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Datasheet Texas Instruments SN54F27 — Даташит

ПроизводительTexas Instruments
СерияSN54F27
Datasheet Texas Instruments SN54F27

Triple 3-Input Positive-NOR Gates

Datasheets

Triple 3-Input Positive-NOR Gates datasheet
PDF, 853 Кб, Версия: A, Файл опубликован: 1 окт 1993
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Статус

5962-89510012A5962-8951001CASNJ54F27FKSNJ54F27J
Статус продуктаВ производствеВ производствеВ производствеВ производстве
Доступность образцов у производителяНетНетНетНет

Корпус / Упаковка / Маркировка

5962-89510012A5962-8951001CASNJ54F27FKSNJ54F27J
N1234
Pin20142014
Package TypeFKJFKJ
Industry STD TermLCCCCDIPLCCCCDIP
JEDEC CodeS-CQCC-NR-GDIP-TS-CQCC-NR-GDIP-T
Package QTY1111
CarrierTUBETUBETUBETUBE
Width (мм)8.896.678.896.67
Length (мм)8.8919.568.8919.56
Thickness (мм)1.834.571.834.57
Pitch (мм)1.272.541.272.54
Max Height (мм)2.035.082.035.08
Mechanical DataСкачатьСкачатьСкачатьСкачать
Маркировка5962-SNJ54F27J

Параметры

Parameters / Models5962-89510012A
5962-89510012A
5962-8951001CA
5962-8951001CA
SNJ54F27FK
SNJ54F27FK
SNJ54F27J
SNJ54F27J
Bits3333
F @ Nom Voltage(Max), Mhz70707070
ICC @ Nom Voltage(Max), мА0.0120.0120.0120.012
Тип входаTTLTTLTTLTTL
Рабочий диапазон температур, Cот -55 до 125от -55 до 125от -55 до 125от -55 до 125
Output Drive (IOL/IOH)(Max), мА1/-201/-201/-201/-20
Тип выходаTTLTTLTTLTTL
Package GroupLCCCCDIPLCCCCDIP
Package Size: mm2:W x L, PKG20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)
RatingMilitaryMilitaryMilitaryMilitary
Schmitt TriggerNoNoNoNo
Technology FamilyFFFF
VCC(Max), В5.55.55.55.5
VCC(Min), В4.54.54.54.5
tpd @ Nom Voltage(Max), нс6666

Экологический статус

5962-89510012A5962-8951001CASNJ54F27FKSNJ54F27J
RoHSSee ti.comSee ti.comSee ti.comSee ti.com

Application Notes

  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Мб, Файл опубликован: 1 окт 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Кб, Файл опубликован: 29 авг 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Кб, Версия: A, Файл опубликован: 1 авг 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Кб, Версия: C, Файл опубликован: 2 дек 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Кб, Файл опубликован: 8 июл 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Designing With Logic (Rev. C)
    PDF, 186 Кб, Версия: C, Файл опубликован: 1 июн 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Introduction to Logic
    PDF, 93 Кб, Файл опубликован: 30 апр 2015

Модельный ряд

Классификация производителя

  • Semiconductors> Space & High Reliability> Logic Products> Gate Products

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