Datasheet Texas Instruments SN54LS06 — Даташит

Производитель	Texas Instruments
Серия	SN54LS06

Datasheets

Цены

Статус

Корпус / Упаковка / Маркировка

Параметры

Parameters / Models	5962-9861701Q2A	5962-9861701QCA	SN54LS06J	SNJ54LS06FK	SNJ54LS06J
Bits	6	6	6	6	6
Тип входа	TTL	TTL	TTL	TTL	TTL
Рабочий диапазон температур, C	от -55 до 125	от -55 до 125	от -55 до 125	от -55 до 125	от -55 до 125
Тип выхода	TTL	TTL	TTL	TTL	TTL
Package Group	LCCC	CDIP	CDIP	LCCC	CDIP
Package Size: mm2:W x L, PKG	20LCCC: 79 mm2: 8.89 x 8.89(LCCC)	See datasheet (CDIP)	See datasheet (CDIP)	20LCCC: 79 mm2: 8.89 x 8.89(LCCC)	See datasheet (CDIP)
Rating	Military	Military	Military	Military	Military
Schmitt Trigger	No	No	No	No	No
Technology Family	LS	LS	LS	LS	LS
VCC(Max), В	5.5	5.5	5.5	5.5	5.5
VCC(Min), В	4.5	4.5	4.5	4.5	4.5
Voltage(Nom), В	5	5	5	5	5

Экологический статус

Application Notes

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  The Texas Instruments (TI) SN54/74LS123 dual retriggerable monostable multivibrator is a one-shot device capable of verylong output pulses and up to 100% duty cycle. The ?LS123 also features dc triggering from gated low-level active A andhigh-level active B inputs and provides a clear input that terminates the output pulse of any predetermined time independentof timing components R ext and
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  PDF, 1.7 Мб, Файл опубликован: 1 окт 1996
  This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
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  TI IBIS File Creation Validation and Distribution Processes
  PDF, 380 Кб, Файл опубликован: 29 авг 2002
  The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
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  PDF, 150 Кб, Файл опубликован: 1 окт 1996
  Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
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  Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
  PDF, 614 Кб, Версия: C, Файл опубликован: 2 дек 2015
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  Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
  PDF, 337 Кб, Файл опубликован: 8 июл 2004
  Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
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  Designing With Logic (Rev. C)
  PDF, 186 Кб, Версия: C, Файл опубликован: 1 июн 1997
  Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
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  Introduction to Logic
  PDF, 93 Кб, Файл опубликован: 30 апр 2015

Модельный ряд

Классификация производителя

• Semiconductors> Space & High Reliability> Logic Products> Buffers/Drivers/Transceivers> Buffer Drivers