Datasheet Texas Instruments SN54CBT3383 — Даташит

Производитель	Texas Instruments
Серия	SN54CBT3383

Datasheets

Цены

Статус

Корпус / Упаковка / Маркировка

Параметры

Parameters / Models	5962-9668801QKA	5962-9668801QLA	SNJ54CBT3383JT	SNJ54CBT3383W
Количество каналов	10	10	10	10
Рабочий диапазон температур, C	от -55 до 125	от -55 до 125	от -55 до 125	от -55 до 125
Package Group	CFP	CDIP	CDIP	CFP
Package Size: mm2:W x L, PKG	See datasheet (CFP)	See datasheet (CDIP)	See datasheet (CDIP)	See datasheet (CFP)
Rating	Military	Military	Military	Military
Ron(Max), Ohms	7	7	7	7
Ron(Typ), Ohms	5	5	5	5
Technology Family	CBT	CBT	CBT	CBT
VCC(Max), В	5.5	5.5	5.5	5.5
VCC(Min), В	4.5	4.5	4.5	4.5

Экологический статус

Application Notes

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  Voltage translation between buses with incompatible logic levels can be accomplished using Texas Instruments (TI) translation-voltage clamps (TVC) or standard crossbar technology (CBT) devices. CBT devices in this application offer flexibility in designs, protection of circuits that are sensitive to high-state voltage-level overshoots, and cost efficiency.
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  The emergence of low-voltage technology required existing 5-V systems to interact with 3.3-V systems. Compatibility issues of mixed-mode operation created the need for 5-V to 3.3-V translation. Buffers and transceivers serve as effective translators. While providing additional drive, these devices also add propagation delay and require directional control. In cases where additional drive is not
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  In today?s competitive computing and networking industry, any equipment downtime due to component interconnects or bus failures impedes communication, hinders productivity and hampers financial growth. In recognizing this increasingly costly unplanned downtime, the industry introduced live-insertion technology to minimize the impact of any such failures. The live-insertion feature enables a networ
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  Texas Instruments offers a wide variety of electronic switches (digital analog bilateral bilateral analog) in a variety of families including CBT CBTLV HC LV and LVC. Depending on the application the right solution may be an analog switch that passes digital signals or vice versa. This application report summarizes the various switching technologies and provides considerations for choosi
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  TI IBIS File Creation Validation and Distribution Processes
  PDF, 380 Кб, Файл опубликован: 29 авг 2002
  The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
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  Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices
  PDF, 115 Кб, Файл опубликован: 1 дек 1997
  This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn
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  PDF, 337 Кб, Файл опубликован: 8 июл 2004
  Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
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  16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
  PDF, 895 Кб, Версия: B, Файл опубликован: 22 май 2002
  TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
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  Selecting the Right Level Translation Solution (Rev. A)
  PDF, 313 Кб, Версия: A, Файл опубликован: 22 июн 2004
  Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
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  Implications of Slow or Floating CMOS Inputs (Rev. D)
  PDF, 260 Кб, Версия: D, Файл опубликован: 23 июн 2016

Модельный ряд

Классификация производителя

• Semiconductors> Space & High Reliability> Logic Products> Switches and Multiplexer> Signal Switch