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Datasheet Texas Instruments SN54HCT373 — Даташит

ПроизводительTexas Instruments
СерияSN54HCT373
Datasheet Texas Instruments SN54HCT373

Восьмеричные прозрачные защелки типа D с выходами с 3 состояниями

Datasheets

SN54HCT373, SN74HCT373 datasheet
PDF, 1.3 Мб, Версия: D, Файл опубликован: 13 авг 2003
Выписка из документа
ХРОНИКИ РОСТА: причины увеличения доли китайских полупроводниковых компонентов

Статус

5962-86867012A5962-8686701RAJM38510/65453BRAJM38510/65453BSAM38510/65453BRAM38510/65453BSASN54HCT373JSNJ54HCT373FKSNJ54HCT373JSNJ54HCT373W
Статус продуктаВ производствеВ производствеВ производствеВ производствеВ производствеВ производствеВ производствеВ производствеВ производствеВ производстве
Доступность образцов у производителяНетНетНетНетНетНетНетНетНетНет

Корпус / Упаковка / Маркировка

5962-86867012A5962-8686701RAJM38510/65453BRAJM38510/65453BSAM38510/65453BRAM38510/65453BSASN54HCT373JSNJ54HCT373FKSNJ54HCT373JSNJ54HCT373W
N12345678910
Pin20202020202020202020
Package TypeFKJJWJWJFKJW
Industry STD TermLCCCCDIPCDIPCFPCDIPCFPCDIPLCCCCDIPCFP
JEDEC CodeS-CQCC-NR-GDIP-TR-GDIP-TR-GDFP-FR-GDIP-TR-GDFP-FR-GDIP-TS-CQCC-NR-GDIP-TR-GDFP-F
Package QTY1111111111
CarrierTUBETUBETUBETUBETUBETUBETUBETUBETUBETUBE
Width (мм)8.896.926.926.926.926.926.928.896.926.92
Length (мм)8.8924.224.213.0924.213.0924.28.8924.213.09
Thickness (мм)1.834.574.571.844.571.844.571.834.571.84
Pitch (мм)1.272.542.541.272.541.272.541.272.541.27
Max Height (мм)2.035.085.082.455.082.455.082.035.082.45
Mechanical DataСкачатьСкачатьСкачатьСкачатьСкачатьСкачатьСкачатьСкачатьСкачатьСкачать
Маркировка65453BRA65453BSAJM38510/JM38510/SN54HCT373J373FKSNJ54HCT373JSNJ54HCT373W

Параметры

Parameters / Models5962-86867012A
5962-86867012A
5962-8686701RA
5962-8686701RA
JM38510/65453BRA
JM38510/65453BRA
JM38510/65453BSA
JM38510/65453BSA
M38510/65453BRA
M38510/65453BRA
M38510/65453BSA
M38510/65453BSA
SN54HCT373J
SN54HCT373J
SNJ54HCT373FK
SNJ54HCT373FK
SNJ54HCT373J
SNJ54HCT373J
SNJ54HCT373W
SNJ54HCT373W
3-State OutputYesYesYesYesYesYesYesYesYesYes
Bits8888888888
F @ Nom Voltage(Max), Mhz25252525252525252525
ICC @ Nom Voltage(Max), мА0.080.080.080.080.080.080.080.080.080.08
Тип входаTTLTTLTTLTTLTTLTTLTTLTTLTTLTTL
Рабочий диапазон температур, Cот -55 до 125от -55 до 125от -55 до 125от -55 до 125от -55 до 125от -55 до 125от -55 до 125от -55 до 125от -55 до 125от -55 до 125
Output Drive (IOL/IOH)(Max), мА6/-66/-66/-66/-66/-66/-66/-66/-66/-66/-6
Тип выходаCMOSCMOSCMOSCMOSCMOSCMOSCMOSCMOSCMOSCMOS
Package GroupLCCCCDIPCDIPCFPCDIPCFPCDIPLCCCCDIPCFP
Package Size: mm2:W x L, PKG20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)See datasheet (CDIP)See datasheet (CFP)See datasheet (CDIP)See datasheet (CFP)See datasheet (CDIP)20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)See datasheet (CFP)
RatingMilitaryMilitaryMilitaryMilitaryMilitaryMilitaryMilitaryMilitaryMilitaryMilitary
Technology FamilyHCTHCTHCTHCTHCTHCTHCTHCTHCTHCT
VCC(Max), В5.55.55.55.55.55.55.55.55.55.5
VCC(Min), В4.54.54.54.54.54.54.54.54.54.5
tpd @ Nom Voltage(Max), нс40404040404040404040

Экологический статус

5962-86867012A5962-8686701RAJM38510/65453BRAJM38510/65453BSAM38510/65453BRAM38510/65453BSASN54HCT373JSNJ54HCT373FKSNJ54HCT373JSNJ54HCT373W
RoHSSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.com

Application Notes

  • SN54/74HCT CMOS Logic Family Applications and Restrictions
    PDF, 102 Кб, Файл опубликован: 1 май 1996
    The TI SN54/74HCT family of CMOS devices is a subgroup of the SN74HC series with the HCT circuitry modified to meet the interfacing requirements of TTL outputs to high-speed CMOS inputs. The HCT devices can be driven by the TTL circuits directly without additional components. This document describes the TTL/HC interface the operating voltages circuit noise and power consumption. A Bergeron anal
  • Power-Up Behavior of Clocked Devices (Rev. A)
    PDF, 34 Кб, Версия: A, Файл опубликован: 6 фев 2015
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Кб, Файл опубликован: 29 авг 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Кб, Версия: C, Файл опубликован: 2 дек 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Кб, Файл опубликован: 8 июл 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Designing With Logic (Rev. C)
    PDF, 186 Кб, Версия: C, Файл опубликован: 1 июн 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Introduction to Logic
    PDF, 93 Кб, Файл опубликован: 30 апр 2015
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Кб, Версия: D, Файл опубликован: 23 июн 2016
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Кб, Версия: B, Файл опубликован: 1 июн 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
  • Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
    PDF, 43 Кб, Файл опубликован: 1 апр 1996
    Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren

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Классификация производителя

  • Semiconductors> Space & High Reliability> Logic Products> Flip-Flop/Latch/Registers

На английском языке: Datasheet Texas Instruments SN54HCT373

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