996
Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren
Модельный ряд
Серия: SN54ACT244-SP (2)
Классификация производителя
- Semiconductors> Space & High Reliability> Logic Products> Buffers/Drivers/Transceivers> Buffer Drivers
