Datasheet Texas Instruments SN54HC04-DIE — Даташит

SN54HC04-DIE
www.ti.com SCLS736 – JULY 2013 HEX INVERTER
Check for Samples: SN54HC04-DIE FEATURES 1 Wide Operating Voltage Range
Low Power Consumption Low Input Current DESCRIPTION
The SN54HC04-DIE contains six independent inverters and performs the Boolean function Y = A in positive
logic.
ORDERING INFORMATION (1) (1)
(2) PRODUCT PACKAGE
DESIGNATOR PACKAGE SN54HC04 TD Bare die in waffle pack (2) ORDERABLE PART NUMBER PACKAGE QUANTITY SN54HC04VTDE1 100 SN54HC04VTDE2 10 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Processing is per the Texas Instruments space production baseline and is in compliance with the Texas Instruments Quality Control
System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature
only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual
Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters. Copyright В© 2013, Texas Instruments Incorporated SN54HC04-DIE
SCLS736 – JULY 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. BARE DIE INFORMATION 2 DIE THICKNESS BACKSIDE FINISH BACKSIDE …