Datasheet Texas Instruments SN54BCT125A — Даташит

Производитель	Texas Instruments
Серия	SN54BCT125A

Datasheets

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Корпус / Упаковка / Маркировка

Параметры

Parameters / Models	5962-9093701M2A	5962-9093701MCA	5962-9093701MDA	SN54BCT125AJ	SNJ54BCT125AFK	SNJ54BCT125AJ	SNJ54BCT125AW
Bits	4	4	4	4	4	4	4
Тип входа	TTL	TTL	TTL	TTL	TTL	TTL	TTL
Рабочий диапазон температур, C	от -55 до 125	от -55 до 125	от -55 до 125	от -55 до 125	от -55 до 125	от -55 до 125	от -55 до 125
Тип выхода	TTL	TTL	TTL	TTL	TTL	TTL	TTL
Package Group	LCCC	CDIP	CFP	CDIP	LCCC	CDIP	CFP
Package Size: mm2:W x L, PKG	20LCCC: 79 mm2: 8.89 x 8.89(LCCC)	See datasheet (CDIP)	See datasheet (CFP)	See datasheet (CDIP)	20LCCC: 79 mm2: 8.89 x 8.89(LCCC)	See datasheet (CDIP)	See datasheet (CFP)
Rating	Military	Military	Military	Military	Military	Military	Military
Schmitt Trigger	No	No	No	No	No	No	No
Technology Family	BCT	BCT	BCT	BCT	BCT	BCT	BCT
VCC(Max), В	5.5	5.5	5.5	5.5	5.5	5.5	5.5
VCC(Min), В	4.5	4.5	4.5	4.5	4.5	4.5	4.5
Voltage(Nom), В	5	5	5	5	5	5	5

Экологический статус

Application Notes

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  This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
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  The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
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  PDF, 150 Кб, Файл опубликован: 1 окт 1996
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  The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
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  PDF, 337 Кб, Файл опубликован: 8 июл 2004
  Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
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  PDF, 186 Кб, Версия: C, Файл опубликован: 1 июн 1997
  Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
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  PDF, 260 Кб, Версия: D, Файл опубликован: 23 июн 2016

Модельный ряд

Классификация производителя

• Semiconductors> Space & High Reliability> Logic Products> Buffers/Drivers/Transceivers> Buffer Drivers